Date and time
Friday, March 20th at 11am EST | 10am CST | 8am PST | 4pm GMT (1hour)
About the webinar
The demand for smaller, lighter and more capable electronic devices is accelerating. As boards become denser and form factors shrink, PCB miniaturization places new pressure on design teams to balance space constraints with reliability, manufacturability and performance.
In this webinar, Sam Thompson, Global Sales Director MedTech at NCAB Group, and Ryan Miller, Field Application Engineer and MedTech Specialist at NCAB Group USA, will share practical guidance on how to approach miniaturized PCB design with confidence. Drawing on extensive industry experience, they will discuss the technical considerations that have the greatest impact on quality and long-term device reliability — and where small design decisions can have significant downstream effects in production.
Whether you are already working on miniaturized designs or preparing for future next-generation products, this session will provide clear, actionable insight to help engineering and sourcing teams reduce risk and optimize outcomes.
Agenda
- What is miniaturization technology?
- Spotlight: miniaturization in MedTech
- Technical deep dive:
- Track and gap
- Rigid HDI
- Flex, Rigid-Flex & HDI
- Common mistakes to avoid
- Q&A
Speakers
