IMS – PCB con substrato metallico isolato
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IMS PCBs – Technical specification
Feature | NCAB´s technical specification |
Number of layers | 1 – 4 layers |
Technology highlights | Effective heat sink solutions for thermal applications. This construction type enables superior heat dissipation through use of either aluminium or copper substrate bonded to the insulated circuitry through thermal pre-preg or resin systems. |
Materials | Aluminium & copper plates. FR-4, PTFE, thermal dielectrics. |
Dielectric thickness | 0.05mm – 0.20mm |
Thermal conductivity | 1-12 W/m/K |
Profile method | Punching, Liquid cooled routing |
Copper weights (finished) | 35μm – 140μm |
Minimum track and gaps | 0.10mm / 0.10mm |
Metal core thickness | 0.40mm – 3.20mm |
Maxmimum dimensions | 550mm x 700mm |
Surface finishes available | HASL, LF HASL, OSP, ENIG, Imersion tin, Immsersion silver |
Minimum mechanical drill | 0.30mm |
Minimum laser drill | 0.10mm standard, 0.075mm advanced |