NCAB GROUP

Capability

The information below details some of the key capabilities that NCAB Group can offer and support today. You will find information here relating to the specific materials we can support, the PCB technologies or product types which we currently produce, as well as some of the tolerances which we can achieve.

The first category is what we call “standard” and means we can offer each individual parameters from multiple sources. The second is our “advanced” offering and this shows the very best that NCAB can offer, but here the supply chain or sourcing options is limited and in some cases this means that only one plant is capable of this parameter.

When using combinations of these parameters, you should always consult your local NCAB technical contact person.


CAPABILITY ROADMAP

Feature 2015
Standard Advanced
Materials RIGID:
FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance) including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC

FLEX:
PI, PET including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan, Hanwha

IMS:
IMS Al based including:
Bergquist MP, HT & CML, ITEQ T-Lam, Laird TLAM SS, Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.

Please contact NCAB Group for full details regarding material availability

RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2
Low – Loss material
N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20 (series), I-Speed
Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22 (series), RO4350B, RO3000 (series), RF-35, RF-35A2, TLX (series), AD250, FL-700LD

FLEX:
PI, LCP including: Dupont

IMS:
IMS Al & Cu based including:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi

Please contact NCAB Group for full details regarding material availability

Minimum dielectric thickness 0.005mm for PCB
0.025mm for FPC
≤0.025mm for PCB
0.012mm for FPC
Layer count 1 – 38L / 40L QTA 64L (pilot runs)
HDI / Buried – blind via Y Y
Copper filled BVH (Y/N) Y Y
Copper filled PTH (Y/N) Y Y – copper paste
Copper paste filled PTH (Y/N) Y Y
Capped via (Y/N) Y Y
LDI (Y/N) Y Y
Maximum board size (mm) 1050 x 610 1400 x 610
Minimum board thickness (mm)
2L
0.15 for PCB
0.05 for 1L FPC
0.12 for 2L FPC
0.15 for PCB
0.05 for 1L FPC
0.12 for 2L FPC
Minimum board thickness (mm)
≥4L
0.25 for PCB
0.20 for FPC
0.25 for PCB
0.16 for FCP
Maximum board thickness (mm)

8.0 10.0
Minimum track / gap IL (mil)- copper weight dependant 0.075mm 0.05mm
Minimum track / gap OL (mil)- copper weight dependant 0.075mm 0.05mm
Surface finish ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG + GF / Isn + GF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF / IAG + GF / Isn + GF
Layer to layer registration 0.10mm ≤ 0.075mm
Minimum hole (mech) (mm/mil) 0.20mm 0.15mm
Minimum hole (laser) (mm/mil) 0.10mm 0.06mm
Aspect ratio PTH 10:1 20:1
Aspect ration BVH 0.8:1 1.3:1 (factory + design dependant)
Finish hole tolerance (PTH) ± 0.10mm ± 0.05mm
Finish hole tolerance (NPTH) ± 0.05mm ≤ ± 0.05mm
Maximum Cu weight OL 6oz (UL approved)
10oz (non-UL approved)
10oz
Maximum Cu weight IL 6oz (UL approved)
10oz (non-UL approved)
10oz
Controlled impedance (+/- X%) Others ± 10% ± 5%

Rigid-flex (Y/N) Y Y including semi flex
Flexible (Y/N) Y Y
IMS (Y/N) Y (Al) Y (both Al and Cu)
Embedded components (Y/N) Y Y
Soldermask via plugging IPC4761 Type VI (Y/N)
Y Y
Epoxy via plugging IPC4761 Type VI (Y/N) Y Y
Epoxy via plugging IPC4761 Type VII (Y/N) Y Y
It is important to note that even with ‘standard’ technology this does not mean that all factories can achieve ALL of the aspects – When using combinations of these parameters, you should always consult your local NCAB technical contact person.

CAPACITY ROADMAP

Feature Capacity
2015
Capacity sqm per month 1 276 500
2 – 4 layers 466 025
6 layers and above 540 095
HDI / Buried – blind via 108 150
Flex, flex-rigid 23 900
Prototypes/QTA no orders 27 150
Number of employees (total) 35 330
Number of employees pre-production 2 187
Number of employees quality mgmt 3 297
Production facility sqm 916 400

 

EQUIPMENT LIST

Feature Factory Equipment (number of sets)
2015
CAM stations / seats 385
Plotters 73
Artwork AOI 35
Inner layer dry film lamination lines 61
Inner layer exposure machines 137
Inner layer automatic exposure machines 123
Inner layer LDI 17
Inner layer developing lines 66
AOI machines 272
Oxide lines 46
Bonding presses 141
X-Ray drilling machines 105
CNC drilling machines 1488
Laser drilling machines 83
De-smear and PTH lines 44
Panel plating lines 46
Vertical panel plating lines 42
Pattern plating lines 38
Outerlayer dry film lamination lines 66
Outerlayer UV exposure machines 82
Outerlayer automatic UV exposure machines 56
Outerlayer LDI 17
Outer layer developing lines 65
Outer layer AOI machines 138
Soldermask pre-treatment 52
Soldermask printing lines 347
Soldermask exposure machines 109
Soldermask automatic exposure machines 48
Soldermask developing lines 58
CNC routing machines 421
Bevelling machines 35
Scoring machines 63
Electrical test machines 367
Auto-segregation electrical test machines 83
Flying probe electrical test machines 161
Automated visual inspection systems 81