These factories, combined with our worldwide technical organization, bring a comprehensive knowledge of the requirements and manufacturing methods required for successful HDI products.
Please contact your local NCAB Group company if you need further information or assistance, we are happy to help you.
HDI PCBs – Technical specification
|Feature||NCAB´s technical specification|
|Number of layers||4 – 22 layers standard, 30 layers advanced|
|Technology highlights||Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.|
|HDI builds||1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D|
|Materials||FR4 standard, FR4 high performance, Halogen free FR4, Rogers|
|Copper weights (finished)||18μm – 70μm|
|Minimum track and gap||0.075mm / 0.075mm|
|PCB thickness||0.40mm – 3.20mm|
|Maxmimum dimensions||610mm x 450mm; dependant upon laser drilling machine|
|Surface finishes available||OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers|
|Minimum mechanical drill||0.15mm|
|Minimum laser drill||0.10mm standard, 0.075mm advanced|