Capability
The information below details some of the key capabilities that NCAB Group can offer and support today. You will find information here relating to the specific materials we can support, the PCB technologies or product types which we currently produce, as well as some of the tolerances which we can achieve.
The first category is what we call “standard” and means we can offer each individual parameters from multiple sources. The second is our “advanced” offering and this shows the very best that NCAB can offer, but here the supply chain or sourcing options is limited and in some cases this means that only one plant is capable of this parameter.
When using combinations of these parameters, you should always consult your local NCAB technical contact person.
CAPABILITY ROADMAP
| Feature | 2011 | |
| Standard | Advanced | |
| Materials | Extensive ranges of ‘Standard’ FR4, Mid Tg FR4, High Tg FR4, Low CTE FR4, Low halogen FR4, High decomposition FR4 (ShengYi, Iteq, Kingboard, Elite Material, NanYa, Grace, Isola).IMS materials from Bergquist, Iteq, Laird & Totking.
Full range of flex materials (PI and PET) from Dupont, Panasonic, ShengYi, Taiflex. CEM-1, CEM-3, FR1, FR2, XPC Please contact NCAB for full details regarding specific brands and types. |
Isola:FR406/408, FR408HR(IS), IS410, HR370, Nelco:N4000-13 series, 4000, Panasonic: M4、M6 Rogers:RO4350、3210, RO4350+FR4 ITEQ:IT150DA,SY:7038, Panasonic (R1755C)/PTFE, teflon, Arlon, Taconic,3M, Omega, Dupont, |
| Minimum dielectric thickness | 0.012mm for FPC 0.076mm for PCB |
0.05mm for PCB |
| Layer count | 1 – 22L (30L FTR) | 40L |
| HDI / Buried – blind via | Y | Y |
| Copper filled BVH (Y/N) | Y | Y |
| Copper filled PTH (Y/N) | N | Y |
| Capped via (Y/N) | Y | Y |
| LDI (Y/N) | Y | Y |
| Maximum board size (mm) | 580×800 | 1400×600 |
| Minimum board thickness 2L (mm) |
0.05mm for single FPC 0.075mm for double-sided FPC 0.3mm for PCB |
0.05mm for FPC 0.075mm for double-sided FPC 0.225mm for PCB |
| Minimum board thickness >=4L (mm) |
0.16mm for FPC 0.3mm for PCB |
0.16mm for FPC 0.225mm for PCB |
| Maximum board thickness (mm) |
6 | 8 |
| Minimum track / gap IL (mil)- copper weight dependant | 3.5/3.5 mil | 3/3 mil |
| Minimum track / gap OL (mil)- copper weight dependant | 3.5/4 mil | 3/3 mil |
| Surface finish | ENIG/GF/OSP/IAg/ HASL (lead)/ HASL (Leadfree)/ Plating Au/Ni/ Immersion Tin/GF+OSP/ GF+HASL/OSP+ENIG |
ENIG / GF / OSP / IAg / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Tin / GF+OSP / GF+HASL / OSP+ENIG |
| Layer to layer registration | 4mil | 3mil |
| Minimum hole (mech) (mm/mil) | 0.20mm | 0.15mm |
| Minimum hole (laser) (mm/mil) | 0.10mm | 0.10mm |
| Aspect ratio PTH | 10:1 | 16.1 |
| Aspect ration BVH | 0.7:1 | 1.1:1 |
| Finish hole tolerance (PTH) | +/-3mil | +/-2mil |
| Finish hole tolerance (NPTH) | +/-2mil | +/-2mil |
| Maximum Cu weight OL | 4oz | 6oz |
| Maximum Cu weight IL | 6oz | 6oz |
| Controlled impedance (+/- X%) | +/-10% | +/-5% |
| Rigid-flex (Y/N) | Y | Y |
| Flexible (Y/N) | Y | Y |
| IMS (Y/N) | Y(AL) | Y(both AL and Cu) |
| Embedded components (Y/N) | N | Y |
| Soldermask via plugging IPC4761 Type VI (Y/N) |
Y | Y |
| Epoxy via plugging IPC4761 Type VI (Y/N) | Y | Y |
| Epoxy via plugging IPC4761 Type VII (Y/N) | Y | Y |
| It is important to note that even with ‘standard’ technology this does not mean that all factories can achieve ALL of the aspects – When using combinations of these parameters, you should always consult your local NCAB technical contact person. |
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CAPACITY ROADMAP
| Feature | Capacity |
| 2011 | |
| Capacity sqm per month | 819,300 |
| 2 – 4 layers | 50% |
| 6 layers and above | 35% |
| HDI / Buried – blind via | 10% |
| Flex, flex-rigid | 5% |
| Prototypes/QTA no orders | 132,000 |
| Number of employees (total) | 25,675 |
| Number of employees pre-production | 5,448 |
| Number of employees quality mgmt | 2,441 |
| Production facility sqm | 1,355,736 |
EQUIPMENT LIST
| Feature | Factory Equipment (number of sets) |
| 2011 | |
| CAM stations / seats | 216 |
| Plotters | 50 |
| Artwork AOI | 17 |
| Inner layer dry film lamination lines | 46 |
| Inner layer exposure machines | 90 |
| Inner layer automatic exposure machines | 76 |
| Inner layer LDI | 11 |
| Inner layer developing lines | 39 |
| AOI machines | 173 |
| Oxide lines | 35 |
| Bonding presses | 49 |
| X-Ray drilling machines | 38 |
| CNC drilling machines | 1271 |
| Laser drilling machines | 39 |
| De-smear and PTH lines | 32 |
| Panel plating lines | 18 |
| Vertical panel plating lines | 31 |
| Pattern plating lines | 28 |
| Outerlayer dry film lamination lines | 48 |
| Outerlayer UV exposure machines | 81 |
| Outerlayer automatic UV exposure machines | 46 |
| Outerlayer LDI | 9 |
| Outer layer developing lines | 33 |
| Outer layer AOI machines | 73 |
| Soldermask pre-treatment | 35 |
| Soldermask printing lines | 261 |
| Soldermask exposure machines | 70 |
| Soldermask automatic exposure machines | 43 |
| Soldermask developing lines | 38 |
| CNC routing machines | 267 |
| Bevelling machines | 27 |
| Scoring machines | 50 |
| Electrical test machines | 350 |
| Auto-segregation electrical test machines | 25 |
| Flying probe electrical test machines | 152 |
| Automated visual inspection systems | 8 |
