我们的专业能力体现在以下两类产品，第一类是标准产品，通过我们的主要或核心工厂即能轻松制造。第二类是具有非常特殊工艺的产品，NCAB也能在少数的工厂中制造出最佳产品。
当使用这些参数组合时，NCAB当地的技术人员能够为您提供帮助。
Feature | 2023 Standard | Advanced | 2024 | 2025 |
| Materials Please contact NCAB Group for full details regarding material availability. | RIGID: FR2, CEM-1, CEM-3, FR4 (standard – halogen free – high performance) Hydrocarbon, High CTI (0), High thermal conductivity, PI Including: ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC,Meteorwave,Synamic FLEX: PI, PET, PSA,SUS,LPISM,Silver ink and Carbon ink ,Metal dome ,Underfill glue Including: Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Thinflex, Hanwha, EMI film Sputtered copper Modified Polyimide Silver ink and Carbon in IMS: Bergquist MP, HT & CML ITEQ T-Lam, Laird TLAM SS Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Please contact NCAB Group for full details regarding material availability | RIGID: Mid – Loss material TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2 Low – Loss material N4000-13(series), FR408HR, Megtron-4, Megtron-4S, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed Ultra Low – Loss material Megtron-6, IT150DA, FX-2, FL-700, I-Tera, ASTRA, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD Super Low – Loss material and High Thermal Reliability Laminate TU993,M6N,M7N, FLEX: PI, LCP Include: Dupont, Panasonic Copper-nickel alloy, Conformal coating, Sputtered copper, Modified Polyimide, Silver ink and Carbon in IMS: IMS Al & Cu based Include: Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi Please contact NCAB Group for full details regarding material availability | ‘Advanced’ materials becoming more mainstream across the supply base. Non reinforced materials will increase in line with with UHDI emerging. | ‘Advanced’ materials becoming more mainstream across the supply base. Non reinforced materials will increase in line with with UHDI emerging. |
| Minimum dielectric thickness | 0.05mm for PCB 0.025mm for FPC | 0.025mm for PCB 0.012mm for FPC | ≤0.05mm for PCB 0.01mm for FPC | ≤0.05mm for PCB 0.01mm for FPC |
| Layer count | 1 – 42L / 50L QTA | 64L (pilot runs) | 64L (pilot runs) | 64L (pilot runs) |
| HDI / Buried – blind via | Y (2+n+2) | Y (4+n+4 / ELIC) | Y (U-HDI) | Y (U-HDI) |
| Copper filled BVH (Y/N) | Y | Y | Y | Y |
| Copper filled PTH (Y/N) | Y- copper paste | Y – copper paste | Y | Y |
| Copper paste filled PTH (Y/N) | Y | Y | Y | Y |
| Capped via (Y/N) | Y | Y | Y | Y |
| LDI (Y/N) | Y | Y | Y | Y |
| Maximum board size (mm) | 1180 X 610 | 1400 X 610 | 1400 X 610 | 1400 X 610 |
| Minimum board thickness (mm) 2L | 0.15mm for PCB 0.05mm for 1L FPC 0.12mm for 2L FPC | 0.15mm for PCB 0.05mm for 1L FPC 0.12mm for 2L FPC | 0.08mm for PCB 0.05mm for 1L FPC 0.12mm for 2L FPC | 0.08mm for PCB 0.05mm for 1L FPC 0.12mm for 2L FPC |
| Minimum board thickness (mm) ≥4L | 0.25mm for PCB 0.20 for FPC | 0.25mm for PCB 0.16 for FPC | 0.13 mm for PCB 0.13 for FPC | 0.13 mm for PCB 0.13 for FPC |
| Maximum board thickness (mm) | 8.6mm | 10.0mm | 10.0mm | 10.0mm |
| Minimum track / gap IL (mil) – copper weight dependant | 0.06mm for PCB 0.025mm for FPC | 0.030mm for PCB 0.025mm for FPC | 0.025mm for PCB 0.020mm for FPC | 0.015mm for PCB 0.015mm for FPC |
| Minimum track / gap OL (mil) – copper weight dependant | 0.075mm for PCB 0.04mm for FPC | 0.050 mm for PCB 0.030 mm for FPC | 0.025mm for PCB 0.020mm for FPC | 0.015mm for PCB 0.015mm for FPC |
| Surface finish | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ENEPIG | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GF | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GF | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF//IAG+GF/Isn+GF |
| Layer to layer registration | 0.05mm for PCB 0.02mm for FPC | 0.025mm for PCB 0.02mm for FPC | 0.025mm for PCB 0.02 for FCP | 0.025mm for PCB 0.02 for FCP |
| Minimum hole (mech) (mm/mil) | 0.15mm | 0.1mm | 0.1mm | 0.1mm |
| Minimum hole (laser) (mm/mil) | 0.075 | 0.05 | 0.04 | 0.04 |
| Aspect ratio PTH | 30:1 | 35:1 | 35:1 | 35:1 |
| Aspect ration BVH | 0.9:1 | 1.3:1 (factory + design dependant) | 1.3:1 (factory + design dependant) | 1.3:1 (factory + design dependant) |
| Finish hole tolerance (PTH) | ± 0.076mm | ± 0.05mm | ± 0.05mm | ± 0.03mm |
| Finish hole tolerance (NPTH) | ±0.0375 | ±0.025 | ±0.025 | ±0.025 |
| Maximum Cu weight OL | 12oz | 12oz | 12oz | 12oz |
| Maximum Cu weight IL | 12oz | 12oz | 12oz | 12oz |
| Controlled impedance (+/- X%) | Others ± 10% | ± 5% | ± 5% | ± 5% |
| Rigid-flex (Y/N) | Y | Y including semi flex | Y including semi flex | Y including semi flex |
| Flexible (Y/N) | Y | Y | Y | Y |
| IMS (Y/N) | Y (Al) | Y (both Al and Cu) | Y (both Al and Cu) | Y (both Al and Cu) |
| Embedded components (Y/N) | Y | Y | Y | Y |
| Soldermask via plugging IPC4761 Type VI (Y/N) | Y | Y | Y | Y |
| Epoxy via plugging IPC4761 Type VI (Y/N) | Y | Y | Y | Y |
| Epoxy via plugging IPC4761 Type VII (Y/N) | Y | Y | Y | Y |