Some of today’s challenges for data centers are heat management and increasing data throughput while decreasing relative power consumption. Please see below for a selection of applications we serve.
Selection of applications we serve
High speed communication hardware
PCBs for fiber optic transceivers and switch electronics. Demands are typically signal integrity and thermal management.
PCB TechnologyPCB Technology for High speed communication hardware
HDI
Multilayer
High speed communication interconnect
PCBs for high-speed passive connectors and opto-electrical transceiver modules. Demands are typically signal integrity and very limited size.
PCB TechnologyPCB Technology for High speed communication interconnect
HDI
RF - Radio Frequency
RIGID-FLEX
Rugged computer modules
PCBs for rugged deployable systems that need to operate in harsh usage environments and conditions. Demands are typically high reliability with particular focus on water, dust, shock and vibration.
PCB TechnologyPCB Technology for Rugged computer modules
HDI
RF - Radio Frequency
