Technical specification for Multilayer PCBs

Multilayer PCBs

The multilayer PCB segment is a big part of our production. In order to support this important segment, we have developed long-standing relationships with a broad factory base.

Please contact your local NCAB Group company if you need further information or assistance, we are happy to help you.

Multilayer PCBs – Technical specification

DOWNLOAD SPECIFICATION

Feature	NCAB´s technical specification
Number of layers	4 – 22 layers standard, 30 layers advanced, 40 layers prototype.
Technology highlights	Multiple layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses.
Materials	High performance FR4, halogen-free FR4, low loss and low Dk materials
Copper weights (finished)	18μm – 210μm, advanced 1050μm / 30oz
Minimum track and gap	0.075mm / 0.075mm
PCB thickness	0.40mm – 7.0mm
Maxmimum dimensions	580mm x 1080mm, advanced 610mm x 1400mm
Surface finishes available	HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
Minimum mechanical drill	0.20mm

Download our design guidelines for Multilayer PCBs

To prevent getting it wrong from the start, we have put together our design guidelines, to use as a checklist.

Design guidelines