NCAB GROUP

Kapabilitet

Informationen nedan visar några av de viktigaste parametrar som NCAB Group erbjuder idag. Här hittar du information om specifika material, mönsterkortstekniker och även några av de toleranser vi erbjuder.

Kapabilitetsdelen består av två kategorier. Den första kategorin som vi kallar ”standard” innebär att vi kan erbjuda varje individuell parameter från flera fabriker. Den andra kategorin ”advanced” visar det bästa NCAB kan erbjuda vilket innebär att minst en fabrik har förmågan att producera detta.

Vid kombinationer av flera parametrar bör du alltid rådgöra med din lokala NCAB tekniker.

 

CAPABILITY ROADMAP

Feature 2017
Standard Advanced
Materials RIGID:
FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance) including:
ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave

FLEX:
PI, PET Including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Hanwha, SF305

IMS:
IMS Al based Including: Bergquist MP, HT & CML ITEQ T-Lam, Laird TLAM SS Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.

Please contact NCAB Group for full details regarding material availability

RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2


Low – Loss material
N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed


Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD


Super Low – Loss material and High Thermal Reliability Laminate
TU993,M6N,M7N,

FLEX:
PI, LCP Including: Dupont

IMS:
IMS Al & Cu based
Including: Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi

Please contact NCAB Group for full details regarding material availability

Minimum dielectric thickness 0.05mm for PCB
0.025mm for FPC
0.025mm for PCB
0.012mm for FPC
Layer count 1 – 38L / 40L QTA 64L (pilot runs)
HDI / Buried – blind via Y Y
Copper filled BVH (Y/N) Y Y
Copper filled PTH (Y/N) Y Y – copper paste
Copper paste filled PTH (Y/N) Y Y
Capped via (Y/N) Y Y
LDI (Y/N) Y Y
Maximum board size (mm) 1050 x 610 1400 x 610
Minimum board thickness (mm)
2L
0.15 for PCB
0.05 for 1L FPC
0.12 for 2L FPC
0.15 for PCB
0.05 for 1L FPC
0.12 for 2L FPC
Minimum board thickness (mm)
≥4L
0.25 for PCB
0.20 for FPC
0.25 for PCB
0.16 for FCP
Maximum board thickness (mm)

8.6 10.0
Minimum track / gap IL (mil)- copper weight dependant 0.075mm 0.05mm
Minimum track / gap OL (mil)- copper weight dependant 0.075mm 0.05mm
Surface finish ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF
Layer to layer registration 0.05mm 25μm
Minimum hole (mech) (mm/mil) 0.15mm 0.1mm
Minimum hole (laser) (mm/mil) 0.075 0,05
Aspect ratio PTH 15:1 20:1
Aspect ration BVH 0.8:1 1.3:1 (factory + design dependant)
Finish hole tolerance (PTH) ± 0.076mm ± 0.05mm
Finish hole tolerance (NPTH) ±0.0375 ±0.025
Maximum Cu weight OL 12oz 12oz
Maximum Cu weight IL 12oz 12oz
Controlled impedance (+/- X%) Others ± 10% ± 5%

Rigid-flex (Y/N) Y Y including semi flex
Flexible (Y/N) Y Y
IMS (Y/N) Y (Al) Y (both Al and Cu)
Embedded components (Y/N) Y Y
Soldermask via plugging IPC4761 Type VI (Y/N)
Y Y
Epoxy via plugging IPC4761 Type VI (Y/N) Y Y
Epoxy via plugging IPC4761 Type VII (Y/N) Y Y
It is important to note that even with ‘standard’ technology this does not mean that all factories can achieve ALL of the aspects – When using combinations of these parameters, you should always consult your local NCAB technical contact person.

CAPACITY ROADMAP

Feature Capacity
2017
Capacity sqm per month 1 382 894
2 – 4 layers 524 150
6 layers and above 663 145
HDI / Buried – blind via 181 365
Flex, flex-rigid 39 204
Prototypes/QTA no orders 50 580
Number of employees (total) 31 604
Number of employees pre-production 1 941
Number of employees quality mgmt 3 626
Production facility sqm 2 851 130

 

EQUIPMENT LIST

Feature Factory Equipment (number of sets)
2017
CAM stations / seats 442
Plotters 49
Artwork AOI 27
Inner layer dry film lamination lines 47
Inner layer exposure machines 102
Inner layer automatic exposure machines 89
Inner layer LDI 13
Inner layer developing lines 48
AOI machines 241
Oxide lines 40
Bonding presses 52
X-Ray drilling machines 41
CNC drilling machines 1624
Laser drilling machines 26
De-smear and PTH lines 35
Panel plating lines 35
Vertical panel plating lines 41
Pattern plating lines 36
Outerlayer dry film lamination lines 53
Outerlayer UV exposure machines 79
Outerlayer automatic UV exposure machines 37
Outerlayer LDI 12
Outer layer developing lines 36
Outer layer AOI machines 150
Soldermask pre-treatment 47
Soldermask printing lines 287
Soldermask exposure machines 118
Soldermask automatic exposure machines 36
Soldermask developing lines 41
CNC routing machines 520
Bevelling machines 39
Scoring machines 70
Electrical test machines 311
Auto-segregation electrical test machines 141
Flying probe electrical test machines 238
Automated visual inspection systems 63