NCAB GROUP

Obwody drukowane półelastyczne (semi-flex)

Półelastyczne (semi-flex) obwody drukowane wykorzystują zaawansowane materiały FR-4 i specyficzną metodę produkcji, aby stworzyć produkty elastyczne gotowe do instalacji zapewniające opłacalne rozwiązania dla określonych zastosowań.

6L Semi-Flex – general description: 3 layer flex PCB; technical specification: IPC-4101C Slash Sheet 99; materials: EMC-EM-825; surface treatment: Immersion ENIG; board thickness: 1.5 mm +/0.2mm; application: automotive/industrial

6L Semi-Flex – general description: 3 layer flex PCB; technical specification: IPC-4101C Slash Sheet 99; materials: EMC-EM-825; surface treatment: Immersion ENIG; board thickness: 1.5 mm +/0.2mm; application: automotive/industrial

Semi-Flex PCBs – Technical specification

DOWNLOAD SPECIFICATION (PDF) »

Feature NCAB´s technical specifcation
Number of layers 1 – 12 layers, with 1 – 2 conductive layers in bending area.
Technology highlights The process uses controlled depth routing of the FR-4 to achieve a flexible / bending section within a traditionally rigid FR-4. Only suitable for static operations – bends typically just for installation. A lower cost solution for some very specific “flex-to-fit”applications.
Bending performance 50 x bend cycles of 0° – 90° – 0°
Bend features 5mm radius / max bending angle 90°
Materials Specialized FR-4 for static flex applications
Copper weights (finished) 35μm
Minimum track and gap 0.075mm / 0.075mm
PCB thickness 1.00mm – 2.00mm
PCB thickness in flex section 0.25mm ± 0.05mm
Maxmimum dimensions 538mm x 610mm
Surface finishes available HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
Minimum mechanical drill 0.20mm