Rigid flex PCBs - technical specification

Rigid-Flex PCBs

Rigid-flex is a complicated product that demands a lot of interaction between our and your technicians. Like other complex products, early discussions between NCAB and the designer is necessary to optimize the design for manufacturability and to optimize costs. We support rigid-flex pcbs both locally in Europe and US as well as offshore for higher volume requirements.

Available structures for rigid flex PCBs
There are numerous, different structures available. The more common ones are defined below:

Traditional rigid flex construction (IPC-6013 type 4) Multilayer rigid and flexible circuit combination containing three or more layers with plated through holes. Capability is 22L with 10L flex layers.
Asymmetrical rigid flex construction, where the FPC is situated on the outer layer of the rigid construction. Containing three or more layers with plated through holes.
Multilayer rigid flex construction with buried / blind via (microvia) as part of the rigid construction. 2 layers of microvia are achievable. Construction may also include two rigid structures as part of a homogeneous build. Capability is 2+n+2 HDI structure.

In our FAQ about PCBs you can read more about the structures and see their technical illustrations.

Please contact your local NCAB Group company if you need further information or assistance, we are happy to help you.

Rigid-Flex PCB – Technical specification

DOWNLOAD SPECIFICATION (PDF)

Feature	NCAB´s technical specification
Number of layers	4-16 layers
Technology highlights	Mixed materials including RF and high speed, standard FR-4, polyimide flex. Adhesiveless or adhesive based polyimide flex constructions, with cover coat or flexible solder mask materials.
Bending performance	Based on the specific design, the bend performance can range from a basic 90 °bend to fit to a full dynamic flex with 360° range of motion in the flex tail that will withstand continuous cycles throughout the product life.
Bend features	Bend radius controls the flexibility of the flex portion of the board. The thinner the material the lower the bend radius and the more flexible the flex section.
Materials	RA copper, HTE copper, FR-4, polyimide, adhesive
Copper weights (finished)	½ ounce, 1 ounce, 2 ounce, 3 ounce
Minimum track and gap	0.075mm / 0.075mm
PCB thickness	0.4mm to 3mm
PCB thickness in flex section	0.05mm to 0.8mm
Maxmimum dimensions	457mm to 610mm
Surface finishes available	ENIG, OSP Immersion tin, Immersion silver
Minimum mechanical drill	0.20mm

Download our design guidelines

To prevent getting it wrong from the start, we have put together our design guidelines, to use as a checklist.

Design guidelines