NCAB GROUP

Capability

The information below details some of the key capabilities that NCAB Group can offer and support today. You will find information here relating to the specific materials we can support, the PCB technologies or product types which we currently produce, as well as some of the tolerances which we can achieve.

The first category is what we call “standard” and means we can offer each individual parameters from multiple sources. The second is our “advanced” offering and this shows the very best that NCAB can offer, but here the supply chain or sourcing options is limited and in some cases this means that only one plant is capable of this parameter.

When using combinations of these parameters, you should always consult your local NCAB technical contact person.


CAPABILITY ROADMAP

Feature 2014
Standard Advanced
Materials RIGID:
FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance) including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC

FLEX:
PI, PET including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.

IMS:
IMS Al based including:
Bergquist MP, HT & CML, ITEQ T-Lam, Laird TLAM SS, Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.

Please contact NCAB Group for full details regarding material availability

RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2
Low – Loss material
N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20 (series), I-Speed
Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22 (series), RO4350B, RO3000 (series), RF-35, RF-35A2, TLX (series), AD250, FL-700LD

FLEX:
PI, LCP including: Dupont

IMS:
IMS Al & Cu based including:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi

Please contact NCAB Group for full details regarding material availability

Minimum dielectric thickness 0.075mm for PCB
0.025mm for FPC
≤0.05mm for PCB
0.015mm for FPC
Layer count 1 – 38L / 40L QTA 64L (pilot runs)
HDI / Buried – blind via Y Y
Copper filled BVH (Y/N) Y Y
Copper filled PTH (Y/N) N Y – copper paste
Copper paste filled PTH (Y/N) N Y
Capped via (Y/N) Y Y
LDI (Y/N) Y Y
Maximum board size (mm) 1000 x 580 1400 x 610
Minimum board thickness (mm)
2L
0.30 for PCB
0.05 for 1L FPC
0.12 for 2L FPC
0.20 for PCB
0.05 for 1L FPC
0.12 for 2L FPC
Minimum board thickness (mm)
≥4L
0.40 for PCB
0.20 for FPC
0.35 for PCB
0.16 for FCP
Maximum board thickness (mm)

7.0 10.0
Minimum track / gap IL (mil)- copper weight dependant 0.075mm 0.05mm
Minimum track / gap OL (mil)- copper weight dependant 0.075mm 0.05mm
Surface finish ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF
Layer to layer registration 0.10mm ≤ 0.075mm
Minimum hole (mech) (mm/mil) 0.20mm 0.15mm
Minimum hole (laser) (mm/mil) 0.10mm 0.06mm
Aspect ratio PTH 10:1 20:1
Aspect ration BVH 0.8:1 1.3:1 (factory + design dependant)
Finish hole tolerance (PTH) ± 0.10mm ± 0.05mm
Finish hole tolerance (NPTH) ± 0.05mm ≤ ± 0.05mm
Maximum Cu weight OL 6oz (UL approved)
10oz (non-UL approved)
10oz
Maximum Cu weight IL 6oz (UL approved)
10oz (non-UL approved)
10oz
Controlled impedance (+/- X%) Others ± 10% ± 5%

Rigid-flex (Y/N) Y Y including semi flex
Flexible (Y/N) Y Y
IMS (Y/N) Y (Al) Y (both Al and Cu)
Embedded components (Y/N) Y Y
Soldermask via plugging IPC4761 Type VI (Y/N)
Y Y
Epoxy via plugging IPC4761 Type VI (Y/N) Y Y
Epoxy via plugging IPC4761 Type VII (Y/N) Y Y
It is important to note that even with ‘standard’ technology this does not mean that all factories can achieve ALL of the aspects – When using combinations of these parameters, you should always consult your local NCAB technical contact person.

CAPACITY ROADMAP

Feature Capacity
2014
Capacity sqm per month 1 125 600
2 – 4 layers 451 140
6 layers and above 433 294
HDI / Buried – blind via 119 266
Flex, flex-rigid 121 900
Prototypes/QTA no orders 188 910
Number of employees (total) 26 861
Number of employees pre-production 1 607
Number of employees quality mgmt 2 691
Production facility sqm 803 200

 

EQUIPMENT LIST

Feature Factory Equipment (number of sets)
2014
CAM stations / seats 340
Plotters 69
Artwork AOI 26
Inner layer dry film lamination lines 56
Inner layer exposure machines 138
Inner layer automatic exposure machines 110
Inner layer LDI 15
Inner layer developing lines 69
AOI machines 297
Oxide lines 42
Bonding presses 142
X-Ray drilling machines 100
CNC drilling machines 1442
Laser drilling machines 85
De-smear and PTH lines 44
Panel plating lines 49
Vertical panel plating lines 40
Pattern plating lines 38
Outerlayer dry film lamination lines 69
Outerlayer UV exposure machines 74
Outerlayer automatic UV exposure machines 54
Outerlayer LDI 15
Outer layer developing lines 62
Outer layer AOI machines 129
Soldermask pre-treatment 50
Soldermask printing lines 330
Soldermask exposure machines 106
Soldermask automatic exposure machines 39
Soldermask developing lines 56
CNC routing machines 376
Bevelling machines 32
Scoring machines 58
Electrical test machines 368
Auto-segregation electrical test machines 85
Flying probe electrical test machines 148
Automated visual inspection systems 33