NCAB GROUP

Teknisk roadmap

NCAB Groups tekniska roadmap visar den förväntade utvecklingen av vårt produkterbjudande och tekniska möjligheter de kommande två åren. Att ha den kunskapen är avgörande för vår sourcingverksamhet eftersom detta hjälper oss att formera morgondagens strategier redan idag. Genom att förstå förväntningarna kan NCAB tillsammans med våra fabriker planera framåt för att göra det möjligt att uppnå målen.

Roadmapen omfattar exempelvis vilken utrustning och kapacitet som krävs för att lyckas på en snabbrörlig marknad.

CAPABILITY ROADMAP

Feature 2017 2018 2019
Standard Advanced
Materials RIGID:
FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance) including:
ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC,Meteorwave

FLEX:
PI, PET including:
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Hanwha,SF305

IMS:
IMS Al based including:
Bergquist MP, HT & CML
ITEQ T-Lam, Laird TLAM SS
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.

Please contact NCAB Group for full details regarding material availability.

RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2
Low – Loss material
N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed
Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD
Super Low – Loss material and High Thermal Reliability Laminate
TU993,M6N,M7N,

FLEX:
PI, LCP including: Dupont

IMS:
IMS Al & Cu based including:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Sh

Please contact NCAB Group for full details regarding material availability.

‘Advanced’ materials becoming more mainstream across the supply base. ‘Advanced’ materials becoming more mainstream across the supply base.
Minimum dielectric thickness 0.05mm for PCB
0.025mm for FPC
0.025mm for PCB
0.012mm for FPC
≤0.05mm for PCB
0.01mm for FPC
≤0.05mm for PCB
0.01mm for FPC
Layer count 1 – 38L / 40L QTA 64L (pilot runs) 60L 60L
HDI / Buried – blind via Y Y Y Y
Copper filled BVH (Y/N) Y Y Y Y
Copper filled PTH (Y/N) Y Y – copper paste Y Y
Copper paste filled PTH (Y/N) Y Y Y Y
Capped via (Y/N) Y Y Y Y
LDI (Y/N) Y Y Y Y
Maximum board size (mm) 1050 x 610 1400 X 610 1400 X 610 1400 X 610
Minimum board thickness
2L (mm)
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
Minimum board thickness
>=4L (mm)
0.25mm for PCB
0.20 for FPC
0.25mm for PCB
0.16 for FPC
0.20mm for PCB
0.16 for FPC
0.20mm for PCB
0.16 for FPC
Maximum board thickness (mm)

8.6 10.0 10.0 10.0
Minimum track / gap IL (mil)- copper weight dependant 0.075mm 0.05mm 0.05mm 0.05mm
Minimum track / gap OL (mil)- copper weight dependant 0.075mm 0.05mm 0.05mm 0.05mm
Surface finish ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF// IAG+GF/ Isn+GF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF/ Isn+GF
Layer to layer registration 0.05mm 25μm 25μm 25μm
Minimum hole (mech) (mm/mil) 0.15mm 0.10mm 0.10mm 0.10mm
Minimum hole (laser) (mm/mil) 0.075mm 0.05mm 0.05mm (std) 0.05mm (std)
Aspect ratio PTH 15:1 20:1 20:1 20:1
Aspect ration BVH 0.8:1 1.3:1 (factory + design dependant) ≥1.3:1 ≥1.3:1
Finish hole tolerance (PTH) ± 0.076mm ± 0.05mm ± 0.05mm ± 0.05mm
Finish hole tolerance (NPTH) ± 0.0375 ± 0.025 ± 0.025 ± 0.025
Maximum Cu weight OL 12 oz 12 oz 12 oz 12 oz
Maximum Cu weight IL 12 oz 12 oz 12 oz 12 oz
Controlled impedance (+/- X%) Others ± 10% ± 5% ± 5% ± 5%
Rigid-flex (Y/N) Y Y including semi flex Y including semi flex Y including semi flex
Flexible (Y/N) Y Y Y Y
IMS (Y/N) Y (Al) Y (both Al and Cu) Y Y
Embedded components (Y/N) Y Y Y Y
Soldermask via plugging IPC4761 Type VI (Y/N)
Y Y Y Y
Epoxy via plugging IPC4761 Type VI (Y/N) Y Y Y Y
Epoxy via plugging IPC4761 Type VII (Y/N) Y Y Y Y
It is important to note that even with ‘standard’ technology this does not mean that all factories can achieve ALL of the aspects – When using combinations of these parameters, you should always consult your local NCAB technical contact person.

CAPACITY ROADMAP

Feature Capacity
2017 2018 2019
Capacity sqm per month 1 382 894 1 501 342 1 613 107
2 – 4 layers 524 150 555 841 589 796
6 layers and above 663 145 719 827 741 363
HDI / Buried – blind via 181 365 219 223 273 034
Flex, flex-rigid 39 204 56 251 74 214
Prototypes/QTA no orders 50 580 58 866 63 569
Number of employees (total) 31 604 33 079 34 405
Number of employees pre-production 1 941 2 116 2 272
Number of employees quality mgmt 3 626 3 914 4 196
Production facility sqm 2 851 130 2 394 810 2 429 929

 

EQUIPMENT LIST

Feature Factory Equipment (number of sets)
2017 2018 2019
CAM stations / seats 442 475 522
Plotters 49 53 56
Artwork AOI 27 29 29
Inner layer dry film lamination lines 47 49 55
Inner layer exposure machines 102 107 110
Inner layer automatic exposure machines 89 101 111
Inner layer LDI 13 16 20
Inner layer developing lines 48 50 57
AOI machines 241 252 276
Oxide lines 40 44 51
Bonding presses 52 57 59
X-Ray drilling machines 41 50 57
CNC drilling machines 1624 1662 1683
Laser drilling machines 26 35 48
De-smear and PTH lines 35 38 42
Panel plating lines 35 42 47
Vertical panel plating lines 41 44 47
Pattern plating lines 36 41 47
Outerlayer dry film lamination lines 53 58 61
Outerlayer UV exposure machines 79 83 87
Outerlayer automatic UV exposure machines 37 47 52
Outerlayer LDI 12 18 22
Outer layer developing lines 36 38 41
Outer layer AOI machines 150 160 167
Soldermask pre-treatment 47 47 48
Soldermask printing lines 287 302 351
Soldermask exposure machines 118 123 130
Soldermask automatic exposure machines 36 44 52
Soldermask developing lines 41 43 46
CNC routing machines 520 569 613
Bevelling machines 39 41 45
Scoring machines 70 73 78
Electrical test machines 311 322 334
Auto-segregation electrical test machines 141 148 156
Flying probe electrical test machines 238 260 278
Automated visual inspection systems 63 76 87