La première catégorie que nous appelons « Standard » signifie que nous pouvons proposer des options provenant de multiples sources. La deuxième catégorie « Avancée » représente ce que NCAB peut offrir de mieux. Cependant, les options d’approvisionnement sont ici plus limitées, et dans certains cas, une seule usine est capable de produire le circuit imprimé demandé.
Cette feuille de route est basée sur les capacités qualifiées au 1er janvier 2025, y compris les investissements planifiés et approuvés jusqu’en 2025. Des capacités plus avancées sont disponibles à un niveau de qualification inférieur, selon les accords entre NCAB, l’usine et le client.
Pour toute question, n’hésitez pas à consulter votre contact technique NCAB local.
| Feature | 2025 Standard | Advanced | 2026 |
| Materials | RIGID: FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance), Hydrocarbon, High CTI (0), High thermal conductivity, PI Including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave, Synamic FLEX: PI, PET, PSA, SUS, LPISM, Silver ink and Carbon ink, Metal dome, Underfill glue Including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Thinflex, Hanwha, EMI film Sputtered copper Modified Polyimide Silver ink and Carbon ink IMS: IMS Al based Including: Bergquist MP, HT & CML, ITEQ T-Lam, Laird TLAM SS, Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Please contact NCAB Group for full details regarding material availability | RIGID: Mid – Loss material TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2 Low – Loss material N4000-13 (series), FR408HR, Megtron-4, Megtron-4S, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20 (series), I-Speed, TU883, EM891, EM528 I-Tera, IT968, IT968G, S6GX, S6X, MW1000, NPG186, LW900G, DS-7409(V), H360, H360C, NY6300 (series) Ultra Low – Loss material Megtron-6, IT150DA, FX-2, FL-700, I-Tera, ASTRA, N6800-22 (series), RO4350B, RO3000 (series), RF-35, RF-35A2, TLX (series), AD250, FL-700LD, TU933, EM890K, Tachyon-100G, IT988GSE, S6N //S8N MW4000, LW990G DS-7409D(V)N HSD7/HSD7K NY-P2/NY-P3 Super Low – Loss material and High Thermal Reliability Laminate TU993,M6N,M7N,M7GN, Extremely Low Loss M8U/M8N TU943R EM892K/EM892K2 IT998 S9N/S9N2 MW8000 MCL-990GDZ DS-7409DJL2+ NY-P4 FLEX: PI, LCP, PCP/PIC Including: Dupont, Panasonic, Copper-nickel alloy, Conformal coating, Sputtered copper, Modified Polyimide, Silver ink and Carbon ink IMS: IMS Al & Cu based Include: Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi Please contact NCAB Group for full details regarding material availability | ‘Advanced’ materials becoming more mainstream across the supply base. Non reinforced materials will increase in line with with UHDI emerging. |
| Minimum dielectric thickness | 0.05mm for PCB 0.025mm for FPC | 0.025mm for PCB 0.012mm for FPC | ≤0.05mm for PCB 0.01mm for FPC |
| Layer count | 1 – 42L / 50L QTA/Backplane 68L | 64L (pilot runs)/Backplane 120L | 64L (pilot runs)/Backplane 68L |
| HDI / Buried – blind via | Y (6+N+6) | Y (8+N+8) | Y (7+N+7) |
| Copper filled BVH (Y/N) | Y | Y | Y |
| Copper filled PTH (Y/N) | Y- copper paste | Y- copper paste | Y |
| Copper paste filled PTH (Y/N) | Y | Y | Y |
| Capped via (Y/N) | Y | Y | Y |
| LDI (Y/N) | Y | Y | Y |
| Maximum board size (mm) | 1180 x 610 | 1400 x 610 | 1400 x 610 |
| Minimum board thickness (mm) 2L | 0.15mm for PCB 0.05mm for 1L FPC 0.06mm for 2L FPC | 0.12mm for PCB 0.05mm for 1L FPC 0.06mm for 2L FPC | 0.08mm for PCB 0.05mm for 1L FPC 0.06mm for 2L FPC |
| Minimum board thickness (mm) ≥ 4L | 0.20mm for PCB 0.13 for FPC | 0.20mm for PCB 0.13 for FPC | 0.13 mm for PCB 0.13 for FPC |
| Maximum board thickness (mm) | 8.6mm | 10.0mm | 10.0mm |
| Minimum track / gap IL (mil) – copper weight dependant | 0.05mm for PCB 0.025mm for FPC | 0.030mm for PCB 0.025mm for FPC | 0.025mm for PCB 0.020mm for FPC |
| Minimum track / gap OL (mil) – copper weight dependant | 0.05mm for PCB 0.04mm for FPC | 0.040 mm for PCB 0.030 mm for FPC | 0.025mm for PCB 0.020mm for FPC |
| Surface finish | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ENEPIG | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ ENEPIG / SPF | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ ENEPIG / SPF |
| Layer to layer registration | 0.05mm for PCB 0.02mm for FPC | 0.025mm for PCB 0.02mm for FPC | 0.025mm for PCB 0.02mm for FPC |
| Minimum hole (mech) (mm/mil) | 0.1mm | 0.075mm | 0.075mm |
| Minimum hole (laser) (mm/mil) | 0.05 | 0.05 | 0,035 |
| Aspect ratio PTH | 30:1 | 35:1 | 35:1 |
| Aspect ration BVH | 0.8:1 | 1.3:1 (factory + design dependant) | 1.3:1 (factory + design dependant) |
| Finish hole tolerance (PTH) | ± 0.076mm | ± 0.05mm | ± 0.05mm |
| Finish hole tolerance (NPTH) | ±0.0375 | ±0.025 | ±0.025 |
| Maximum Cu weight OL | 12oz | 12oz | 12oz |
| Maximum Cu weight IL | 12oz | 12oz | 12oz |
| Controlled impedance (+/- X%) | Others ± 10% | ± 5% | ± 5% |
| Rigid-flex (Y/N) | Y | Y including semi flex | Y including semi flex |
| Flexible (Y/N) | Y | Y | Y |
| IMS (Y/N) | Y (Al) | Y (both Al and Cu) | Y (both Al and Cu) |
| Embedded components (Y/N) | Y | Y | Y |
| Soldermask via plugging IPC4761 Type VI (Y/N) | Y | Y | Y |
| Epoxy via plugging IPC4761 Type VI (Y/N) | Y | Y | Y |
| Epoxy via plugging IPC4761 Type VII (Y/N) | Y | Y | Y |