Производственные возможности включают две категории производства. Стандартное — это продукция, которую мы имеем возможность производить на наших ключевых или основных предприятиях. Вторая категория представляет собой наше расширенное предложение, демонстрирующее все самое лучшее, что может предложить компания NCAB, однако в этом случае выбор поставщиков может быть ограничен меньшим числом производств.
При использовании комбинации этих параметров вы должны проконсультироваться с техническим специалистом NCAB.
| 2019 | 2020 | 2021 | ||||
|---|---|---|---|---|---|---|
| Feature | Standard | Advanced | Standard | Advanced | Standard | Advanced |
| Materials Please contact NCAB Group for full details regarding material availability. | RIGID: FR2, CEM-1, CEM-3, FR4 (standard — halogen free — high performance) including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave, Ventec, Isola, Nelco, Rogers, Taconic, Panasonic FLEX: PI, PET including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Hanwha, SF305 IMS: IMS Al based including: Bergquist MP, HT & CML ITEQ T-Lam, Laird TLAM SSTaiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. | RIGID: Mid-Loss material: TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2 Low-loss material: N4000-13(series), FR408HR, Megtron-4, Megtron-4S, S7038, S7439, S7439C, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed,IT968 Ultra-Low loss material: Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series), RF-35, RF-35A2, TLX (series), AD250, FL-700LD Super Low – Loss material and High Thermal Reliability Laminate: TU993,M6N,M7N, IT988GSE FLEX: PI, LCP including Dupont IMS: IMS Al & Cu based including: Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi | RIGID: FR2, CEM-1, CEM-3, FR4 (standard — halogen free — high performance) including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave, Ventec, Isola, Nelco, Rogers, Taconic, Panasonic, Hitachi FLEX: PI, PET including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Hanwha, SF305 IMS: IMS Al & Cu based including: Bergquist MP, HT & CML ITEQ T-Lam, Laird TLAM SS Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. | RIGID: Mid-Loss material: TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2 Low-low loss material: N4000-13(series), FR408HR, Megtron-4, Megtron-4S, S7038, S7439, S7439C, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed,IT968 Ultra Low-Loss material: Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD, Super Low – Loss material and High Thermal Reliability Laminate: TU993,M6N,M7N, IT988GSE FLEX: PI, LCP including: Dupont IMS: IMS Al & Cu based including: Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi | RIGID: FR2, CEM-1, CEM-3, FR4 (standard — halogen free — high performance) including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave, Ventec, Isola, Nelco, Rogers, Taconic, Panasonic, Hitachi FLEX: PI, PET including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Hanwha, SF305 IMS: IMS Al & Cu based including: Bergquist MP, HT & CML, ITEQ T-Lam, Laird TLAM SSTaiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. | RIGID: Mid-Loss material: TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2 Low-Low loss material: N4000-13(series), FR408HR, Megtron-4, Megtron-4S, S7038, S7439, S7439C, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed,IT968 Ultra-Low Loss material: Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD, Super Low – Loss material and High Thermal Reliability Laminate: TU993,M6N,M7N, IT988GSE FLEX: PI, LCP including: Dupont IMS: IMS Al & Cu based including: Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi |
| Minimum dielectric thickness | 0.05mm for PCB 0.025mm for FPC | 0.025mm for PCB 0.012mm for FPC | 0.05mm for PCB 0.025mm for FPC | 0.025mm for PCB 0.012mm for FPC | 0.05mm for PCB 0.025mm for FPC | 0.025mm for PCB 0.012mm for FPC |
| Layer count | 1 — 38L / 40L QTA | 68L (pilot runs) | 1 — 38L / 40L QTA | 100L (pilot runs) | 1 — 38L / 40L QTA | 120L (pilot runs) |
| HDI / Buried — blind via | Y | Y | Y | Y | Y | Y |
| Copper filled BVH (Y/N) | Y | Y | Y | Y | Y | Y |
| Copper filled PTH (Y/N) | Y | Y — copper paste | Y | Y — copper paste | Y | Y — copper paste |
| Copper paste filled PTH (Y/N) | Y | Y | Y | Y | Y | Y |
| Capped via (Y/N) | Y | Y | Y | Y | Y | Y |
| LDI (Y/N) | Y | Y | Y | Y | Y | Y |
| Maximum board size (mm) | 1050 x 610 | 1400 X 610 | 1050 x 610 | 1400 X 610 | 1050 x 610 | 1400 X 610 |
| Minimum board thickness 2L (mm) | 0.15 for PCB 0.05 for 1L FPC 0.12 for 2L FPC | 0.15 for PCB 0.05 for 1L FPC 0.12 for 2L FPC | 0.15 for PCB 0.05 for 1L FPC 0.12 for 2L FPC | 0.15 for PCB 0.05 for 1L FPC 0.12 for 2L FPC | 0.15 for PCB 0.05 for 1L FPC 0.12 for 2L FPC | 0.15 for PCB 0.05 for 1L FPC 0.12 for 2L FPC |
| Minimum board thickness >=4L (mm) | 0.25 for PCB 0.20 for FPC | 0.25 for PCB 0.16 for FPC | 0.25 for PCB 0.20 for FPC | 0.25 for PCB 0.16 for FPC | 0.25 for PCB 0.20 for FPC | 0.25 for PCB 0.16 for FPC |
| Maximum board thickness (mm) | 8.6 | 10.0 | 8.6 | 10.0 | 8.6 | 14.0 |
| Minimum track / gap IL (mil)- copper weight dependant | 0.075mm | 0.05mm | 0.075mm | 0.05mm | 0.075mm | 0.05mm |
| Minimum track / gap OL (mil)- copper weight dependant | 0.075mm | 0.05mm | 0.075mm | 0.05mm | 0.075mm | 0.05mm |
| Minimum pitch of laser | 0.50mm | 0.35mm | 0.50mm | 0.35mm | 0.50mm | 0.30mm |
| Surface finish | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG+GF/ Isn+GF /ENEPIG / selective hard gold / Selective soft gold / flash gold | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG+GF/ Isn+GF /ENEPIG /selective hard gold / Selective soft gold / flash gold | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF /EPAG / ISIG | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG+GF/ Isn+GF /ENEPIG /selective hard gold / Selective soft gold / flash gold | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF /EPAG / ISIG |
| Minimum bonding pad size / gap | 125/125μm | 65/65μm | 125/125μm | 56/56μm | 125/125μm | 56/56μm |
| Layer to layer registration | 0.05mm | 25μm | 0.05mm | 25μm | 0.05mm | 25μm |
| Minimum hole (mech) (mm/mil) | 0.15mm | 0.10mm | 0.15mm | 0.10mm | 0.15mm | 0.10mm |
| Minimum hole (laser) (mm/mil) | 0.075mm | 0.05mm | 0.075mm | 0.05mm | 0.075mm | 0.05mm |
| Aspect ratio PTH | 20:1 | 22:1 | 20:1 | 25:1 | 20:1 | 27:1 |
| Aspect ration BVH | 0.8:1 | 1.3:1 (factory + design dependant) | 0.8:1 | 1.3:1 (factory + design dependant) | 0.8:1 | 1.3:1 (factory + design dependant) |
| Finish hole tolerance (PTH) | ± 0.076mm | ± 0.05mm | ± 0.076mm | ± 0.04mm | ± 0.076mm | ± 0.04mm |
| Finish hole tolerance (NPTH) | ± 0.0375 | ± 0.025 | ± 0.0375 | ± 0.025 | ± 0.0375 | ± 0.025 |
| Maximum Cu weight OL | 12 oz | 30 oz | 12 oz | 30 oz | 12 oz | 30 oz |
| Maximum Cu weight IL | 12 oz | 30 oz | 12 oz | 30 oz | 12 oz | 30 oz |
| Controlled impedance (+/- X%) | Others ± 10% | ± 5% | Others ± 10% | ± 5% | Others ± 10% | ± 5% |
| Minimum Solder mask clearance | 0.075mm | 0.025mm | 0.075mm | 0.025mm | 0.075mm | 0.025mm |
| Minimum Solder mask dam | 0.10mm | 0.05mm | 0.10mm | 0.05mm | 0.10mm | 0.05mm |
| Rigid-flex (Y/N) | Y | Y including semi flex | Y | Y including semi flex | Y | Y including semi flex |
| Flexible (Y/N) | Y | Y | Y | Y | Y | Y |
| IMS (Y/N) | Y (Al) | Y (both Al and Cu) | Y (Al) | Y (both Al and Cu) | Y (Al) | Y (both Al and Cu) |
| Embedded components (Y/N) | Y | Y | Y | Y | Y | Y |
| Soldermask via plugging IPC4761 Type VI (Y/N) | Y | Y | Y | Y | Y | Y |
| Epoxy via plugging IPC4761 Type VI (Y/N) | Y | Y | Y | Y | Y | Y |
| Epoxy via plugging IPC4761 Type VII (Y/N) | Y | Y | Y | Y | Y | Y |
| Copper paste via plugging IPC4761 Type VI (Y/N) | Y | Y | Y | Y | Y | Y |
| Silver paste via plugging IPC4761 Type VI (Y/N) | Y | Y | Y | Y | Y | Y |
| IC substrate | N | N | N | Y | N | Y |