制程能力发展路线

以下信息详细介绍了NCAB目前具备的一些主要制程能力 –您将在这里找到以下相关内容:特定原材料、PCB技术或各种类型的PCB,以及我们所能达到的公差。

我们的专业能力体现在以下两类产品,第一类是标准产品,通过我们的主要或核心工厂即能轻松制造。第二类是具有非常特殊工艺的产品,NCAB也能在少数的工厂中制造出最佳产品。

当使用这些参数组合时,NCAB当地的技术人员能够为您提供帮助

201920202021
FeatureStandardAdvancedStandardAdvancedStandardAdvanced
Materials

Please contact NCAB Group for full details regarding material availability.
RIGID:
FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance) including:
ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave, Ventec, Isola, Nelco, Rogers, Taconic, Panasonic

FLEX:
PI, PET including:
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Hanwha, SF305

IMS:
IMS Al based including: Bergquist MP, HT & CML ITEQ T-Lam, Laird TLAM SSTaiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.
RIGID:
Mid-Loss material:
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2

Low-loss material:
N4000-13(series), FR408HR, Megtron-4, Megtron-4S, S7038, S7439, S7439C, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed,IT968

Ultra-Low loss material:
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series), RF-35, RF-35A2, TLX (series), AD250, FL-700LD

Super Low – Loss material and High Thermal Reliability Laminate: TU993,M6N,M7N, IT988GSE

FLEX:
PI, LCP including Dupont

IMS:
IMS Al & Cu based including: Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi
RIGID:
FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance) including:
ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave, Ventec, Isola, Nelco, Rogers, Taconic, Panasonic, Hitachi

FLEX:

PI, PET including:
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Hanwha, SF305

IMS:
IMS Al & Cu based including:
Bergquist MP, HT & CML ITEQ T-Lam, Laird TLAM SS
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.
RIGID:
Mid-Loss material:
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2

Low-low loss material: N4000-13(series), FR408HR, Megtron-4, Megtron-4S, S7038, S7439, S7439C, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed,IT968

Ultra Low-Loss material: Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD,

Super Low – Loss material and High Thermal Reliability Laminate:
TU993,M6N,M7N, IT988GSE

FLEX:
PI, LCP including: Dupont

IMS:
IMS Al & Cu based including:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi
RIGID:
FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance) including:
ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave, Ventec, Isola, Nelco, Rogers, Taconic, Panasonic, Hitachi

FLEX:
PI, PET including:
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Hanwha, SF305

IMS:
IMS Al & Cu based including: Bergquist MP, HT & CML, ITEQ T-Lam, Laird TLAM SSTaiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.
RIGID:
Mid-Loss material:
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2

Low-Low loss material: N4000-13(series), FR408HR, Megtron-4, Megtron-4S, S7038, S7439, S7439C, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed,IT968

Ultra-Low Loss material: Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD,

Super Low – Loss material and High Thermal Reliability Laminate:
TU993,M6N,M7N, IT988GSE

FLEX:
PI, LCP including: Dupont

IMS:
IMS Al & Cu based including:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi
Minimum dielectric thickness0.05mm for PCB
0.025mm for FPC
0.025mm for PCB
0.012mm for FPC
0.05mm for PCB
0.025mm for FPC
0.025mm for PCB
0.012mm for FPC
0.05mm for PCB
0.025mm for FPC
0.025mm for PCB
0.012mm for FPC
Layer count1 – 38L / 40L QTA68L (pilot runs)1 – 38L / 40L QTA100L (pilot runs)1 – 38L / 40L QTA120L (pilot runs)
HDI / Buried – blind viaYYYYYY
Copper filled BVH (Y/N)YYYYYY
Copper filled PTH (Y/N)YY – copper pasteYY – copper pasteY Y – copper paste
Copper paste filled PTH (Y/N)YYYYYY
Capped via (Y/N)YYYYYY
LDI (Y/N)YYYYYY
Maximum board size (mm)1050 x 6101400 X 6101050 x 6101400 X 6101050 x 6101400 X 610
Minimum board thickness
2L (mm)
0.15 for PCB
0.05 for 1L FPC
0.12 for 2L FPC
0.15 for PCB
0.05 for 1L FPC
0.12 for 2L FPC
0.15 for PCB
0.05 for 1L FPC
0.12 for 2L FPC
0.15 for PCB
0.05 for 1L FPC
0.12 for 2L FPC
0.15 for PCB
0.05 for 1L FPC
0.12 for 2L FPC
0.15 for PCB
0.05 for 1L FPC
0.12 for 2L FPC
Minimum board thickness
>=4L (mm)
0.25 for PCB
0.20 for FPC
0.25 for PCB
0.16 for FPC
0.25 for PCB
0.20 for FPC
0.25 for PCB
0.16 for FPC
0.25 for PCB
0.20 for FPC
0.25 for PCB
0.16 for FPC
Maximum board thickness (mm)
8.610.08.610.08.614.0
Minimum track / gap IL (mil)- copper weight dependant0.075mm0.05mm0.075mm0.05mm0.075mm0.05mm
Minimum track / gap OL (mil)- copper weight dependant0.075mm0.05mm0.075mm0.05mm0.075mm0.05mm
Minimum pitch of laser0.50mm0.35mm0.50mm0.35mm0.50mm0.30mm
Surface finishENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG+GF/ Isn+GF /ENEPIG / selective hard gold / Selective soft gold / flash goldENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GFENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG+GF/ Isn+GF /ENEPIG /selective hard gold / Selective soft gold / flash goldENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF /EPAG / ISIGENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG+GF/ Isn+GF /ENEPIG /selective hard gold / Selective soft gold / flash goldENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF /EPAG / ISIG
Minimum bonding pad size / gap125/125μm65/65μm125/125μm56/56μm125/125μm56/56μm
Layer to layer registration0.05mm25μm0.05mm25μm0.05mm25μm
Minimum hole (mech) (mm/mil)0.15mm0.10mm0.15mm0.10mm0.15mm0.10mm
Minimum hole (laser) (mm/mil)0.075mm0.05mm0.075mm0.05mm0.075mm0.05mm
Aspect ratio PTH20:122:120:125:120:127:1
Aspect ration BVH0.8:11.3:1 (factory + design dependant)0.8:11.3:1 (factory + design dependant)0.8:11.3:1 (factory + design dependant)
Finish hole tolerance (PTH)± 0.076mm± 0.05mm± 0.076mm± 0.04mm± 0.076mm± 0.04mm
Finish hole tolerance (NPTH)± 0.0375± 0.025± 0.0375± 0.025± 0.0375± 0.025
Maximum Cu weight OL12 oz30 oz12 oz30 oz12 oz30 oz
Maximum Cu weight IL12 oz30 oz12 oz30 oz12 oz30 oz
Controlled impedance (+/- X%)Others ± 10%± 5%Others ± 10%± 5%Others ± 10%± 5%
Minimum Solder mask clearance0.075mm0.025mm0.075mm0.025mm0.075mm0.025mm
Minimum Solder mask dam0.10mm0.05mm0.10mm0.05mm0.10mm0.05mm
Rigid-flex (Y/N)YY including semi flexYY including semi flexY Y including semi flex
Flexible (Y/N)YYYYYY
IMS (Y/N)Y (Al)Y (both Al and Cu)Y (Al)Y (both Al and Cu)Y (Al)Y (both Al and Cu)
Embedded components (Y/N)YYYYYY
Soldermask via plugging IPC4761 Type VI (Y/N)
YYYYYY
Epoxy via plugging IPC4761 Type VI (Y/N)YYYYYY
Epoxy via plugging IPC4761 Type VII (Y/N)YYYYYY
Copper paste via plugging IPC4761 Type VI (Y/N)YYYYYY
Silver paste via plugging IPC4761 Type VI (Y/N)YYYYYY
IC substrateNNNYNY