Kapabilitet

Informationen nedan visar några av de viktigaste parametrar som NCAB Group erbjuder idag. Här hittar du information om specifika material, mönsterkortstekniker och även några av de toleranser vi erbjuder.

Kapabilitetsdelen består av två kategorier. Den första kategorin som vi kallar ”standard” innebär att vi kan erbjuda varje individuell parameter från flera fabriker. Den andra kategorin ”advanced” visar det bästa NCAB kan erbjuda vilket innebär att minst en fabrik har förmågan att producera detta.

Vid kombinationer av flera parametrar bör du alltid rådgöra med din lokala NCAB tekniker.


Feature
2023
Standard

Advanced
20242025
Materials
Please contact NCAB Group for full details regarding material availability.
RIGID:
FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance)
Hydrocarbon, High CTI (0), High thermal conductivity, PI
Including:
ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC,Meteorwave,Synamic

FLEX:
PI, PET, PSA,SUS,LPISM,Silver ink and Carbon ink ,Metal dome ,Underfill glue
Including:
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Thinflex, Hanwha, EMI film
Sputtered copper
Modified Polyimide
Silver ink and Carbon in

IMS:
Bergquist MP, HT & CML
ITEQ T-Lam, Laird TLAM SS
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.

Please contact NCAB Group for full details regarding material availability
RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2
Low – Loss material
N4000-13(series), FR408HR, Megtron-4, Megtron-4S, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed
Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, ASTRA, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD
Super Low – Loss material and High Thermal Reliability Laminate
TU993,M6N,M7N,

FLEX:
PI, LCP
Include: Dupont, Panasonic
Copper-nickel alloy, Conformal coating, Sputtered copper, Modified Polyimide, Silver ink and Carbon in

IMS:
IMS Al & Cu based
Include:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi

Please contact NCAB Group for full details regarding material availability
‘Advanced’ materials becoming more mainstream across the supply base. Non reinforced materials will increase in line with with UHDI emerging.‘Advanced’ materials becoming more mainstream across the supply base. Non reinforced materials will increase in line with with UHDI emerging.
Minimum dielectric thickness0.05mm for PCB
0.025mm for FPC
0.025mm for PCB
0.012mm for FPC
≤0.05mm for PCB
0.01mm for FPC
≤0.05mm for PCB
0.01mm for FPC
Layer count1 – 42L / 50L QTA64L (pilot runs)64L (pilot runs)64L (pilot runs)
HDI / Buried – blind viaY (2+n+2)Y (4+n+4 / ELIC)Y (U-HDI)Y (U-HDI)
Copper filled BVH (Y/N)YYYY
Copper filled PTH (Y/N)Y- copper pasteY – copper pasteYY
Copper paste filled PTH (Y/N)YYYY
Capped via (Y/N)YYYY
LDI (Y/N)YYYY
Maximum board size (mm)1180 X 6101400 X 6101400 X 6101400 X 610
Minimum board thickness (mm) 2L0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.08mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.08mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
Minimum board thickness (mm) ≥4L0.25mm for PCB
0.20 for FPC
0.25mm for PCB
0.16 for FPC
0.13 mm for PCB
0.13 for FPC
0.13 mm for PCB
0.13 for FPC
Maximum board thickness (mm)8.6mm10.0mm10.0mm10.0mm
Minimum track / gap IL (mil) – copper weight dependant0.06mm for PCB
0.025mm for FPC
0.030mm for PCB
0.025mm for FPC
0.025mm for PCB
0.020mm for FPC
0.015mm for PCB
0.015mm for FPC
Minimum track / gap OL (mil) – copper weight dependant0.075mm for PCB
0.04mm for FPC
0.050 mm for PCB
0.030 mm for FPC
0.025mm for PCB
0.020mm for FPC
0.015mm for PCB
0.015mm for FPC
Surface finishENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ENEPIGENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GFENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GFENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GF
Layer to layer registration0.05mm for PCB
0.02mm for FPC
0.025mm for PCB
0.02mm for FPC
0.025mm for PCB
0.02 for FCP
0.025mm for PCB
0.02 for FCP
Minimum hole (mech) (mm/mil)0.15mm0.1mm0.1mm0.1mm
Minimum hole (laser) (mm/mil)0.0750,050,040,04
Aspect ratio PTH30:10.015mm for PCB
0.015mm for FPC
35:135:1
Aspect ration BVH0.9:11.3:1 (factory + design dependant)1.3:1 (factory + design dependant)1.3:1 (factory + design dependant)
Finish hole tolerance (PTH)± 0.076mm± 0.05mm± 0.05mm± 0.03mm
Finish hole tolerance (NPTH)±0.0375±0.025±0.025±0.025
Maximum Cu weight OL12oz12oz12oz12oz
Maximum Cu weight IL12oz12oz12oz12oz
Controlled impedance (+/- X%)Others ± 10%± 5%± 5%± 5%
Rigid-flex (Y/N)YY including semi flexY including semi flexY including semi flex
Flexible (Y/N)YYYY
IMS (Y/N)Y (Al)Y (both Al and Cu)Y (both Al and Cu)Y (both Al and Cu)
Embedded components (Y/N)YYYY
Soldermask via plugging IPC4761 Type VI (Y/N)YYYY
Epoxy via plugging IPC4761 Type VI (Y/N)YYYY
Epoxy via plugging IPC4761 Type VII (Y/N)YYYY