Feuille de route technologique
La roadmap technique de NCAB illustre le développement attendu de notre offre de produit et les compétences technologiques sur une période de 2 ans. Une bonne compréhension des développements futurs est essentielle pour nos activités d’approvisionnement car elle permet de définir aujourd’hui les stratégies de demain. Ce n’est qu’en ayant un bon aperçu de ces attentes que NCAB peut planifier à l’avance avec ses usines.
Cela couvre des éléments tels que les listes des équipements et les plans de capacité nécessaires pour réussir sur un marché évoluant rapidement.
CAPABILITY ROADMAP
| Feature | 2013 | 2014 | 2015 | |
| Standard | Advanced | |||
| Materials | GW(Gw4010, Gw4011), ITEQ(IT140, IT158, IT180, IT180A, IT150DA,IT-140TC, IT-158TC, IT-180TC, IT-140GTC) EM(EM-825, EM-827, EM-320, EM-285), KB(KB6160, KB6165), Mica-Ava EG150T, IS410,RO(R04350, R04003) ShengYi (S1141, S1130, S1155, S1165, S1170, S1000-2, S1000, S1600), PI: FR9120, PET: LPET2ED18/S-FR-610,CEM-3, NY: NY1140, NP2170, NP-140TL, NPG-TL/NPG-B Isola FR406/408 /370 HR / IS410 Grace GA-HF-14 Arlon 25FR TU872SLK Megtron4, 6 CEM-3 S2600 Please contact NCAB for full details regarding specific brands and types. |
Nelco:N4000-13 series Rogers:RO4350、RO4350+FR4 Panasonic (R1755C, R1755M) / PTFE, teflon, ceramic wafer Taconic ,3M C-Ply, Omega, Dupont, Rogers:3210, 3003, 3006, 4350B RTG002,RTG5880 Matsushita-R0880 Hybrid builds Bergquist – MP / HT / CM series Laird – TLAM SS series ITEQ T-Lam 1KA Totking ZT QB-Al |
Advanced materials becoming more mainstream and continued development of HF / low loss across more factories. | Advanced materials becoming more mainstream and continued development of HF / low loss across more factories. |
| Minimum dielectric thickness | 0.01mm for FPC 0.05mm for PCB |
0.05mm for PCB | 0.05mm for PCB | 0.04mm for PCB |
| Layer count | 1 – 36L (40L FTR) | 58L | 60L | 60L |
| HDI / Buried – blind via | Y | Y | Y | Y |
| Copper filled BVH (Y/N) | Y | Y | Y | Y |
| Copper filled PTH (Y/N) | Y | Y | Y | Y |
| Capped via (Y/N) | Y | Y | Y | Y |
| LDI (Y/N) | Y | Y | Y | Y |
| Maximum board size (mm) | 584×899 | 1400×600 | 1400×600 | 1400×600 |
| Minimum board thickness 2L (mm) |
0.05mm for single FPC 0.075mm for double-sided FPC 0.3mm for PCB |
0.05mm for FPC 0.075mm for double-sided FPC 0.2mm for PCB |
0.05mm for FPC 0.075mm for double-sided FPC 0.17mm for PCB |
0.05mm for FPC 0.075mm for double-sided FPC 0.17mm for PCB |
| Minimum board thickness >=4L (mm) |
0.16mm for FPC 0.4mm for PCB |
0.16mm for FPC 0.25mm for PCB |
0.16mm for FPC 0.20mm for PCB |
0.16mm for FPC 0.20mm for PCB |
| Maximum board thickness (mm) |
6 | 10 | 10 | 10 |
| Minimum track / gap IL (mil)- copper weight dependant | 3.5/3.5 mil | 2.0/2.0 mil | 2.0/2.0 mil | 2.0/2.0 mil |
| Minimum track / gap OL (mil)- copper weight dependant | 3.0/3.5 mil | 2.0/2.0 mil | 2.0/2.0 mil | 2.0/2.0mil |
| Surface finish | ENIG / GF / OSP / Iag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Tin / GF+OSP / GF+HASL / OSP+ENIG | ENIG / GF / OSP / Iag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Tin / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG | ENIG / GF / OSP / Iag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Tin / GF+OSP / GF+HASL / OSP+ENIG/ ENEPIG | ENIG / GF / OSP / Iag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Tin / GF+OSP / GF+HASL / OSP+ENIG/ ENEPIG |
| Layer to layer registration | 4mil | 3mil | <3mil | 2mil |
| Minimum hole (mech) (mm/mil) | 0.20mm | 0.15mm | 0.15mm | 0.15mm |
| Minimum hole (laser) (mm/mil) | 0.10mm | 0.075mm | 0.075mm | 0.05mm |
| Aspect ratio PTH | 10:1 | 20:1 | 22:1 | 25:1 |
| Aspect ration BVH | 0.7:1 | 1.1:1 | 1.2:1 | 1.5:1 |
| Finish hole tolerance (PTH) | +/-3mil | +/-2mil | +/-2mil | +/-2mil |
| Finish hole tolerance (NPTH) | +/-2mil | ±1mil≤X＜±2mil | ±1mil≤X＜±2mil | ±1mil≤X＜±2mil |
| Maximum Cu weight OL | 6oz(UL approved) /10oz(non-UL approved) |
10oz | 10oz | 10oz |
| Maximum Cu weight IL | 6oz(UL approved) /10oz(non-UL approved) |
10oz | 10oz | 10oz |
| Controlled impedance (+/- X%) | ±5%(<50Ω) Others +/-10% |
+/-5% | +/-5% | +/-5% |
| Rigid-flex (Y/N) | Y | Y | Y | Y |
| Flexible (Y/N) | Y | Y | Y | Y |
| IMS (Y/N) | Y (both AL and Cu) | Y (both AL and Cu) | Y (AL, Cu and Fe) | Y (AL, Cu and Fe) |
| Embedded components (Y/N) | Y | Y | Y | Y |
| Soldermask via plugging IPC4761 Type VI (Y/N) |
Y | Y | Y | Y |
| Epoxy via plugging IPC4761 Type VI (Y/N) | Y | Y | Y | Y |
| Epoxy via plugging IPC4761 Type VII (Y/N) | Y | Y | Y | Y |
| It is important to note that even with ‘standard’ technology this does not mean that all factories can achieve ALL of the aspects – When using combinations of these parameters, you should always consult your local NCAB technical contact person. |
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CAPACITY ROADMAP
| Feature | Capacity | ||
| 2012 | 2013 | 2014 | |
| Capacity sqm per month | 966 000 | 1 134 000 | 1 246 700 |
| 2 – 4 layers | 56% | 51% | 46% |
| 6 layers and above | 30% | 33% | 34% |
| HDI / Buried – blind via | 8% | 10% | 12% |
| Flex, flex-rigid | 6% | 7% | 8% |
| Prototypes/QTA no orders per month | 11 320 | 12 510 | 15 486,5 |
| Number of employees (total) | 26 822 | 29 560 | 32 227 |
| Number of employees pre-production | 3336 | 3665 | 4073 |
| Number of employees quality mgmt | 2426 | 2785 | 3070 |
| Production facility sqm | 518 000 | 687 000 | 728 000 |
EQUIPMENT LIST
| Feature | Factory Equipment (number of sets) | ||
| 2011 | 2012 | 2013 | |
| CAM stations / seats | 363 | 399 | 403 |
| Plotters | 61 | 63 | 63 |
| Artwork AOI | 19 | 20 | 20 |
| Inner layer dry film lamination lines | 40 | 41 | 43 |
| Inner layer exposure machines | 108 | 112 | 112 |
| Inner layer automatic exposure machines | 56 | 57 | 58 |
| Inner layer LDI | 8 | 8 | 9 |
| Inner layer developing lines | 28 | 28 | 29 |
| AOI machines | 119 | 119 | 119 |
| Oxide lines | 22 | 22 | 23 |
| Bonding presses | 85 | 86 | 87 |
| X-Ray drilling machines | 21 | 21 | 22 |
| CNC drilling machines | 1174 | 1174 | 1176 |
| Laser drilling machines | 3 | 3 | 4 |
| De-smear and PTH lines | 22 | 22 | 23 |
| Panel plating lines | 20 | 20 | 21 |
| Vertical panel plating lines | 12 | 12 | 13 |
| Pattern plating lines | 22 | 22 | 23 |
| Outerlayer dry film lamination lines | 44 | 45 | 45 |
| Outerlayer UV exposure machines | 91 | 91 | 92 |
| Outerlayer automatic UV exposure machines | 43 | 44 | 44 |
| Outerlayer LDI | 7 | 7 | 7 |
| Outer layer developing lines | 22 | 22 | 23 |
| Outer layer AOI machines | 54 | 54 | 54 |
| Soldermask pre-treatment | 36 | 36 | 36 |
| Soldermask printing lines | 197 | 201 | 201 |
| Soldermask exposure machines | 68 | 68 | 69 |
| Soldermask automatic exposure machines | 12 | 13 | 13 |
| Soldermask developing lines | 29 | 29 | 30 |
| CNC routing machines | 241 | 242 | 244 |
| Bevelling machines | 25 | 26 | 26 |
| Scoring machines | 53 | 53 | 54 |
| Electrical test machines | 358 | 362 | 363 |
| Auto-segregation electrical test machines | 30 | 30 | 30 |
| Flying probe electrical test machines | 87 | 88 | 89 |
| Automated visual inspection systems | 5 | 5 | 5 |
