Rigid-Flex PCBs – Technical specification
|NCAB´s technical specification for Rigid flex PCBs
|Number of layers
|Mixed materials including RF and high speed, standard FR-4, polyimide flex. Adhesiveless or adhesive based polyimide flex constructions, with cover coat or flexible solder mask materials.
|Based on the specific design, the bend performance can range from a basic 90 °bend to fit to a full dynamic flex with 360° range of motion in the flex tail that will withstand continuous cycles throughout the product life.
|Bend radius controls the flexibility of the flex portion of the board. The thinner the material the lower the bend radius and the more flexible the flex section.
|RA copper, HTE copper, FR-4, polyimide, adhesive
|Copper weights (finished)
|½ ounce, 1 ounce, 2 ounce, 3 ounce
|Minimum track and gap
|0.075mm / 0.075mm
|0.4mm to 3mm
|PCB thickness in flex section
|0.05mm to 0.8mm
|457mm to 610mm
|Surface finishes available
|ENIG, OSP Immersion tin, Immersion silver
|Minimum mechanical drill
|Minimum laser drill
|0.10mm standard, 0.075mm advanced