RF – Radio frequency
PCBs
NCAB works close with your product design team to insure that the project’s cost/performance targets can be met by providing information on material options, relative costs and DFM considerations.
When producing radio frequency PCBs it is important to think about how to control the signals using (i) materials types and material characteristics (loss tangent / Df and dielectric constant / Dk) (ii) low profile copper foils (iii) weave styles and (iv) how we layout the copper circuitry, as all of these factories have a significant impact on the the performance of the finished product.
Please contact your local NCAB Group company if you need further information or assistance, we are happy to help you.
Radio Frequency PCB – Technical specification
| Feature | NCAB´s technical specification |
|---|---|
| Number of layers | 2-20 layers |
| Technology highlights | Controlled impedance, low loss materials, miniaturization |
| Materials | Low loss / low Dk, higher performance FR-4, PPO, Teflon, hydrocarbon / ceramic filled |
| Dielectric thickness | 0.1mm – 3.0mm |
| Profile method | Routing, v-score |
| Copper weights (finished) | ½ to 6 ounce |
| Minimum track and gaps | 0.075mm / 0.075mm |
| Metal core thickness | 0.4-2mm post bonded |
| Maxmimum dimensions | 580mm x 1010mm |
| Surface finishes available | HASL (Lead-free), OSP, ENIG, Immersion tin, Immersion silver |