On 24 September 2025, NCAB hosted the PCB Circularity & Life Cycle Assessment (LCA) conference in Stockholm. The event brought together industry leaders, technical experts, and sustainability professionals to explore the future of circularity in printed circuit boards (PCBs) and the development of robust LCA models.
Purpose and vision
The conference was designed as a starting point for a collaborative journey towards more sustainable PCB practices. With the electronics industry facing increasing demands for transparency, resource efficiency, and climate impact reduction, the event aimed to foster open dialogue, share best practices, and identify actionable next steps for circularity and life cycle assessment in the sector.
Speakers and participating companies
The agenda featured presentations and panel discussions from a diverse group of speakers representing leading organisations, including:
- Virenti & RISE explored the use of bio-based materials in printed circuit boards, highlighting opportunities for more sustainable sourcing.
- SYTECH presented innovations in degradable laminates and base materials with a lower carbon footprint.
- LiloTree shared advancements in sustainable and circular final finishes designed for next-generation electronic assemblies.
- Volvo Group discussed strategies for decarbonising the electronic supply chain and the specific challenges of PCBs in commercial vehicles.
- Trossa outlined the development of the NCAB/Trossa life cycle assessment (LCA) model.
- Danfoss examined approaches to recovering value at end-of-life through improved disassembly processes.
The attendee list included representatives from Ei Electronics, Halma, Stoneridge, ACTIA Group, Ericsson, Zaptec, Marshall, Getinge, ASSA ABLOY Global Solutions, and others, reflecting a broad cross-section of the electronics value chain.
Conference highlights
The day began with a welcome from NCAB, followed by a series of expert talks and a deep dive into LCA methodology and results. The afternoon featured a roundtable session, where participants discussed challenges and opportunities in design for sustainability, circularity at end-of-life, and supplier collaboration. Key questions included how to integrate sustainability into product development, overcome barriers to circular design, and communicate LCA findings to stakeholders.
Outcomes and next step
The conference concluded with a summary of insights and a call to action: to continue the dialogue, expand project groups on material testing and LCA modelling, and plan for a follow-up event in 2026. Attendees were invited to join collaborative initiatives focused on advancing circularity and improving environmental performance across the industry.
Looking ahead
As the electronics industry faces evolving regulatory requirements and customer expectations, the PCB Circularity & LCA Conference marks the beginning of a shared journey. By bringing together diverse perspectives and expertise, we – together with our partners – aim to drive meaningful progress towards a more sustainable and circular future for PCBs.