NCAB GROUP

Technical Roadmap

The technical roadmap for NCAB shows the expected development of our product offering and technological capability over a 2-year period. A proper grasp of future developments is critical to our sourcing activities as it helps to define tomorrow’s strategies, today. Only through building a proper picture of these expectations can NCAB plan ahead with our factories.

This covers such elements as equipment lists and capacity plans necessary to succeed in a fast moving market.


CAPABILITY ROADMAP

Feature 2014 2015 2016
Standard Advanced
Materials RIGID:
FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance) including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC

FLEX:
PI, PET including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.

IMS:
IMS Al based including:
Bergquist MP, HT & CML, ITEQ T-Lam, Laird TLAM SS, Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.

Please contact NCAB Group for full details regarding material availability.

RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2
Low – Loss material
N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20 (series), I-Speed
Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22 (series), RO4350B, RO3000 (series), RF-35, RF-35A2, TLX (series), AD250, FL-700LD

FLEX:
PI, LCP including: Dupont

IMS:
IMS Al & Cu based including:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi

Please contact NCAB Group for full details regarding material availability.

‘Advanced’ materials becoming more mainstream across the supply base. ‘Advanced’ materials becoming more mainstream across the supply base.
Minimum dielectric thickness 0.075mm for PCB
0.025mm for FPC
≤0.05mm for PCB
0.015mm for FPC
≤0.05mm for PCB
0.012mm for FPC
≤0.05mm for PCB
0.01mm for FPC
Layer count 1 – 38L / 40L QTA 64L (pilot runs) 60L 60L
HDI / Buried – blind via Y Y Y Y
Copper filled BVH (Y/N) Y Y Y Y
Copper filled PTH (Y/N) N Y – copper paste Y Y
Copper paste filled PTH (Y/N) N Y Y Y
Capped via (Y/N) Y Y Y Y
LDI (Y/N) Y Y Y Y
Maximum board size (mm) 1000 x 580 1400 X 610 1400 X 610 1400 X 610
Minimum board thickness
2L (mm)
0.30mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.20mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
≤0.20mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
≤0.20mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
Minimum board thickness
>=4L (mm)
0.40mm for PCB
0.20 for FPC
0.35mm for PCB
0.16 for FPC
≤0.30mm for PCB
0.16 for FPC
0.20mm for PCB
0.16 for FPC
Maximum board thickness (mm)

7.0 10.0 10.0 10.0
Minimum track / gap IL (mil)- copper weight dependant 0.075mm 0.05mm 0.05mm 0.05mm
Minimum track / gap OL (mil)- copper weight dependant 0.075mm 0.05mm 0.05mm 0.05mm
Surface finish ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF
Layer to layer registration 0.10mm ≤ 0.075mm ≤ 0.075mm ≤ 0.075mm
Minimum hole (mech) (mm/mil) 0.20mm 0.15mm 0.15mm 0.15mm
Minimum hole (laser) (mm/mil) 0.10mm 0.06mm 0.075mm (std) 0.075mm (std)
Aspect ratio PTH 10:1 20:1 20:1 20:1
Aspect ration BVH 0.8:1 1.3:1 (factory + design dependant) 1.3:1 ≥1.3:1
Finish hole tolerance (PTH) ± 0.10mm ± 0.05mm ± 0.05mm ± 0.05mm
Finish hole tolerance (NPTH) ± 0.05mm ≤ ± 0.05mm ≤ ± 0.05mm ≤ ± 0.05mm
Maximum Cu weight OL 6oz (UL approved)
10oz (non-UL approved)
10oz 10oz ≥ 10 oz
Maximum Cu weight IL 6oz (UL approved)
10oz (non-UL approved)
10oz 10oz ≥ 10 oz
Controlled impedance (+/- X%) Others ± 10% ± 5% ± 5% ± 5%
Rigid-flex (Y/N) Y Y including semi flex Y Y
Flexible (Y/N) Y Y Y Y
IMS (Y/N) Y (Al) Y (both Al and Cu) Y Y
Embedded components (Y/N) Y Y Y Y
Soldermask via plugging IPC4761 Type VI (Y/N)
Y Y Y Y
Epoxy via plugging IPC4761 Type VI (Y/N) Y Y Y Y
Epoxy via plugging IPC4761 Type VII (Y/N) Y Y Y Y
It is important to note that even with ‘standard’ technology this does not mean that all factories can achieve ALL of the aspects – When using combinations of these parameters, you should always consult your local NCAB technical contact person.

CAPACITY ROADMAP

Feature Capacity
2014 2015 2016
Capacity sqm per month 1 125 600 1 193 600 1 330 600
2 – 4 layers 451 140 421 060 406 900
6 layers and above 433 294 514 174 618 934
HDI / Buried – blind via 119 266 134 366 157 366
Flex, flex-rigid 121 900 124 000 147 400
Prototypes/QTA no orders 188 910 195 270 207 210
Number of employees (total) 26 861 33 080 30 310
Number of employees pre-production 1 607 2 112 1 884
Number of employees quality mgmt 2 691 2 880 3 070
Production facility sqm 803 200 918 200 943 200

 

EQUIPMENT LIST

Feature Factory Equipment (number of sets)
2014 2015 2016
CAM stations / seats 340 362 384
Plotters 69 71 72
Artwork AOI 26 28 30
Inner layer dry film lamination lines 56 58 60
Inner layer exposure machines 138 144 149
Inner layer automatic exposure machines 110 115 122
Inner layer LDI 15 15 16
Inner layer developing lines 69 72 76
AOI machines 297 309 322
Oxide lines 42 45 48
Bonding presses 142 147 153
X-Ray drilling machines 100 104 109
CNC drilling machines 1442 1453 1469
Laser drilling machines 85 90 94
De-smear and PTH lines 44 48 51
Panel plating lines 49 52 54
Vertical panel plating lines 40 43 45
Pattern plating lines 38 40 42
Outerlayer dry film lamination lines 69 75 80
Outerlayer UV exposure machines 74 79 83
Outerlayer automatic UV exposure machines 54 57 62
Outerlayer LDI 15 15 16
Outer layer developing lines 62 65 67
Outer layer AOI machines 129 136 144
Soldermask pre-treatment 50 52 55
Soldermask printing lines 330 345 364
Soldermask exposure machines 106 110 117
Soldermask automatic exposure machines 39 42 46
Soldermask developing lines 56 59 61
CNC routing machines 376 398 420
Bevelling machines 32 32 33
Scoring machines 58 61 66
Electrical test machines 368 380 400
Auto-segregation electrical test machines 85 91 104
Flying probe electrical test machines 148 154 163
Automated visual inspection systems 33 39 47