RF – 射频 PCB
NCAB 集团与产品设计团队合作,提供材料选择、相对成本和 DFM 考量等信息,以确保实现项目的成本/性能目标。一旦完成设计后,NCAB 集团将从制样到生产流程跟踪这些电路板,测量和控制诸如线宽和介电层间距等重要工艺参数,以确保产品符合设计要求和在其使用寿命期间提供一致的性能。
若您想了解更多信息或者需要帮助,请联系当地的NCAB公司,我们会竭诚为您提供帮助。
Radio Frequency PCBs – Technical specification
Feature | NCAB´s technical specification |
---|---|
Number of layers | 2-20 layers |
Technology highlights | Controlled impedance, low loss materials, miniaturization |
Materials | Low loss / low Dk, higher performance FR-4, PPO, Teflon, hydrocarbon / ceramic filled |
Dielectric thickness | 0.1mm – 3.0mm |
Profile method | Routing, v-score |
Copper weights (finished) | ½ to 6 ounce |
Minimum track and gaps | 0.075mm / 0.075mm |
Metal core thickness | 0.4-2mm post bonded |
Maxmimum dimensions | 580mm x 1010mm |
Surface finishes available | HASL (Lead-free), OSP, ENIG, Immersion tin, Immersion silver |
Minimum laser drill | 0.10mm standard, 0.075mm advanced |