Возможности
В изложенных ниже сведениях перечислены некоторые из ключевых возможностей, которые на сегодняшний день может предложить и обеспечить их поддержку компания NCAB - здесь вы найдете информацию, связанную с конкретными материалами, применение которых мы поддерживаем, технологии или виды ПП, которые мы в настоящее время производим, а также некоторые из допусков, которых мы способны достичь.
Производственные возможности включают две категории производства. Стандартное - это продукция, которую мы имеем возможность производить на наших ключевых или основных предприятиях. Вторая категория представляет собой наше расширенное предложение, демонстрирующее все самое лучшее, что может предложить компания NCAB, однако в этом случае выбор поставщиков может быть ограничен меньшим числом производств.
CAPABILITY ROADMAP
| Feature | 2018 | |||
| Standard |
Advanced |
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| Materials | RIGID: FR2, CEM-1, CEM-3, FR4 (standard - halogen free - high performance) including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave FLEX: IMS: Please contact NCAB Group for full details regarding material availability. |
RIGID: Mid – Loss material TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2 Low – Loss material N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed Ultra Low – Loss material Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD Super Low – Loss material and High Thermal Reliability Laminate TU993,M6N,M7N, FLEX: IMS: Please contact NCAB Group for full details regarding material availability. |
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| Minimum dielectric thickness | 0.05mm for PCB 0.025mm for FPC |
0.025mm for PCB 0.012mm for FPC |
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| Layer count | 1 - 38L / 40L QTA | 64L (pilot runs) | ||
| HDI / Buried - blind via | Y | Y | ||
| Copper filled BVH (Y/N) | Y | Y | ||
| Copper filled PTH (Y/N) | Y | Y - copper paste | ||
| Copper paste filled PTH (Y/N) | Y | Y | ||
| Capped via (Y/N) | Y | Y | ||
| LDI (Y/N) | Y | Y | ||
| Maximum board size (mm) | 1050 x 610 | 1400 X 610 | ||
| Minimum board thickness 2L (mm) |
0.15mm for PCB 0.05mm for 1L FPC 0.12mm for 2L FPC |
0.15mm for PCB 0.05mm for 1L FPC 0.12mm for 2L FPC |
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| Minimum board thickness >=4L (mm) |
0.25mm for PCB 0.20 for FPC |
0.25mm for PCB 0.16 for FPC |
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| Maximum board thickness (mm) |
8.6 | 10.0 | ||
| Minimum track / gap IL (mil)- copper weight dependant | 0.075mm | 0.05mm | ||
| Minimum track / gap OL (mil)- copper weight dependant | 0.075mm | 0.05mm | ||
| Surface finish | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG+GF/ Isn+GF /ENEPIG | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF | ||
| Layer to layer registration | 0.05mm | 25μm | ||
| Minimum hole (mech) (mm/mil) | 0.15mm | 0.10mm | ||
| Minimum hole (laser) (mm/mil) | 0.075mm | 0.05mm | ||
| Aspect ratio PTH | 18:1 | 20:1 | ||
| Aspect ration BVH | 0.8:1 | 1.3:1 (factory + design dependant) | ||
| Finish hole tolerance (PTH) | ± 0.076mm | ± 0.05mm | ||
| Finish hole tolerance (NPTH) | ± 0.0375 | ± 0.025 | ||
| Maximum Cu weight OL | 12 oz | 12 oz | ||
| Maximum Cu weight IL | 12 oz | 12 oz | ||
| Controlled impedance (+/- X%) | Others ± 10% | ± 5% | ||
| Rigid-flex (Y/N) | Y | Y including semi flex | ||
| Flexible (Y/N) | Y | Y | ||
| IMS (Y/N) | Y (Al) | Y (both Al and Cu) | ||
| Embedded components (Y/N) | Y | Y | ||
| Soldermask via plugging IPC4761 Type VI (Y/N) |
Y | Y | ||
| Epoxy via plugging IPC4761 Type VI (Y/N) | Y | Y | ||
| Epoxy via plugging IPC4761 Type VII (Y/N) | Y | Y | ||
| It is important to note that even with 'standard' technology this does not mean that all factories can achieve ALL of the aspects - When using combinations of these parameters, you should always consult your local NCAB technical contact person. | ||||
CAPACITY ROADMAP
| Feature | Capacity | ||
| 2018 | |||
| Capacity sqm per month | 1 276 425 | ||
| 1 -2 layers | 348 606 | ||
| 4-8 layers | 531 579 | ||
| 10 layer + | 152 510 | ||
| HDI / Buried - blind via | 132 800 | ||
| IMS | 37 130 | ||
| Flex, Flex-rigid, semi-flex | 73 800 | ||
| Prototypes/QTA no orders | 139 144 | ||
| Number of employees (total) | 33 266 | ||
| Number of employees pre-production | 1 786 | ||
| Number of employees quality mgmt | 4 020 | ||
| Production facility sqm | 2 813 888 | ||
EQUIPMENT LIST
| Feature | Factory Equipment (number of sets) | ||
| 2018 | |||
| CAM stations / seats | 754 | ||
| Plotters | 77 | ||
| Artwork AOI | 40 | ||
| Inner layer dry film lamination lines | 57 | ||
| Inner layer exposure machines | 80 | ||
| Inner layer automatic exposure machines | 111 | ||
| Inner layer LDI | 26 | ||
| Inner layer developing lines | 68 | ||
| AOI machines | 176 | ||
| Oxide lines | 55 | ||
| Bonding presses | 109 | ||
| X-Ray drilling machines | 130 | ||
| CNC drilling machines | 1300 | ||
| Laser drilling machines | 112 | ||
| De-smear and PTH lines | 49 | ||
| Panel plating lines | 50 | ||
| Vertical panel plating lines | 57 | ||
| Pattern plating lines | 40 | ||
| Outerlayer dry film lamination lines | 61 | ||
| Outerlayer UV exposure machines | 42 | ||
| Outerlayer automatic UV exposure machines | 62 | ||
| Outerlayer LDI | 28 | ||
| Outer layer developing lines | 74 | ||
| Outer layer AOI machines | 132 | ||
| Soldermask pre-treatment | 57 | ||
| Soldermask printing lines | 309 | ||
| Soldermask exposure machines | 90 | ||
| Soldermask automatic exposure machines | 78 | ||
| Soldermask developing lines | 54 | ||
| CNC routing machines | 539 | ||
| Bevelling machines | 44 | ||
| Scoring machines | 58 | ||
| Electrical test machines | 221 | ||
| Auto-segregation electrical test machines | 139 | ||
| Flying probe electrical test machines | 229 | ||
| Automated visual inspection systems | 77 | ||
