刚-挠 结合PCB

PCB 产品种类

刚-挠 结合PCB

刚-挠结合电路板是一种复杂产品,要求 PCB 供应商与客户反复交流。同其他复杂产品一样,需要 NCAB 集团与设计师开展早期讨论,以优化可制造性的设计和成本。NCAB 集团既支持在欧洲和美国当地生产的刚-挠结合电路板,也支持离岸生产满足大批量需求。

若您想了解更多信息或者需要帮助,请联系当地的NCAB公司,我们会竭诚为您提供帮助。

Rigid-Flex PCBs – Technical specification

FeatureNCAB´s technical specification
Number of layers4-16 layers
Technology highlightsMixed materials including RF and high speed, standard FR-4, polyimide flex. Adhesiveless or adhesive based polyimide flex constructions, with cover coat or flexible solder mask materials.
Bending performanceBased on the specific design, the bend performance can range from a basic 90 °bend to fit to a full dynamic flex with 360° range of motion in the flex tail that will withstand continuous cycles throughout the product life.
Bend featuresBend radius controls the flexibility of the flex portion of the board. The thinner the material the lower the bend radius and the more flexible the flex section.
MaterialsRA copper, HTE copper, FR-4, polyimide, adhesive
Copper weights (finished)½ ounce, 1 ounce, 2 ounce, 3 ounce
Minimum track and gap0.075mm / 0.075mm
PCB thickness0.4mm to 3mm
PCB thickness in flex section0.05mm to 0.8mm
Maxmimum dimensions457mm to 610mm
Surface finishes availableENIG, OSP Immersion tin, Immersion silver
Minimum mechanical drill0.20mm

下载我们的设计指南

为防止一开始就做错,我们以核查表的形式制定了设计指南。