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Mehrlagige Leiterplatten – Technische Spezifikation
| Feature | NCAB´s technical specification |
|---|---|
| Number of layers | 4 – 22 layers standard, 30 layers advanced, 40 layers prototype. |
| Technology highlights | Multiple layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses. |
| Materials | High performance FR4, halogen-free FR4, low loss and low Dk materials |
| Copper weights (finished) | 18μm – 210μm, advanced 1050μm / 30oz |
| Minimum track and gap | 0.075mm / 0.075mm |
| PCB thickness | 0.40mm – 7.0mm |
| Maxmimum dimensions | 580mm x 1080mm, advanced 610mm x 1400mm |
| Surface finishes available | HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers |
| Minimum mechanical drill | 0.20mm |