The information below details some of the key capabilities that NCAB Group can offer and support today. You will find information here relating to the specific materials we can support, the PCB technologies or product types which we currently produce, as well as some of the tolerances which we can achieve.
The first category is what we call “standard” and means we can offer each individual parameters from multiple sources. The second is our “advanced” offering, and this shows the very best that NCAB can offer, but here the supply chain or sourcing options are limited and in some cases this means that only one plant is capable of this parameter.
This is the capability roadmap based on qualified capability per 1st January 2025 included planned and approved investments through 2025. More advanced capabilities are available on a lower qualification level as agreed between NCAB the factory and the customer.
If you have questions regarding this, you can always consult your local NCAB technical contact person.
| Feature | 2025 Standard | Advanced | 2026 |
| Materials | RIGID: FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance), Hydrocarbon, High CTI (0), High thermal conductivity, PI Including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave, Synamic FLEX: PI, PET, PSA, SUS, LPISM, Silver ink and Carbon ink, Metal dome, Underfill glue Including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Thinflex, Hanwha, EMI film Sputtered copper Modified Polyimide Silver ink and Carbon ink IMS: IMS Al based Including: Bergquist MP, HT & CML, ITEQ T-Lam, Laird TLAM SS, Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Please contact NCAB Group for full details regarding material availability | RIGID: Mid – Loss material TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2 Low – Loss material N4000-13 (series), FR408HR, Megtron-4, Megtron-4S, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20 (series), I-Speed, TU883, EM891, EM528 I-Tera, IT968, IT968G, S6GX, S6X, MW1000, NPG186, LW900G, DS-7409(V), H360, H360C, NY6300 (series) Ultra Low – Loss material Megtron-6, IT150DA, FX-2, FL-700, I-Tera, ASTRA, N6800-22 (series), RO4350B, RO3000 (series), RF-35, RF-35A2, TLX (series), AD250, FL-700LD, TU933, EM890K, Tachyon-100G, IT988GSE, S6N //S8N MW4000, LW990G DS-7409D(V)N HSD7/HSD7K NY-P2/NY-P3 Super Low – Loss material and High Thermal Reliability Laminate TU993,M6N,M7N,M7GN, Extremely Low Loss M8U/M8N TU943R EM892K/EM892K2 IT998 S9N/S9N2 MW8000 MCL-990GDZ DS-7409DJL2+ NY-P4 FLEX: PI, LCP, PCP/PIC Including: Dupont, Panasonic, Copper-nickel alloy, Conformal coating, Sputtered copper, Modified Polyimide, Silver ink and Carbon ink IMS: IMS Al & Cu based Include: Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi Please contact NCAB Group for full details regarding material availability | ‘Advanced’ materials becoming more mainstream across the supply base. Non reinforced materials will increase in line with with UHDI emerging. |
| Minimum dielectric thickness | 0.05mm for PCB 0.025mm for FPC | 0.025mm for PCB 0.012mm for FPC | ≤0.05mm for PCB 0.01mm for FPC |
| Layer count | 1 – 42L / 50L QTA/Backplane 68L | 64L (pilot runs)/Backplane 120L | 64L (pilot runs)/Backplane 68L |
| HDI / Buried – blind via | Y (6+N+6) | Y (8+N+8) | Y (7+N+7) |
| Copper filled BVH (Y/N) | Y | Y | Y |
| Copper filled PTH (Y/N) | Y- copper paste | Y- copper paste | Y |
| Copper paste filled PTH (Y/N) | Y | Y | Y |
| Capped via (Y/N) | Y | Y | Y |
| LDI (Y/N) | Y | Y | Y |
| Maximum board size (mm) | 1180 x 610 | 1400 x 610 | 1400 x 610 |
| Minimum board thickness (mm) 2L | 0.15mm for PCB 0.05mm for 1L FPC 0.06mm for 2L FPC | 0.12mm for PCB 0.05mm for 1L FPC 0.06mm for 2L FPC | 0.08mm for PCB 0.05mm for 1L FPC 0.06mm for 2L FPC |
| Minimum board thickness (mm) ≥ 4L | 0.20mm for PCB 0.13 for FPC | 0.20mm for PCB 0.13 for FPC | 0.13 mm for PCB 0.13 for FPC |
| Maximum board thickness (mm) | 8.6mm | 10.0mm | 10.0mm |
| Minimum track / gap IL (mil) – copper weight dependant | 0.05mm for PCB 0.025mm for FPC | 0.030mm for PCB 0.025mm for FPC | 0.025mm for PCB 0.020mm for FPC |
| Minimum track / gap OL (mil) – copper weight dependant | 0.05mm for PCB 0.04mm for FPC | 0.040 mm for PCB 0.030 mm for FPC | 0.025mm for PCB 0.020mm for FPC |
| Surface finish | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ENEPIG | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ ENEPIG / SPF | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ ENEPIG / SPF |
| Layer to layer registration | 0.05mm for PCB 0.02mm for FPC | 0.025mm for PCB 0.02mm for FPC | 0.025mm for PCB 0.02mm for FPC |
| Minimum hole (mech) (mm/mil) | 0.1mm | 0.075mm | 0.075mm |
| Minimum hole (laser) (mm/mil) | 0.05 | 0.05 | 0,035 |
| Aspect ratio PTH | 30:1 | 35:1 | 35:1 |
| Aspect ration BVH | 0.8:1 | 1.3:1 (factory + design dependant) | 1.3:1 (factory + design dependant) |
| Finish hole tolerance (PTH) | ± 0.076mm | ± 0.05mm | ± 0.05mm |
| Finish hole tolerance (NPTH) | ±0.0375 | ±0.025 | ±0.025 |
| Maximum Cu weight OL | 12oz | 12oz | 12oz |
| Maximum Cu weight IL | 12oz | 12oz | 12oz |
| Controlled impedance (+/- X%) | Others ± 10% | ± 5% | ± 5% |
| Rigid-flex (Y/N) | Y | Y including semi flex | Y including semi flex |
| Flexible (Y/N) | Y | Y | Y |
| IMS (Y/N) | Y (Al) | Y (both Al and Cu) | Y (both Al and Cu) |
| Embedded components (Y/N) | Y | Y | Y |
| Soldermask via plugging IPC4761 Type VI (Y/N) | Y | Y | Y |
| Epoxy via plugging IPC4761 Type VI (Y/N) | Y | Y | Y |
| Epoxy via plugging IPC4761 Type VII (Y/N) | Y | Y | Y |