刚-挠结合PCB

刚-挠结合PCB

刚-挠结合电路板是一种复杂产品，要求 PCB 供应商与客户反复交流。同其他复杂产品一样，需要 NCAB 集团与设计师开展早期讨论，以优化可制造性的设计和成本。NCAB 集团既支持在欧洲和美国当地生产的刚-挠结合电路板，也支持离岸生产满足大批量需求。

若您想了解更多信息或者需要帮助，请联系当地的NCAB公司，我们会竭诚为您提供帮助。

Rigid-Flex PCBs – Technical specification

Feature	NCAB´s technical specification for Rigid flex PCBs
Number of layers	4-16 layers
Technology highlights	Mixed materials including RF and high speed, standard FR-4, polyimide flex. Adhesiveless or adhesive based polyimide flex constructions, with cover coat or flexible solder mask materials.
Bending performance	Based on the specific design, the bend performance can range from a basic 90 °bend to fit to a full dynamic flex with 360° range of motion in the flex tail that will withstand continuous cycles throughout the product life.
Bend features	Bend radius controls the flexibility of the flex portion of the board. The thinner the material the lower the bend radius and the more flexible the flex section.
Materials	RA copper, HTE copper, FR-4, polyimide, adhesive
Copper weights (finished)	½ ounce, 1 ounce, 2 ounce, 3 ounce
Minimum track and gap	0.075mm / 0.075mm
PCB thickness	0.4mm to 3mm
PCB thickness in flex section	0.05mm to 0.8mm
Maxmimum dimensions	457mm to 610mm
Surface finishes available	ENIG, OSP Immersion tin, Immersion silver
Minimum mechanical drill	0.20mm
Minimum laser drill	0.10mm standard, 0.075mm advanced

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为防止一开始就做错，我们以核查表的形式制定了设计指南。