软硬结合板/刚挠结合板
软硬结合板有哪些可用的结构?
软硬结合板有多种不同结构可供选择,以下是常见的几种:
传统软硬结合构造(IPC-6013 4型),包含有镀通孔的三层或多层软板。最高支持22L硬板带10L软板结构。
不对称软硬结合构造,包含有镀通孔的三层或多层软板,且软板位于硬板一侧。
多层软硬结合构造,埋孔/盲孔(微孔)作为硬板结构的一部分,支持两层微孔,可能可能还包含两个硬板结构作为同质结构的一部分。
在我们的常见问题解答中查看关于软硬结合板常见结构的更多信息。
如果您需要进一步的信息或协助,请联系当地的NCAB团队,我们很乐意为您提供支持。



Rigid-Flex PCBs – Technical specification
Feature | NCAB´s technical specification for Rigid flex PCBs |
Number of layers | 4-16 layers |
Technology highlights | Mixed materials including RF and high speed, standard FR-4, polyimide flex. Adhesiveless or adhesive based polyimide flex constructions, with cover coat or flexible solder mask materials. |
Bending performance | Based on the specific design, the bend performance can range from a basic 90 °bend to fit to a full dynamic flex with 360° range of motion in the flex tail that will withstand continuous cycles throughout the product life. |
Bend features | Bend radius controls the flexibility of the flex portion of the board. The thinner the material the lower the bend radius and the more flexible the flex section. |
Materials | RA copper, HTE copper, FR-4, polyimide, adhesive |
Copper weights (finished) | ½ ounce, 1 ounce, 2 ounce, 3 ounce |
Minimum track and gap | 0.075mm / 0.075mm |
PCB thickness | 0.4mm to 3mm |
PCB thickness in flex section | 0.05mm to 0.8mm |
Maxmimum dimensions | 457mm to 610mm |
Surface finishes available | ENIG, OSP Immersion tin, Immersion silver |
Minimum mechanical drill | 0.20mm |
Minimum laser drill | 0.10mm standard, 0.075mm advanced |

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