These factories, combined with our worldwide technical organization, bring a comprehensive knowledge of the requirements and manufacturing methods required for successful HDI products.
Please contact your local NCAB Group company if you need further information or assistance, we are happy to help you.
HDI PCBs – Technical specification
|Feature||NCAB´s technical specification|
|Number of layers||4 – 22 layers standard, 30 layers advanced|
|Technology highlights||Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.|
|HDI builds||1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D|
|Materials||FR4 standard, FR4 high performance, Halogen free FR4, Rogers|
|Copper weights (finished)||18μm – 70μm|
|Minimum track and gap||0.075mm / 0.075mm|
|PCB thickness||0.40mm – 3.20mm|
|Maxmimum dimensions||610mm x 450mm; dependant upon laser drilling machine|
|Surface finishes available||OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers|
|Minimum mechanical drill||0.15mm|
|Minimum laser drill||0.10mm standard, 0.075mm advanced|
What is a HDI PCB?
IPC-2226 defines HDI as a printed circuit board with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces ≤ 100 µm / 0.10mm, smaller vias (<150 µm) and capture pads <400 µm / 0.40mm, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology.
Download our design guidelines for HDI PCBs
To prevent getting it wrong from the start, we have put together our design guidelines, to use as a checklist.