Some of today’s challenges for data centers are heat management and increasing data throughput while decreasing relative power consumption. Please see below for a selection of applications we serve.
High speed communication hardware
PCBs for fiber optic transceivers and switch electronics. Demands are typically signal integrity and thermal management.
PCB Technology for High speed communication hardware
HDI
Multilayer
High speed communication interconnect
PCBs for high-speed passive connectors and opto-electrical transceiver modules. Demands are typically signal integrity and very limited size.
PCB Technology for High speed communication interconnect
HDI
RF - Radio Frequency
RIGID-FLEX
