Tekninen valmius

Alla on esitetty tärkeimmät NCAB:n tällä hetkellä tarjoamat ja tukemat tekniset valmiudet. Esitys kattaa hallitsemamme erityismateriaalit, piirilevyteknologiat ja tyypit, joihin kykenemme.

Tekninen kyvykkyys on jaettu kahteen luokkaan. Toinen niistä on standardityyppiset, joihin kuuluvat tuotteet voimme hankkia helposti ”perustehtaistamme”. Toinen on vaativien tuotteiden luokka, joka on parasta, mitä NCAB voi tarjota. Siinä toimitusketju tai hankintavaihtoehdot saattavat rajoittua pienempään määrään tehtaita.

 

CAPABILITY ROADMAP
 

Feature 2018
Standard

Advanced

Materials RIGID:
FR2, CEM-1, CEM-3, FR4 (standard - halogen free - high performance) including:
ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave

FLEX:
PI, PET including:
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Hanwha, SF305

IMS:
IMS Al based including:
Bergquist MP, HT & CML
ITEQ T-Lam, Laird TLAM SS
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.

Please contact NCAB Group for full details regarding material availability.

RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2
Low – Loss material
N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed
Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD
Super Low – Loss material and High Thermal Reliability Laminate
TU993,M6N,M7N,

FLEX:
PI, LCP including: Dupont

IMS:
IMS Al & Cu based including:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi

Please contact NCAB Group for full details regarding material availability.

Minimum dielectric thickness 0.05mm for PCB
0.025mm for FPC
0.025mm for PCB
0.012mm for FPC
Layer count 1 - 38L / 40L QTA 64L (pilot runs)
HDI / Buried - blind via Y Y
Copper filled BVH (Y/N) Y Y
Copper filled PTH (Y/N) Y Y - copper paste
Copper paste filled PTH (Y/N) Y Y
Capped via (Y/N) Y Y
LDI (Y/N) Y Y
Maximum board size (mm) 1050 x 610 1400 X 610
Minimum board thickness
2L (mm)
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
Minimum board thickness
>=4L (mm)
0.25mm for PCB
0.20 for FPC
0.25mm for PCB
0.16 for FPC
Maximum board thickness (mm)

8.6 10.0
Minimum track / gap IL (mil)- copper weight dependant 0.075mm 0.05mm
Minimum track / gap OL (mil)- copper weight dependant 0.075mm 0.05mm
Surface finish ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG+GF/ Isn+GF /ENEPIG ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF
Layer to layer registration 0.05mm 25μm
Minimum hole (mech) (mm/mil) 0.15mm 0.10mm
Minimum hole (laser) (mm/mil) 0.075mm 0.05mm
Aspect ratio PTH 18:1 20:1
Aspect ration BVH 0.8:1 1.3:1 (factory + design dependant)
Finish hole tolerance (PTH) ± 0.076mm ± 0.05mm
Finish hole tolerance (NPTH) ± 0.0375 ± 0.025
Maximum Cu weight OL 12 oz 12 oz
Maximum Cu weight IL 12 oz 12 oz
Controlled impedance (+/- X%) Others ± 10% ± 5%
Rigid-flex (Y/N) Y Y including semi flex
Flexible (Y/N) Y Y
IMS (Y/N) Y (Al) Y (both Al and Cu)
Embedded components (Y/N) Y Y
Soldermask via plugging IPC4761 Type VI (Y/N)
Y Y
Epoxy via plugging IPC4761 Type VI (Y/N) Y Y
Epoxy via plugging IPC4761 Type VII (Y/N) Y Y
It is important to note that even with 'standard' technology this does not mean that all factories can achieve ALL of the aspects - When using combinations of these parameters, you should always consult your local NCAB technical contact person.