半软板 (Semi Flex PCB)
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Semi-Flex PCBs – Technical specification
| Feature | NCAB´s technical specification |
| Number of layers | 1 – 12 layers, with 1 – 2 conductive layers in bending area. |
| Technology highlights | The process uses controlled depth routing of the FR-4 to achieve a flexible / bending section within a traditionally rigid FR-4. Only suitable for static operations – bends typically just for installation. A lower cost solution for some very specific “flex-to-fit”applications. |
| Bending performance | 50 x bend cycles of 0° – 90° – 0° |
| Bend features | 5mm radius / max bending angle 90° |
| Materials | Specialized FR-4 for static flex applications |
| Copper weights (finished) | 35μm |
| Minimum track and gap | 0.075mm / 0.075mm |
| PCB thickness | 1.00mm – 2.00mm |
| PCB thickness in flex section | 0.25mm ± 0.05mm |
| Maxmimum dimensions | 538mm x 610mm |
| Surface finishes available | HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers |
| Minimum mechanical drill | 0.20mm |
| Minimum laser drill | 0.10mm standard, 0.075mm advanced |
半柔和刚柔板的区别是什么？
半软板其实是使用特定类型FR4制造的“标准”多层PCB，FR4的厚度有特定容差，以便所产生的较薄区域提供传统刚性FR4的柔性/弯曲部分。半软板适合静态应用（软板部分用于组装）或用于弯曲很少的情况。
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