NCAB Group seminars
For more information and to book a seminar please contact your local NCAB Group Key Account Manager or Customer Support.
The seminars we are running at the moment are:
Technical trends in the global PCB industry
A presentation of the technical challenges, expectations and trends going forward, and the driving forces behind technical developments.
How to produce a Printed Circuit Boards
An in-depth description on how to produce a standard PCB.
A presentation of Embedded components. 3D”MID – 3 dimensional moulded interconnect devices.
Cost drivers in PCB production
We show what is generating the “cost” of the PCB. How designers can influence the cost? How to save money with maintained reliability!
The pros and cons of the most common surface finishes. The seminar also covers handling and storage rules.
HDI – High Density Interconnect
What defines a HDI board, standards, design rules, driving forces for HDI. How do I get started with HDI?
IMS – Insulated Metal Substrate
Thermal management, how to calculate and design IMS boards. What alternatives are there to IMS boards?
Instructions on how to design a correct build-up for maximum performance. What design rules are applicable? How can reliability be secured?
NCAB Group PCB Specification
NCAB explains why we have developed our own detailed specification and demands that we believe will help to improve both the quality and reliability of the PCB’s that we provide.
Impedance controlled boards
What is impedance? Different types of impedance controlled tracks. How does the tolerances affect the impedance?
DFM – Design For Manufacturing
This seminar describes how to avoid costly production, problems with Gerber packages and why NCAB asks you so many technical questions!
IPC vs. Perfag
What do the different standards mean in reality? How do I use them? What is the difference between IPC and Perfag?
Reliability, IPC & NCAB
We examine in depth how to secure reliability at the lowest possible cost.
IPC class 3 – how to specify the boards?
Verification at product level vs. verification of process control. Presentation of the NCAB Group solution.
Material for lead-free production
We present our experiences of lead free production and identify the risks.
What do abbreviations like Td, Tg, CTE, CTI all mean? What is important for me as a designer? How to choose and specify the material.
We present and discuss risks associated with delaminating, laser marking, lead-free soldering, an unsuitable surface finish, a non adequat PCB specification etc.
NCAB Group Laboratory
What can be carried out in our Laboratory?
How do we carry out continuous technical improvements.