NCAB GROUP

Technical Roadmap

The technical roadmap for NCAB shows the expected development of our product offering and technological capability over a 2-year period. A proper grasp of future developments is critical to our sourcing activities as it helps to define tomorrow’s strategies, today. Only through building a proper picture of these expectations can NCAB plan ahead with our factories.

This covers such elements as equipment lists and capacity plans necessary to succeed in a fast moving market.


CAPABILITY ROADMAP

Feature 2016 2017 2018
Standard Advanced
Materials RIGID:
FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance) including:
ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC

FLEX:
PI, PET including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan, Hanwha,SF305

IMS:
IMS Al based including:
Bergquist MP, HT & CML, ITEQ T-Lam, Laird TLAM SS, Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan

Please contact NCAB Group for full details regarding material availability.

RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2
Low – Loss material
N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed
Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD

FLEX:
PI, LCP including: Dupont

IMS:
IMS Al & Cu based including:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi

Please contact NCAB Group for full details regarding material availability.

‘Advanced’ materials becoming more mainstream across the supply base. ‘Advanced’ materials becoming more mainstream across the supply base.
Minimum dielectric thickness 0.05mm for PCB
0.025mm for FPC
0.025mm for PCB
0.012mm for FPC
≤0.05mm for PCB
0.01mm for FPC
≤0.05mm for PCB
0.01mm for FPC
Layer count 1 – 38L / 40L QTA 64L (pilot runs) 60L 60L
HDI / Buried – blind via Y Y Y Y
Copper filled BVH (Y/N) Y Y Y Y
Copper filled PTH (Y/N) Y Y – copper paste Y Y
Copper paste filled PTH (Y/N) Y Y Y Y
Capped via (Y/N) Y Y Y Y
LDI (Y/N) Y Y Y Y
Maximum board size (mm) 1050 x 610 1400 X 610 1400 X 610 1400 X 610
Minimum board thickness
2L (mm)
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
Minimum board thickness
>=4L (mm)
0.25mm for PCB
0.20 for FPC
0.25mm for PCB
0.16 for FPC
0.20mm for PCB
0.16 for FPC
0.20mm for PCB
0.16 for FPC
Maximum board thickness (mm)

8.0 10.0 10.0 10.0
Minimum track / gap IL (mil)- copper weight dependant 0.075mm 0.05mm 0.05mm 0.05mm
Minimum track / gap OL (mil)- copper weight dependant 0.075mm 0.05mm 0.05mm 0.05mm
Surface finish ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG+GF / Isn+GF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF / IAG+GF / Isn+GF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF
Layer to layer registration 0.10mm ≤ 0.075mm ≤ 0.075mm ≤ 0.075mm
Minimum hole (mech) (mm/mil) 0.20mm 0.15mm 0.15mm 0.15mm
Minimum hole (laser) (mm/mil) 0.10mm 0.06mm 0.075mm (std) 0.075mm (std)
Aspect ratio PTH 13:1 20:1 20:1 20:1
Aspect ration BVH 0.8:1 1.3:1 (factory + design dependant) 1.3:1 ≥1.3:1
Finish hole tolerance (PTH) ± 0.10mm ± 0.05mm ± 0.05mm ± 0.05mm
Finish hole tolerance (NPTH) ± 0.05mm ≤ ± 0.05mm ≤ ± 0.05mm ≤ ± 0.05mm
Maximum Cu weight OL 6oz (UL approved)
10oz (non-UL approved)
10 oz ≥ 10 oz ≥ 10 oz
Maximum Cu weight IL 6oz (UL approved)
10oz (non-UL approved)
12 oz ≥ 10 oz ≥ 10 oz
Controlled impedance (+/- X%) Others ± 10% ± 5% ± 5% ± 5%
Rigid-flex (Y/N) Y Y including semi flex Y including semi flex Y including semi flex
Flexible (Y/N) Y Y Y Y
IMS (Y/N) Y (Al) Y (both Al and Cu) Y Y
Embedded components (Y/N) Y Y Y Y
Soldermask via plugging IPC4761 Type VI (Y/N)
Y Y Y Y
Epoxy via plugging IPC4761 Type VI (Y/N) Y Y Y Y
Epoxy via plugging IPC4761 Type VII (Y/N) Y Y Y Y
It is important to note that even with ‘standard’ technology this does not mean that all factories can achieve ALL of the aspects – When using combinations of these parameters, you should always consult your local NCAB technical contact person.

CAPACITY ROADMAP

Feature Capacity
2016 2017 2018
Capacity sqm per month 2 162 450 2 326 460 2 400 808
2 – 4 layers 289 326 315 518 328 753
6 layers and above 412 482 535 955 623 006
HDI / Buried – blind via 133 036 168 202 186 141
Flex, flex-rigid 14 100 27 300 32 300
Prototypes/QTA no orders 27 260 35 058 36 908
Number of employees (total) 33 856 35 621 36 908
Number of employees pre-production 2 223 2 306 2 451
Number of employees quality mgmt 4 824 5 166 5 439
Production facility sqm 1 188 900 1 321 000 1 356 580

 

EQUIPMENT LIST

Feature Factory Equipment (number of sets)
2016 2017 2018
CAM stations / seats 406 437 457
Plotters 93 96 107
Artwork AOI 25 25 31
Inner layer dry film lamination lines 64 68 69
Inner layer exposure machines 117 124 132
Inner layer automatic exposure machines 110 118 130
Inner layer LDI 15 16 18
Inner layer developing lines 66 72 74
AOI machines 219 227 231
Oxide lines 44 44 46
Bonding presses 82 84 85
X-Ray drilling machines 102 104 111
CNC drilling machines 1572 1654 1666
Laser drilling machines 78 78 95
De-smear and PTH lines 46 47 46
Panel plating lines 43 46 49
Vertical panel plating lines 43 47 48
Pattern plating lines 36 40 41
Outerlayer dry film lamination lines 61 63 64
Outerlayer UV exposure machines 73 79 86
Outerlayer automatic UV exposure machines 49 50 60
Outerlayer LDI 13 14 15
Outer layer developing lines 60 61 62
Outer layer AOI machines 123 136 140
Soldermask pre-treatment 48 49 50
Soldermask printing lines 358 367 370
Soldermask exposure machines 107 110 123
Soldermask automatic exposure machines 47 50 57
Soldermask developing lines 56 57 56
CNC routing machines 468 507 540
Bevelling machines 37 38 45
Scoring machines 70 71 72
Electrical test machines 306 313 308
Auto-segregation electrical test machines 90 94 113
Flying probe electrical test machines 144 152 159
Automated visual inspection systems 62 71 79