制程能力发展路线

以下信息详细介绍了NCAB目前具备的一些主要制程能力 –您将在这里找到以下相关内容:特定原材料、PCB技术或各种类型的PCB,以及我们所能达到的公差。

我们的专业能力体现在以下两类产品,第一类是标准产品,通过我们的主要或核心工厂即能轻松制造。第二类是具有非常特殊工艺的产品,NCAB也能在少数的工厂中制造出最佳产品。

当使用这些参数组合时,NCAB当地的技术人员能够为您提供帮助


Feature
2021
Standard

Advanced
20222023
Materials
Please contact NCAB Group for full details regarding material availability.
RIGID:
FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance)
Hydrocarbon including:
ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave, Synamic, HTE

FLEX:
PI, PET, PSA,SUS,LPISM,Silver ink and Carbon ink Metal dome, Underfill glue
Include:Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Thinflex, Hanwha, EMI film

IMS:
IMS Al based
Include: Bergquist MP, HT & CML
ITEQ T-Lam, Laird TLAM SS
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.
RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2
Low – Loss material
N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed, NPG-170D
Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD, TU-883 & TU-883 Sp, NPG-186
Super Low – Loss material and High Thermal Reliability Laminate
TU993,M6N,M7N, EM-890K, RO4003C, Tachyon100G, Astra MT77, EM-528K, RT5000(series), RT6000(series), TMM(series)

FLEX:
PI, LCP
Include: Dupont, Copper-nickel alloy, Conformal coating

IMS:
IMS Al & Cu based
Include: Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi
‘Advanced’ materials becoming more mainstream across the supply base.‘Advanced’ materials becoming more mainstream across the supply base.
Minimum dielectric thickness0.05mm for PCB
0.025mm for FPC
0.025mm for PCB
0.012mm for FPC
≤0.05mm for PCB
0.01mm for FPC
≤0.05mm for PCB
0.01mm for FPC
Layer count1 – 38L / 56L QTA64L (pilot runs)64L (pilot runs)70L (pilot runs)
HDI / Buried – blind viaYYYY
Copper filled BVH (Y/N)YYYY
Copper filled PTH (Y/N)YY – copper pasteY – copper pasteY – copper paste
Copper paste filled PTH (Y/N)YYYY
Capped via (Y/N)YYYY
LDI (Y/N)YYYY
Maximum board size (mm)1050 X 6101400 X 6101400 X 6101400 X 610
Minimum board thickness (mm) 2L0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
Minimum board thickness (mm) ≥4L0.25mm for PCB
0.20 for FPC
0.25mm for PCB
0.16 for FPC
0.25mm for PCB
0.16 for FPC
0.25mm for PCB
0.15 for FPC
Maximum board thickness (mm)8.6mm10.0mm10.0mm10.0mm
Minimum track / gap IL (mil) – copper weight dependant0.075mm0.05mm0.05mm0.05mm
Minimum track / gap OL (mil) – copper weight dependant0.075mm0.05mm0.05mm0.05mm
Surface finishENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ENEPIGENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GFENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GFENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GF
Layer to layer registration0.05mm25μm25μm20μm
Minimum hole (mech) (mm/mil)0.15mm0.1mm0.1mm0.1mm
Minimum hole (laser) (mm/mil)0.0750,050,050,05
Aspect ratio PTH18:125:128:130:1
Aspect ration BVH0.8:11.3:1 (factory + design dependant)1.3:1 (factory + design dependant)1.3:1 (factory + design dependant)
Finish hole tolerance (PTH)± 0.076mm± 0.05mm± 0.05mm± 0.03mm
Finish hole tolerance (NPTH)±0.0375±0.025±0.025±0.025
Maximum Cu weight OL12oz12oz12oz12oz
Maximum Cu weight IL12oz12oz12oz12oz
Controlled impedance (+/- X%)Others ± 10%± 5%± 5%± 5%
Rigid-flex (Y/N)YY including semi flexY including semi flexY including semi flex
Flexible (Y/N)YYYY
IMS (Y/N)Y (Al)Y (both Al and Cu)Y (both Al and Cu)Y (both Al and Cu)
Embedded components (Y/N)YYYY
Soldermask via plugging IPC4761 Type VI (Y/N)YYYY
Epoxy via plugging IPC4761 Type VI (Y/N)YYYY
Epoxy via plugging IPC4761 Type VII (Y/N)YYYY