Kyvykkyytemme tiekartta

Alla on esitetty tärkeimmät NCAB:n tällä hetkellä tarjoamat ja tukemat tekniset valmiudet. Esitys kattaa hallitsemamme erityismateriaalit, piirilevyteknologiat ja tyypit, joihin kykenemme.

Tekninen kyvykkyys on jaettu kahteen luokkaan. Toinen niistä on standardityyppiset, joihin kuuluvat tuotteet voimme hankkia helposti ”perustehtaistamme”. Toinen on vaativien tuotteiden luokka, joka on parasta, mitä NCAB voi tarjota. Siinä toimitusketju tai hankintavaihtoehdot saattavat rajoittua pienempään määrään tehtaita.

Kun käytetään näiden parametrien yhdistelmiä, tulee aina ottaa yhteyttä paikalliseen NCAB:n tekniseen yhteyshenkilöön .


Feature
2020
Standard

Advanced
20212022
Materials
Please contact NCAB Group for full details regarding material availability.
RIGID:
FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance)
Hydrocarbon
including:
ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC,Meteorwave

FLEX:
PI, PET, PSA,SUS,LPISM,Silver ink and Carbon ink ,Metal dome ,Underfill glue
Include: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Thinflex, Hanwha, EMI film

IMS:
IMS Al based
Include: Bergquist MP, HT & CML
ITEQ T-Lam, Laird TLAM SS
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.
RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2
Low – Loss material
N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed
Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD
Super Low – Loss material and High Thermal Reliability Laminate
TU993,M6N,M7N,

FLEX:
PI, LCP
Include: Dupont, Copper-nickel alloy,
Conformal coating
IMS:
IMS Al & Cu based
Include: Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi
’Advanced’ materials becoming more mainstream across the supply base.’Advanced’ materials becoming more mainstream across the supply base.
Minimum dielectric thickness0.05mm for PCB
0.025mm for FPC
0.025mm for PCB
0.012mm for FPC
≤0.05mm for PCB
0.01mm for FPC
≤0.05mm for PCB
0.01mm for FPC
Layer count1 – 38L / 40L QTA64L (pilot runs)64L (pilot runs)64L (pilot runs)
HDI / Buried – blind viaYYYY
Copper filled BVH (Y/N)YYYY
Copper filled PTH (Y/N)YY – copper pasteY – copper pasteY – copper paste
Copper paste filled PTH (Y/N)YYYY
Capped via (Y/N)YYYY
LDI (Y/N)YYYY
Maximum board size (mm)1050 X 6101400 X 6101400 X 6101400 X 610
Minimum board thickness (mm) 2L0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
Minimum board thickness (mm) ≥4L0.25mm for PCB
0.20 for FPC
0.25mm for PCB
0.16 for FPC
0.25mm for PCB
0.16 for FPC
0.25mm for PCB
0.15 for FPC
Maximum board thickness (mm)8.6mm10.0mm10.0mm10.0mm
Minimum track / gap IL (mil) – copper weight dependant0.075mm0.05mm0.05mm0.05mm
Minimum track / gap OL (mil) – copper weight dependant0.075mm0.05mm0.05mm0.05mm
Surface finishENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ENEPIGENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GFENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GFENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GF
Layer to layer registration0.05mm25μm25μm20μm
Minimum hole (mech) (mm/mil)0.15mm0.1mm0.1mm0.1mm
Minimum hole (laser) (mm/mil)0.0750,050,050,05
Aspect ratio PTH18:120:120:122:1
Aspect ration BVH0.8:11.3:1 (factory + design dependant)1.3:1 (factory + design dependant)1.3:1 (factory + design dependant)
Finish hole tolerance (PTH)± 0.076mm± 0.05mm± 0.05mm± 0.03mm
Finish hole tolerance (NPTH)±0.0375±0.025±0.025±0.025
Maximum Cu weight OL12oz12oz12oz12oz
Maximum Cu weight IL12oz12oz12oz12oz
Controlled impedance (+/- X%)Others ± 10%± 5%± 5%± 5%
Rigid-flex (Y/N)YY including semi flexY including semi flexY including semi flex
Flexible (Y/N)YYYY
IMS (Y/N)Y (Al)Y (both Al and Cu)Y (both Al and Cu)Y (both Al and Cu)
Embedded components (Y/N)YYYY
Soldermask via plugging IPC4761 Type VI (Y/N)YYYY
Epoxy via plugging IPC4761 Type VI (Y/N)YYYY
Epoxy via plugging IPC4761 Type VII (Y/N)YYYY