制程能力发展路线

以下信息详细介绍了NCAB目前具备的一些主要制程能力 –您将在这里找到以下相关内容:特定原材料、PCB技术或各种类型的PCB,以及我们所能达到的公差。

我们的专业能力体现在以下两类产品,第一类是标准产品,通过我们的主要或核心工厂即能轻松制造。第二类是具有非常特殊工艺的产品,NCAB也能在少数的工厂中制造出最佳产品。

当使用这些参数组合时,NCAB当地的技术人员能够为您提供帮助

Feature2025
Standard

Advanced
2026
MaterialsRIGID:

FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance), Hydrocarbon, High CTI (0), High thermal conductivity, PI
Including:
ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave, Synamic

FLEX:
PI, PET, PSA, SUS, LPISM, Silver ink and Carbon ink, Metal dome, Underfill glue
Including:
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Thinflex, Hanwha, EMI film
Sputtered copper
Modified Polyimide
Silver ink and Carbon ink

IMS:
IMS Al based
Including: Bergquist MP, HT & CML, ITEQ T-Lam, Laird TLAM SS, Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.

Please contact NCAB Group for full details regarding material availability
RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2

Low – Loss material
N4000-13 (series), FR408HR, Megtron-4, Megtron-4S, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20 (series), I-Speed, TU883, EM891, EM528 I-Tera, IT968, IT968G, S6GX, S6X, MW1000, NPG186, LW900G, DS-7409(V), H360, H360C, NY6300 (series)

Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, ASTRA, N6800-22 (series), RO4350B, RO3000 (series), RF-35, RF-35A2, TLX (series), AD250, FL-700LD, TU933, EM890K, Tachyon-100G, IT988GSE, S6N //S8N MW4000, LW990G DS-7409D(V)N HSD7/HSD7K NY-P2/NY-P3

Super Low – Loss material and High Thermal Reliability Laminate
TU993,M6N,M7N,M7GN,

Extremely Low Loss
M8U/M8N TU943R EM892K/EM892K2 IT998 S9N/S9N2 MW8000 MCL-990GDZ DS-7409DJL2+ NY-P4

FLEX:
PI, LCP, PCP/PIC
Including: Dupont, Panasonic, Copper-nickel alloy,
Conformal coating, Sputtered copper, Modified Polyimide, Silver ink and Carbon ink

IMS:
IMS Al & Cu based
Include:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi

Please contact NCAB Group for full details regarding material availability
‘Advanced’ materials becoming more mainstream across the supply base. Non reinforced materials will increase in line with with UHDI emerging.
Minimum dielectric thickness0.05mm for PCB
0.025mm for FPC 
0.025mm for PCB
0.012mm for FPC 
≤0.05mm for PCB
0.01mm for FPC 
Layer count1 – 42L / 50L QTA/Backplane 68L64L (pilot runs)/Backplane 120L64L (pilot runs)/Backplane 68L
HDI / Buried – blind viaY (6+N+6)Y (8+N+8)Y (7+N+7)
Copper filled BVH (Y/N)YYY
Copper filled PTH (Y/N)Y- copper pasteY- copper pasteY
Copper paste filled PTH (Y/N)YYY
Capped via (Y/N)YYY
LDI (Y/N)YYY
Maximum board size (mm)1180 x 6101400 x 6101400 x 610
Minimum board thickness (mm) 2L0.15mm for PCB
0.05mm for 1L FPC
0.06mm for 2L FPC
0.12mm for PCB
0.05mm for 1L FPC
0.06mm for 2L FPC
0.08mm for PCB
0.05mm for 1L FPC
0.06mm for 2L FPC
Minimum board thickness (mm) ≥ 4L0.20mm for PCB
0.13 for FPC
0.20mm for PCB
0.13 for FPC
0.13 mm for PCB
0.13 for FPC
Maximum board thickness (mm)8.6mm10.0mm10.0mm
Minimum track / gap IL (mil) – copper weight dependant0.05mm for PCB
0.025mm for FPC
0.030mm for PCB
0.025mm for FPC
0.025mm for PCB
0.020mm for FPC
Minimum track / gap OL (mil) – copper weight dependant0.05mm for PCB
0.04mm for FPC
0.040 mm for PCB
0.030 mm for FPC
0.025mm for PCB
0.020mm for FPC
Surface finishENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ENEPIGENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ ENEPIG / SPFENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ ENEPIG / SPF
Layer to layer registration0.05mm for PCB
0.02mm for FPC
0.025mm for PCB
0.02mm for FPC
0.025mm for PCB
0.02mm for FPC
Minimum hole (mech) (mm/mil)0.1mm0.075mm0.075mm
Minimum hole (laser) (mm/mil)0.050.050,035
Aspect ratio PTH30:135:135:1
Aspect ration BVH0.8:11.3:1 (factory + design dependant) 1.3:1 (factory + design dependant) 
Finish hole tolerance (PTH)± 0.076mm± 0.05mm± 0.05mm
Finish hole tolerance (NPTH)±0.0375±0.025±0.025
Maximum Cu weight OL12oz12oz12oz
Maximum Cu weight IL12oz12oz12oz
Controlled impedance (+/- X%)Others ± 10%± 5%± 5%
Rigid-flex (Y/N)YY including semi flexY including semi flex
Flexible (Y/N)YYY
IMS (Y/N)Y (Al)Y (both Al and Cu)Y (both Al and Cu)
Embedded components (Y/N)YYY
Soldermask via plugging IPC4761 Type VI (Y/N)YYY
Epoxy via plugging IPC4761 Type VI (Y/N)YYY
Epoxy via plugging IPC4761 Type VII (Y/N)YYY