Возможности

В изложенных ниже сведениях перечислены некоторые из ключевых возможностей, которые на сегодняшний день может предложить и обеспечить их поддержку компания NCAB - здесь вы найдете информацию, связанную с конкретными материалами, применение которых мы поддерживаем, технологии или виды ПП, которые мы в настоящее время производим, а также некоторые из допусков, которых мы способны достичь.

Производственные возможности включают две категории производства. Стандартное - это продукция, которую мы имеем возможность производить на наших ключевых или основных предприятиях. Вторая категория представляет собой наше расширенное предложение, демонстрирующее все самое лучшее, что может предложить компания NCAB, однако в этом случае выбор поставщиков может быть ограничен меньшим числом производств.

 

CAPABILITY ROADMAP
 

Feature 2018
Standard

Advanced
Materials RIGID:
FR2, CEM-1, CEM-3, FR4 (standard - halogen free - high performance) including:
ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave

FLEX:
PI, PET including:
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Hanwha, SF305

IMS:
IMS Al based including:
Bergquist MP, HT & CML
ITEQ T-Lam, Laird TLAM SS
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.

Please contact NCAB Group for full details regarding material availability.

RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2
Low – Loss material
N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed
Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD
Super Low – Loss material and High Thermal Reliability Laminate
TU993,M6N,M7N,

FLEX:
PI, LCP including: Dupont

IMS:
IMS Al & Cu based including:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi

Please contact NCAB Group for full details regarding material availability.

Minimum dielectric thickness 0.05mm for PCB
0.025mm for FPC 		0.025mm for PCB
0.012mm for FPC
Layer count 1 - 38L / 40L QTA 64L (pilot runs)
HDI / Buried - blind via Y Y
Copper filled BVH (Y/N) Y Y
Copper filled PTH (Y/N) Y Y - copper paste
Copper paste filled PTH (Y/N) Y Y
Capped via (Y/N) Y Y
LDI (Y/N) Y Y
Maximum board size (mm) 1050 x 610 1400 X 610
Minimum board thickness
2L (mm)		 0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC		 0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
Minimum board thickness
>=4L (mm)
 0.25mm for PCB
0.20 for FPC		 0.25mm for PCB
0.16 for FPC
Maximum board thickness (mm)

 8.6 10.0
Minimum track / gap IL (mil)- copper weight dependant 0.075mm 0.05mm
Minimum track / gap OL (mil)- copper weight dependant 0.075mm 0.05mm
Surface finish ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG+GF/ Isn+GF /ENEPIG ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF
Layer to layer registration 0.05mm 25μm
Minimum hole (mech) (mm/mil) 0.15mm 0.10mm
Minimum hole (laser) (mm/mil) 0.075mm 0.05mm
Aspect ratio PTH 18:1 20:1
Aspect ration BVH 0.8:1 1.3:1 (factory + design dependant)
Finish hole tolerance (PTH) ± 0.076mm ± 0.05mm
Finish hole tolerance (NPTH) ± 0.0375 ± 0.025
Maximum Cu weight OL 12 oz 12 oz
Maximum Cu weight IL 12 oz 12 oz
Controlled impedance (+/- X%) Others ± 10% ± 5%
Rigid-flex (Y/N) Y Y including semi flex
Flexible (Y/N) Y Y
IMS (Y/N) Y (Al) Y (both Al and Cu)
Embedded components (Y/N) Y Y
Soldermask via plugging IPC4761 Type VI (Y/N)
 Y Y
Epoxy via plugging IPC4761 Type VI (Y/N) Y Y
Epoxy via plugging IPC4761 Type VII (Y/N) Y Y
It is important to note that even with 'standard' technology this does not mean that all factories can achieve ALL of the aspects - When using combinations of these parameters, you should always consult your local NCAB technical contact person.

 

CAPACITY ROADMAP

Feature Capacity
2018
Capacity sqm per month 1 108 005
2 - 4 layers 476 030
6 layers and above 525 655
HDI / Buried - blind via 124 170
Flex, flex-rigid 60 450
Prototypes/QTA no orders 138 514
Number of employees (total) 29 346
Number of employees pre-production 1 531
Number of employees quality mgmt 3 630
Production facility sqm 1 268 288

 
EQUIPMENT LIST

Feature Factory Equipment (number of sets)
2018
CAM stations / seats 754
Plotters 77
Artwork AOI 40
Inner layer dry film lamination lines 57
Inner layer exposure machines 80
Inner layer automatic exposure machines 111
Inner layer LDI 26
Inner layer developing lines 68
AOI machines 176
Oxide lines 55
Bonding presses 109
X-Ray drilling machines 130
CNC drilling machines 1300
Laser drilling machines 112
De-smear and PTH lines 49
Panel plating lines 50
Vertical panel plating lines 57
Pattern plating lines 40
Outerlayer dry film lamination lines 61
Outerlayer UV exposure machines 42
Outerlayer automatic UV exposure machines 62
Outerlayer LDI 28
Outer layer developing lines 74
Outer layer AOI machines 132
Soldermask pre-treatment 57
Soldermask printing lines 309
Soldermask exposure machines 90
Soldermask automatic exposure machines 78
Soldermask developing lines 54
CNC routing machines 539
Bevelling machines 44
Scoring machines 58
Electrical test machines 221
Auto-segregation electrical test machines 139
Flying probe electrical test machines 229
Automated visual inspection systems 77