Capability roadmap

The information below details some of the key capabilities that NCAB Group can offer and support today. You will find information here relating to the specific materials we can support, the PCB technologies or product types which we currently produce, as well as some of the tolerances which we can achieve.

The first category is what we call “standard” and means we can offer each individual parameters from multiple sources. The second is our “advanced” offering, and this shows the very best that NCAB can offer, but here the supply chain or sourcing options are limited and in some cases this means that only one plant is capable of this parameter.

When using combinations of these parameters, you should always consult your local NCAB technical contact person.


Feature
2023
Standard

Advanced
20242025
Materials
Please contact NCAB Group for full details regarding material availability.
RIGID:
FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance)
Hydrocarbon, High CTI (0), High thermal conductivity, PI
Including:
ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC,Meteorwave,Synamic

FLEX:
PI, PET, PSA,SUS,LPISM,Silver ink and Carbon ink ,Metal dome ,Underfill glue
Including:
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Thinflex, Hanwha, EMI film
Sputtered copper
Modified Polyimide
Silver ink and Carbon in

IMS:
Bergquist MP, HT & CML
ITEQ T-Lam, Laird TLAM SS
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.

Please contact NCAB Group for full details regarding material availability
RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2
Low – Loss material
N4000-13(series), FR408HR, Megtron-4, Megtron-4S, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed
Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, ASTRA, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD
Super Low – Loss material and High Thermal Reliability Laminate
TU993,M6N,M7N,

FLEX:
PI, LCP
Include: Dupont, Panasonic
Copper-nickel alloy, Conformal coating, Sputtered copper, Modified Polyimide, Silver ink and Carbon in

IMS:
IMS Al & Cu based
Include:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi

Please contact NCAB Group for full details regarding material availability
‘Advanced’ materials becoming more mainstream across the supply base. Non reinforced materials will increase in line with with UHDI emerging.‘Advanced’ materials becoming more mainstream across the supply base. Non reinforced materials will increase in line with with UHDI emerging.
Minimum dielectric thickness0.05mm for PCB
0.025mm for FPC
0.025mm for PCB
0.012mm for FPC
≤0.05mm for PCB
0.01mm for FPC
≤0.05mm for PCB
0.01mm for FPC
Layer count1 – 42L / 50L QTA64L (pilot runs)64L (pilot runs)64L (pilot runs)
HDI / Buried – blind viaY (2+n+2)Y (4+n+4 / ELIC)Y (U-HDI)Y (U-HDI)
Copper filled BVH (Y/N)YYYY
Copper filled PTH (Y/N)Y- copper pasteY – copper pasteYY
Copper paste filled PTH (Y/N)YYYY
Capped via (Y/N)YYYY
LDI (Y/N)YYYY
Maximum board size (mm)1180 X 6101400 X 6101400 X 6101400 X 610
Minimum board thickness (mm) 2L0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.08mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.08mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
Minimum board thickness (mm) ≥4L0.25mm for PCB
0.20 for FPC
0.25mm for PCB
0.16 for FPC
0.13 mm for PCB
0.13 for FPC
0.13 mm for PCB
0.13 for FPC
Maximum board thickness (mm)8.6mm10.0mm10.0mm10.0mm
Minimum track / gap IL (mil) – copper weight dependant0.06mm for PCB
0.025mm for FPC
0.030mm for PCB
0.025mm for FPC
0.025mm for PCB
0.020mm for FPC
0.015mm for PCB
0.015mm for FPC
Minimum track / gap OL (mil) – copper weight dependant0.075mm for PCB
0.04mm for FPC
0.050 mm for PCB
0.030 mm for FPC
0.025mm for PCB
0.020mm for FPC
0.015mm for PCB
0.015mm for FPC
Surface finishENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ENEPIGENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GFENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GFENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GF
Layer to layer registration0.05mm for PCB
0.02mm for FPC
0.025mm for PCB
0.02mm for FPC
0.025mm for PCB
0.02 for FCP
0.025mm for PCB
0.02 for FCP
Minimum hole (mech) (mm/mil)0.15mm0.1mm0.1mm0.1mm
Minimum hole (laser) (mm/mil)0.0750.050.040.04
Aspect ratio PTH30:135:135:135:1
Aspect ration BVH0.9:11.3:1 (factory + design dependant)1.3:1 (factory + design dependant)1.3:1 (factory + design dependant)
Finish hole tolerance (PTH)± 0.076mm± 0.05mm± 0.05mm± 0.03mm
Finish hole tolerance (NPTH)±0.0375±0.025±0.025±0.025
Maximum Cu weight OL12oz12oz12oz12oz
Maximum Cu weight IL12oz12oz12oz12oz
Controlled impedance (+/- X%)Others ± 10%± 5%± 5%± 5%
Rigid-flex (Y/N)YY including semi flexY including semi flexY including semi flex
Flexible (Y/N)YYYY
IMS (Y/N)Y (Al)Y (both Al and Cu)Y (both Al and Cu)Y (both Al and Cu)
Embedded components (Y/N)YYYY
Soldermask via plugging IPC4761 Type VI (Y/N)YYYY
Epoxy via plugging IPC4761 Type VI (Y/N)YYYY
Epoxy via plugging IPC4761 Type VII (Y/N)YYYY