Notre capacité technologique

Les compétences clés que NCAB peut offrir et prendre en charge aujourd’hui sont décrites dans la section ci-dessous – Vous y trouverez des informations sur les matériaux spécifiques que nous pouvons vous proposer, les technologies ou types de PCB que nous fournissons actuellement, ainsi que certaines des tolérances que nous pouvons atteindre.

Les compétences se répartissent en deux catégories – la première que nous qualifions de faisabilité PCB standard, correspond à une catégorie de produits dont nous pouvons facilement assurer l’approvisionnement par l’intermédiaire de nos usines clés. La seconde, qui correspond à notre offre faisaibilité PCB avancée, illustre le meilleur de ce que NCAB peut offrir mais, dans ce cas, la chaîne ou les options d’approvisionnement peuvent être limitées à un nombre d’usines restreint.

Lorsque vous utilisez la combinaison de ces paramètres, vous devez toujours consulter votre contact technique NCAB local.


Feature
2022
Standard

Advanced
20232024
Materials
Please contact NCAB Group for full details regarding material availability.
RIGID:
FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance)
Hydrocarbon
including:
ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave, Synamic

FLEX:
PI, PET, PSA,SUS,LPISM,Silver ink and Carbon ink, Metal dome, Underfill glue
Including:
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Thinflex, Hanwha, EMI film
Sputtered copper
Modified Polyimide
Silver ink and Carbon in

IMS:
IMS Al based
Including:
Bergquist MP, HT & CML
ITEQ T-Lam, Laird TLAM SS
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.
RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2
Low – Loss material
N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed
Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD
Super Low – Loss material and High Thermal Reliability Laminate
TU993,M6N,M7N

FLEX:
PI, LCP
Including: Dupont, Copper-nickel alloy, Conformal coating, Sputtered copper, Modified Polyimide, Silver ink and Carbon in

IMS:
IMS Al & Cu based
Include:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi
‘Advanced’ materials becoming more mainstream across the supply base.‘Advanced’ materials becoming more mainstream across the supply base.
Minimum dielectric thickness0.05mm for PCB
0.025mm for FPC
0.025mm for PCB
0.012mm for FPC
≤0.05mm for PCB
0.01mm for FPC
≤0.05mm for PCB
0.01mm for FPC
Layer count1 – 42L / 50L QTA64L (pilot runs)64L (pilot runs)64L (pilot runs)
HDI / Buried – blind viaYYYY
Copper filled BVH (Y/N)YYYY
Copper filled PTH (Y/N)YY – copper pasteY – copper pasteY – copper paste
Copper paste filled PTH (Y/N)YYYY
Capped via (Y/N)YYYY
LDI (Y/N)YYYY
Maximum board size (mm)1180 X 6101400 X 6101400 X 6101400 X 610
Minimum board thickness (mm) 2L0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
Minimum board thickness (mm) ≥4L0.25mm for PCB
0.20 for FPC
0.25mm for PCB
0.16 for FPC
0.25mm for PCB
0.16 for FPC
0.25mm for PCB
0.15 for FPC
Maximum board thickness (mm)8.6mm10.0mm10.0mm10.0mm
Minimum track / gap IL (mil) – copper weight dependant0.06mm for PCB
0.025mm for FPC
0.06mm for PCB
0.025mm for FPC
0.04mm for PCB
0.025mm for FPC
0.04mm for PCB
0.025mm for FPC
Minimum track / gap OL (mil) – copper weight dependant0.075mm for PCB
0.04mm for FPC
0.075mm for PCB
0.04mm for FPC
0.05mm for PCB
0.04mm for FPC
0.05mm for PCB
0.04mm for FCP
Surface finishENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ENEPIGENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GFENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GFENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GF
Layer to layer registration0.05mm for PCB
0.02mm for FPC
0.025mm for PCB
0.02mm for FPC
0.025mm for PCB
0.02 for FCP
0.025mm for PCB
0.02 for FCP
Minimum hole (mech) (mm/mil)0.15mm0.1mm0.1mm0.1mm
Minimum hole (laser) (mm/mil)0.0750,050,050,05
Aspect ratio PTH40:140:145:145:1
Aspect ration BVH0.9:11.3:1 (factory + design dependant)1.3:1 (factory + design dependant)1.3:1 (factory + design dependant)
Finish hole tolerance (PTH)± 0.076mm± 0.05mm± 0.05mm± 0.03mm
Finish hole tolerance (NPTH)±0.0375±0.025±0.025±0.025
Maximum Cu weight OL12oz12oz12oz12oz
Maximum Cu weight IL12oz12oz12oz12oz
Controlled impedance (+/- X%)Others ± 10%± 5%± 5%± 5%
Rigid-flex (Y/N)YY including semi flexY including semi flexY including semi flex
Flexible (Y/N)YYYY
IMS (Y/N)Y (Al)Y (both Al and Cu)Y (both Al and Cu)Y (both Al and Cu)
Embedded components (Y/N)YYYY
Soldermask via plugging IPC4761 Type VI (Y/N)YYYY
Epoxy via plugging IPC4761 Type VI (Y/N)YYYY
Epoxy via plugging IPC4761 Type VII (Y/N)YYYY