Radio frequency (RF) PCBs - technical specification

Radio frequency (RF) and microwave (MW) circuits can be found in wireless products from handheld devices for medical and industrial applications to advanced communications systems for base stations, radar and global positioning.

NCAB works close with your product design team to insure that the project’s cost/performance targets can be met by providing information on material options, relative costs and DFM considerations.

Please contact your local NCAB Group company if you need further information or assistance, we are happy to help you.

Radio Frequency PCBs – Technical specification

DOWNLOAD SPECIFICATION (PDF)

Feature	NCAB´s technical specification
Number of layers	2-20 layers
Technology highlights	Controlled impedance, low loss materials, miniaturization
Materials	Low loss / low Dk, higher performance FR-4, PPO, Teflon, hydrocarbon / ceramic filled
Dielectric thickness	0.1mm – 3.0mm
Profile method	Routing, v-score
Copper weights (finished)	½ to 6 ounce
Minimum track and gaps	0.075mm / 0.075mm
Metal core thickness	0.4-2mm post bonded
Maxmimum dimensions	580mm x 1010mm
Surface finishes available	HASL (Lead-free), OSP, ENIG, Immersion tin, Immersion silver