NCAB GROUP

Technical Roadmap

The technical roadmap for NCAB shows the expected development of our product offering and technological capability over a 2-year period. A proper grasp of future developments is critical to our sourcing activities as it helps to define tomorrow’s strategies, today. Only through building a proper picture of these expectations can NCAB plan ahead with our factories.

This covers such elements as equipment lists and capacity plans necessary to succeed in a fast moving market.


CAPABILITY ROADMAP

Feature 2015 2016 2017
Standard Advanced
Materials RIGID:
FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance) including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC

FLEX:
PI, PET including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan, Hanwha.

IMS:
IMS Al based including:
Bergquist MP, HT & CML, ITEQ T-Lam, Laird TLAM SS, Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.

Please contact NCAB Group for full details regarding material availability.

RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2
Low – Loss material
N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20 (series), I-Speed
Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22 (series), RO4350B, RO3000 (series), RF-35, RF-35A2, TLX (series), AD250, FL-700LD

FLEX:
PI, LCP including: Dupont

IMS:
IMS Al & Cu based including:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi

Please contact NCAB Group for full details regarding material availability.

‘Advanced’ materials becoming more mainstream across the supply base. ‘Advanced’ materials becoming more mainstream across the supply base.
Minimum dielectric thickness 0.05mm for PCB
0.025mm for FPC
0.025mm for PCB
0.012mm for FPC
≤0.05mm for PCB
0.01mm for FPC
≤0.05mm for PCB
0.01mm for FPC
Layer count 1 – 38L / 40L QTA 64L (pilot runs) 60L 60L
HDI / Buried – blind via Y Y Y Y
Copper filled BVH (Y/N) Y Y Y Y
Copper filled PTH (Y/N) Y Y – copper paste Y Y
Copper paste filled PTH (Y/N) Y Y Y Y
Capped via (Y/N) Y Y Y Y
LDI (Y/N) Y Y Y Y
Maximum board size (mm) 1050 x 610 1400 X 610 1400 X 610 1400 X 610
Minimum board thickness
2L (mm)
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
Minimum board thickness
>=4L (mm)
0.25mm for PCB
0.20 for FPC
0.25mm for PCB
0.16 for FPC
0.20mm for PCB
0.16 for FPC
0.20mm for PCB
0.16 for FPC
Maximum board thickness (mm)

8.0 10.0 10.0 10.0
Minimum track / gap IL (mil)- copper weight dependant 0.075mm 0.05mm 0.05mm 0.05mm
Minimum track / gap OL (mil)- copper weight dependant 0.075mm 0.05mm 0.05mm 0.05mm
Surface finish ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG + GF / Isn + GF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF / IAG + GF / Isn + GF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF / IAG + GF / Isn + GF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF / IAG + GF / Isn + GF
Layer to layer registration 0.10mm ≤ 0.075mm ≤ 0.075mm ≤ 0.075mm
Minimum hole (mech) (mm/mil) 0.20mm 0.15mm 0.15mm 0.15mm
Minimum hole (laser) (mm/mil) 0.10mm 0.06mm 0.075mm (std) 0.075mm (std)
Aspect ratio PTH 10:1 20:1 20:1 20:1
Aspect ration BVH 0.8:1 1.3:1 (factory + design dependant) 1.3:1 ≥1.3:1
Finish hole tolerance (PTH) ± 0.10mm ± 0.05mm ± 0.05mm ± 0.05mm
Finish hole tolerance (NPTH) ± 0.05mm ≤ ± 0.05mm ≤ ± 0.05mm ≤ ± 0.05mm
Maximum Cu weight OL 6oz (UL approved)
10oz (non-UL approved)
10 oz ≥ 10 oz ≥ 10 oz
Maximum Cu weight IL 6oz (UL approved)
10oz (non-UL approved)
10 oz ≥ 10 oz ≥ 10 oz
Controlled impedance (+/- X%) Others ± 10% ± 5% ± 5% ± 5%
Rigid-flex (Y/N) Y Y including semi flex Y including semi flex Y including semi flex
Flexible (Y/N) Y Y Y Y
IMS (Y/N) Y (Al) Y (both Al and Cu) Y Y
Embedded components (Y/N) Y Y Y Y
Soldermask via plugging IPC4761 Type VI (Y/N)
Y Y Y Y
Epoxy via plugging IPC4761 Type VI (Y/N) Y Y Y Y
Epoxy via plugging IPC4761 Type VII (Y/N) Y Y Y Y
It is important to note that even with ‘standard’ technology this does not mean that all factories can achieve ALL of the aspects – When using combinations of these parameters, you should always consult your local NCAB technical contact person.

CAPACITY ROADMAP

Feature Capacity
2015 2016 2017
Capacity sqm per month 1 276 500 1 522 450 1 273 000
2 – 4 layers 466 025 481 225 503 025
6 layers and above 540 096 613 593 519 475
HDI / Buried – blind via 108 150 152 280 71 300
Flex, flex-rigid 23 900 126 600 40 300
Prototypes/QTA no orders 27 150 32 010 34 000
Number of employees (total) 35 330 36 855 28 660
Number of employees pre-production 2 187 2 435 1 645
Number of employees quality mgmt 3 297 3 672 2 627
Production facility sqm 916 400 1 101 900 755 400

 

EQUIPMENT LIST

Feature Factory Equipment (number of sets)
2015 2016 2017
CAM stations / seats 385 379 393
Plotters 73 68 68
Artwork AOI 35 32 31
Inner layer dry film lamination lines 61 65 65
Inner layer exposure machines 137 130 126
Inner layer automatic exposure machines 123 119 122
Inner layer LDI 17 17 18
Inner layer developing lines 66 66 70
AOI machines 272 264 268
Oxide lines 46 44 45
Bonding presses 141 143 153
X-Ray drilling machines 105 99 100
CNC drilling machines 1488 1396 1456
Laser drilling machines 83 79 81
De-smear and PTH lines 44 42 41
Panel plating lines 46 46 45
Vertical panel plating lines 42 37 38
Pattern plating lines 38 37 38
Outerlayer dry film lamination lines 66 64 65
Outerlayer UV exposure machines 82 75 73
Outerlayer automatic UV exposure machines 56 54 55
Outerlayer LDI 17 16 17
Outer layer developing lines 65 64 65
Outer layer AOI machines 138 131 133
Soldermask pre-treatment 52 50 50
Soldermask printing lines 347 329 328
Soldermask exposure machines 109 101 99
Soldermask automatic exposure machines 48 49 52
Soldermask developing lines 58 58 58
CNC routing machines 421 367 396
Bevelling machines 35 33 33
Scoring machines 63 58 58
Electrical test machines 367 349 356
Auto-segregation electrical test machines 83 69 77
Flying probe electrical test machines 161 165 170
Automated visual inspection systems 81 82 88