Nasze możliwości wytwórcze podzielić można na dwie kategorie – pierwsza z nich, zwana przez nas standardową, zawiera projekty, które możemy z łatwością zrealizować za pomocą naszych kluczowych, głównych fabryk. W drugiej kategorii znajduje się nasza oferta zaawansowana, ilustrująca najlepiej ogromne możliwości firmy NCAB, w tej kategorii jednak opcje łańcucha dostaw czy pozyskiwania dostawców zewnętrznych mogą być ograniczone do mniejszej liczby fabryk.
Korzystając z kombinacji tych parametrów, należy zawsze skonsultować się z osobą techniczną w lokalnym biurze NCAB.
| Feature | 2025 Standard | Advanced | 2026 |
| Materials | RIGID: FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance), Hydrocarbon, High CTI (0), High thermal conductivity, PI Including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave, Synamic FLEX: PI, PET, PSA, SUS, LPISM, Silver ink and Carbon ink, Metal dome, Underfill glue Including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Thinflex, Hanwha, EMI film Sputtered copper Modified Polyimide Silver ink and Carbon ink IMS: IMS Al based Including: Bergquist MP, HT & CML, ITEQ T-Lam, Laird TLAM SS, Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Please contact NCAB Group for full details regarding material availability | RIGID: Mid – Loss material TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2 Low – Loss material N4000-13 (series), FR408HR, Megtron-4, Megtron-4S, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20 (series), I-Speed, TU883, EM891, EM528 I-Tera, IT968, IT968G, S6GX, S6X, MW1000, NPG186, LW900G, DS-7409(V), H360, H360C, NY6300 (series) Ultra Low – Loss material Megtron-6, IT150DA, FX-2, FL-700, I-Tera, ASTRA, N6800-22 (series), RO4350B, RO3000 (series), RF-35, RF-35A2, TLX (series), AD250, FL-700LD, TU933, EM890K, Tachyon-100G, IT988GSE, S6N //S8N MW4000, LW990G DS-7409D(V)N HSD7/HSD7K NY-P2/NY-P3 Super Low – Loss material and High Thermal Reliability Laminate TU993,M6N,M7N,M7GN, Extremely Low Loss M8U/M8N TU943R EM892K/EM892K2 IT998 S9N/S9N2 MW8000 MCL-990GDZ DS-7409DJL2+ NY-P4 FLEX: PI, LCP, PCP/PIC Including: Dupont, Panasonic, Copper-nickel alloy, Conformal coating, Sputtered copper, Modified Polyimide, Silver ink and Carbon ink IMS: IMS Al & Cu based Include: Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi Please contact NCAB Group for full details regarding material availability | ’Advanced’ materials becoming more mainstream across the supply base. Non reinforced materials will increase in line with with UHDI emerging. |
| Minimum dielectric thickness | 0.05mm for PCB 0.025mm for FPC | 0.025mm for PCB 0.012mm for FPC | ≤0.05mm for PCB 0.01mm for FPC |
| Layer count | 1 – 42L / 50L QTA/Backplane 68L | 64L (pilot runs)/Backplane 120L | 64L (pilot runs)/Backplane 68L |
| HDI / Buried – blind via | Y (6+N+6) | Y (8+N+8) | Y (7+N+7) |
| Copper filled BVH (Y/N) | Y | Y | Y |
| Copper filled PTH (Y/N) | Y- copper paste | Y- copper paste | Y |
| Copper paste filled PTH (Y/N) | Y | Y | Y |
| Capped via (Y/N) | Y | Y | Y |
| LDI (Y/N) | Y | Y | Y |
| Maximum board size (mm) | 1180 x 610 | 1400 x 610 | 1400 x 610 |
| Minimum board thickness (mm) 2L | 0.15mm for PCB 0.05mm for 1L FPC 0.06mm for 2L FPC | 0.12mm for PCB 0.05mm for 1L FPC 0.06mm for 2L FPC | 0.08mm for PCB 0.05mm for 1L FPC 0.06mm for 2L FPC |
| Minimum board thickness (mm) ≥ 4L | 0.20mm for PCB 0.13 for FPC | 0.20mm for PCB 0.13 for FPC | 0.13 mm for PCB 0.13 for FPC |
| Maximum board thickness (mm) | 8.6mm | 10.0mm | 10.0mm |
| Minimum track / gap IL (mil) – copper weight dependant | 0.05mm for PCB 0.025mm for FPC | 0.030mm for PCB 0.025mm for FPC | 0.025mm for PCB 0.020mm for FPC |
| Minimum track / gap OL (mil) – copper weight dependant | 0.05mm for PCB 0.04mm for FPC | 0.040 mm for PCB 0.030 mm for FPC | 0.025mm for PCB 0.020mm for FPC |
| Surface finish | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ENEPIG | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ ENEPIG / SPF | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ ENEPIG / SPF |
| Layer to layer registration | 0.05mm for PCB 0.02mm for FPC | 0.025mm for PCB 0.02mm for FPC | 0.025mm for PCB 0.02mm for FPC |
| Minimum hole (mech) (mm/mil) | 0.1mm | 0.075mm | 0.075mm |
| Minimum hole (laser) (mm/mil) | 0.05 | 0.05 | 0,035 |
| Aspect ratio PTH | 30:1 | 35:1 | 35:1 |
| Aspect ration BVH | 0.8:1 | 1.3:1 (factory + design dependant) | 1.3:1 (factory + design dependant) |
| Finish hole tolerance (PTH) | ± 0.076mm | ± 0.05mm | ± 0.05mm |
| Finish hole tolerance (NPTH) | ±0.0375 | ±0.025 | ±0.025 |
| Maximum Cu weight OL | 12oz | 12oz | 12oz |
| Maximum Cu weight IL | 12oz | 12oz | 12oz |
| Controlled impedance (+/- X%) | Others ± 10% | ± 5% | ± 5% |
| Rigid-flex (Y/N) | Y | Y including semi flex | Y including semi flex |
| Flexible (Y/N) | Y | Y | Y |
| IMS (Y/N) | Y (Al) | Y (both Al and Cu) | Y (both Al and Cu) |
| Embedded components (Y/N) | Y | Y | Y |
| Soldermask via plugging IPC4761 Type VI (Y/N) | Y | Y | Y |
| Epoxy via plugging IPC4761 Type VI (Y/N) | Y | Y | Y |
| Epoxy via plugging IPC4761 Type VII (Y/N) | Y | Y | Y |