多层 PCB(多层)

多层 PCB 占 NCAB 产品总量的 65% 以上,是我们的主导产品。我们每年生产高达 6700 万欧元以上的多层电路板,因此对我们的工厂有重要影响力。我们拥有十多个当地和离岸工厂的合作伙伴,以便支持这个重要的产品份额,从新产品导入到批量生产。我们与这些工厂建立了牢固的长期关系,与大多数工厂合作已达五年以上。我们的高品质和及时交货的可靠工作业绩凸显了我们对客户满意度的专注。
8L multilayer - general description: high density PCB; materials: FR-4 Shengyi S-1000-2; solder mask color: blue; surface treatment: ENIG; PTH to copper line spacing: 0.015mm; inner/outer layer line width and spacing: 0.07mm/0.075mm; impedance control tolerance: +/- 7%; hole size tolerance: +/- 0.05mm; BGA pad: 0.25mm
8L multilayer - high density, small line and space, dense BGA designing, materials: FR4 (SY1000-2), solder mask color: blue, surface treatment: ENIG, inner layer line to hole space: 6 mil, inner/outer layer line width and space: 2.8 mil/3 mil, impedance tolerance: +/-7%, hole tolerance: +/-2mil, width of BGA: 10 mil

Multilayer PCBs - Technical specification

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Feature NCAB´s technical specification
Number of layers 4 - 22 layers standard, 30 layers advanced, 40 layers prototype.
Technology highlights Multilpe layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses.
Materials High performance FR4, halogen-free FR4, low loss and low Dk materials
Copper weights (finished) 18μm - 210μm, advanced 1050μm / 30oz
Minimum track and gap 0.075mm / 0.075mm
PCB thickness 0.40mm - 7.0mm
Maxmimum dimensions 580mm x 1080mm, advanced 610mm x 1400mm
Surface finishes available HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
Minimum mechanical drill 0.20mm