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Multilayer PCBs – Technical specification
|Feature||NCAB´s technical specification|
|Number of layers||4 – 22 layers standard, 30 layers advanced, 40 layers prototype.|
|Technology highlights||Multilpe layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses.|
|Materials||High performance FR4, halogen-free FR4, low loss and low Dk materials|
|Copper weights (finished)||18μm – 210μm, advanced 1050μm / 30oz|
|Minimum track and gap||0.075mm / 0.075mm|
|PCB thickness||0.40mm – 7.0mm|
|Maxmimum dimensions||580mm x 1080mm, advanced 610mm x 1400mm|
|Surface finishes available||HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers|
|Minimum mechanical drill||0.20mm|
Download our design guidelines for Multilayer PCBs
To prevent getting it wrong from the start, we have put together our design guidelines, to use as a checklist.