PCB SMI (Insulated Metal Base – Support métallique isolée)

NCAB a approuvé des usines spécialisées dans ce domaine, avec des établissements dédiés aux produits SMI, pour soutenir des secteurs tels que l'automobile, les applications médicales, l’aéronautique, l'éclairage et les applications industrielles. Les PCB SMI représentent un segment en très forte croissance et nos achats dans ce domaine augmente chaque mois.
MPCB – materials: Bergquist/HT-07006 A1:5052; solder mask: Tamura/DSR-2200 TT 31DX; board thickness: 1.85mm +/- 10%; copper thickness: 3oz; surface treatement: LF HASL; description: power products
MPCB – materials: Bergquist/HT-07006 A1:5052; solder mask: Tamura/DSR-2200 TT 31DX; board thickness: 1.85mm +/- 10%; copper thickness: 3oz; surface treatement: LF HASL; description: power products

IMS PCBs - Technical specification

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Feature NCAB´s technical specification
Number of layers 1 - 4 layers
Technology highlights Effective heat sink solutions for thermal applications. This construction type enables superior heat dissipation through use of either aluminium or copper substrate bonded to the insulated circuitry through thermal pre-preg or resin systems.
Materials Aluminium & copper plates. FR-4, PTFE, thermal dielectrics.
Dielectric thickness 0.05mm - 0.20mm
Thermal conductivity 1-4 W/m/K
Profile method Punching, Liquid cooled routing
Copper weights (finished) 35μm - 140μm
Minimum track and gaps 0.10mm / 0.10mm
Metal core thickness 0.40mm - 3.20mm
Maxmimum dimensions 550mm x 700mm
Surface finishes available HASL, LF HASL, OSP, ENIG, Imersion tin, Immsersion silver
Minimum mechanical drill 0.30mm