厚铜板

厚铜板是我们生产中不断增长的重要市场。为支持这一重要市场，我们正在与多家一流PCB工厂建立长期合作关系，这些工厂均经过我们供应链管理流程的严格筛选。

由两层或多层导电铜箔制成的PCB，其导电铜层厚度显著大于常规标准。厚铜板可承载更大的电流，适用于大功率设备，如充电桩、电源板、储能系统等。同时，厚铜也提供了更快的导热性，减少热阻，可降低元器件的工作温度，提高产品可靠性。

如果您需要进一步的信息或协助，请联系当地的NCAB团队，我们很乐意为您提供支持。

Feature	NCAB´s technical specification
Number of layers	4 – 22 layers standard, 30 layers advanced, 40 layers prototype, much depending on copper thickness.
Technology highlights	Multiple layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses.
Materials	High performance FR4, halogen-free FR4
Copper weights (finished)	18-210µm, advanced 1050µm / 30 Oz
Minimum track and gap	0,075mm / 0,075mm (very much depending on copper thickness)
PCB thickness	0.40mm – 7.0mm, Min thickness depending on number of layers and copper thickness
Maxmimum dimensions	580mm x 1080mm, advanced 610mm x 1400mm
Surface finishes available	HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers (HASL / LF HASL not recommended)
Minimum mechanical drill	0.20mm

为了防止设计失误，我们整理了所有的设计指南，作为您的PCB设计检查清单。