NCAB GROUP

Capability

The information below details some of the key capabilities that NCAB Group can offer and support today. You will find information here relating to the specific materials we can support, the PCB technologies or product types which we currently produce, as well as some of the tolerances which we can achieve.

The first category is what we call “standard” and means we can offer each individual parameters from multiple sources. The second is our “advanced” offering and this shows the very best that NCAB can offer, but here the supply chain or sourcing options is limited and in some cases this means that only one plant is capable of this parameter.

When using combinations of these parameters, you should always consult your local NCAB technical contact person.


CAPABILITY ROADMAP

Feature 2016
Standard Advanced
Materials RIGID:
FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance) including:
ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC

FLEX:
PI, PET including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan, Hanwha, SF305

IMS:
IMS Al based including:
Bergquist MP, HT & CML, ITEQ T-Lam, Laird TLAM SS, Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.

Please contact NCAB Group for full details regarding material availability

RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2
Low – Loss material
N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed
Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD

FLEX:
PI, LCP including: Dupont

IMS:
IMS Al & Cu based including:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi

Please contact NCAB Group for full details regarding material availability

Minimum dielectric thickness 0.05mm for PCB
0.025mm for FPC
0.025mm for PCB
0.012mm for FPC
Layer count 1 – 38L / 40L QTA 64L (pilot runs)
HDI / Buried – blind via Y Y
Copper filled BVH (Y/N) Y Y
Copper filled PTH (Y/N) Y Y – copper paste
Copper paste filled PTH (Y/N) Y Y
Capped via (Y/N) Y Y
LDI (Y/N) Y Y
Maximum board size (mm) 1050 x 610 1400 x 610
Minimum board thickness (mm)
2L
0.15 for PCB
0.05 for 1L FPC
0.12 for 2L FPC
0.15 for PCB
0.05 for 1L FPC
0.12 for 2L FPC
Minimum board thickness (mm)
≥4L
0.25 for PCB
0.20 for FPC
0.25 for PCB
0.16 for FCP
Maximum board thickness (mm)

8.0 10.0
Minimum track / gap IL (mil)- copper weight dependant 0.075mm 0.05mm
Minimum track / gap OL (mil)- copper weight dependant 0.075mm 0.05mm
Surface finish ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG+GF / Isn+GF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF
Layer to layer registration 0.10mm ≤ 0.075mm
Minimum hole (mech) (mm/mil) 0.20mm 0.15mm
Minimum hole (laser) (mm/mil) 0.10mm 0.06mm
Aspect ratio PTH 13:1 20:1
Aspect ration BVH 0.8:1 1.3:1 (factory + design dependant)
Finish hole tolerance (PTH) ± 0.10mm ± 0.05mm
Finish hole tolerance (NPTH) ± 0.05mm ≤ ± 0.05mm
Maximum Cu weight OL 6oz (UL approved)
10oz (non-UL approved)
10oz
Maximum Cu weight IL 6oz (UL approved)
10oz (non-UL approved)
12oz
Controlled impedance (+/- X%) Others ± 10% ± 5%

Rigid-flex (Y/N) Y Y including semi flex
Flexible (Y/N) Y Y
IMS (Y/N) Y (Al) Y (both Al and Cu)
Embedded components (Y/N) Y Y
Soldermask via plugging IPC4761 Type VI (Y/N)
Y Y
Epoxy via plugging IPC4761 Type VI (Y/N) Y Y
Epoxy via plugging IPC4761 Type VII (Y/N) Y Y
It is important to note that even with ‘standard’ technology this does not mean that all factories can achieve ALL of the aspects – When using combinations of these parameters, you should always consult your local NCAB technical contact person.

CAPACITY ROADMAP

Feature Capacity
2016
Capacity sqm per month 2 162 450
2 – 4 layers 289 326
6 layers and above 412 482
HDI / Buried – blind via 133 036
Flex, flex-rigid 14 100
Prototypes/QTA no orders 27 260
Number of employees (total) 33 856
Number of employees pre-production 2 223
Number of employees quality mgmt 4 824
Production facility sqm 1 188 900

 

EQUIPMENT LIST

Feature Factory Equipment (number of sets)
2016
CAM stations / seats 406
Plotters 93
Artwork AOI 25
Inner layer dry film lamination lines 64
Inner layer exposure machines 117
Inner layer automatic exposure machines 110
Inner layer LDI 15
Inner layer developing lines 66
AOI machines 219
Oxide lines 44
Bonding presses 82
X-Ray drilling machines 102
CNC drilling machines 1572
Laser drilling machines 78
De-smear and PTH lines 46
Panel plating lines 43
Vertical panel plating lines 43
Pattern plating lines 36
Outerlayer dry film lamination lines 61
Outerlayer UV exposure machines 73
Outerlayer automatic UV exposure machines 49
Outerlayer LDI 13
Outer layer developing lines 60
Outer layer AOI machines 123
Soldermask pre-treatment 48
Soldermask printing lines 358
Soldermask exposure machines 107
Soldermask automatic exposure machines 47
Soldermask developing lines 56
CNC routing machines 468
Bevelling machines 37
Scoring machines 70
Electrical test machines 306
Auto-segregation electrical test machines 90
Flying probe electrical test machines 144
Automated visual inspection systems 62