HDI – High Density Interconnect PCBs

NCAB has a long experience building HDI boards, with a factory base with a deep expertise producing HDI PCBs for different market applications.

These factories, combined with our worldwide technical organization, bring a comprehensive knowledge of the requirements and manufacturing methods required for successful HDI products.

Please contact your local NCAB Group company if you need further information or assistance, we are happy to help you.

HDI PCBs – Technical specification

FeatureNCAB´s technical specification
Number of layers4 – 22 layers standard, 30 layers advanced
Technology highlightsMultilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.
HDI builds1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D
MaterialsFR4 standard, FR4 high performance, Halogen free FR4, Rogers
Copper weights (finished)18μm – 70μm
Minimum track and gap0.075mm / 0.075mm
PCB thickness0.40mm – 3.20mm
Maxmimum dimensions610mm x 450mm; dependant upon laser drilling machine
Surface finishes availableOSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
Minimum mechanical drill0.15mm
Minimum laser drill 0.10mm standard, 0.075mm advanced

What is a HDI PCB?

IPC-2226 defines HDI as a printed circuit board with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces ≤ 100 µm / 0.10mm, smaller vias (<150 µm) and capture pads <400 µm / 0.40mm, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology.

IPC-2226 defines HDI as a printed circuit board with a higher wiring density per unit area than conventional printed circuit boards (PCB).

Download our design guidelines for HDI PCBs

To prevent getting it wrong from the start, we have put together our design guidelines, to use as a checklist.