Unsere Fertigungskompetenz umfassen zwei Kategorien – die erste Kategorie ist unser so genannter Standard, eine Kategorie, die wir einfach über unsere Hauptfabriken fertigen lassen können. Die zweite Kategorie umfasst unser erweitertes (Advanced) Angebot. Dies stellt das beste Angebot von NCAB dar, jedoch können hier die Lieferketten- oder Beschaffungsmöglichkeiten auf eine geringe Zahl von Fabriken beschränkt sein.
Wenn Sie eine Kombination von Parametern verwenden, ist es unbedingt notwendig, Ihre lokalen technischen Ansprechpartner von NCAB zu kontaktieren.
Materials
We are proud to say we use globally recognized materials, but due to new technologies both in the PCB production and as required by our customers application development, we see the need of qualification of more sophisticated materials and new material development. For this we have a documented qualification procedure and can offer a range of qualified materials. All materials are additionally approved and qualified by our PSL (Preferred Supplier List) rated factories.
Within our approved materials list we find all types of materials technologies as listed below.
Standard materials
| Material Type | TG (Degr.C) | Standard Loss (Dk > 4,0 Df > 0,015 | Mid Dk/Loss (Dk 3.5~4.0 Df 0.010~0.015) | Low loss (Dk 3.4~3.8 Df 0.005~0.010) |
| FR-4 | Low TG, (130-140) | KB: KB-6160, KB-6160C (CTI600V), KB6164 SYST: S1141, S1600(CTI>=600) ITEQ: IT-140TC NANYA: NP-140, NY-1140 | ||
| Mid Tg (150-170) | KB: KB6165F SYST: S1000H, S1151G (CTI600V), IT-158TC, S1600L (CTI>=600 ) TUC: TU668 WAZAM: H150 (LF) EMC: EM825 ISOLA: IS400 Nanya: NP-155 NUYA: NY-1150 GW: GW1500 | |||
| High Tg (≥170) | KB: KB6167F, SYST: S1000-2M, IT: IT180, IT180ATC EMC: EM827 ISOLA: 370HR, 185HR Nanya: NP-170 NUYA: NY-2170 TUC: TU768 | Panasonic: Megtron-2, RF775/RF777 series, IF-2LD series, Shengyi SF, S7038, Synamic2, Taiflex 2UP, LCP, TK Nanya: NPG-171 Isola: IS415, FR-408 | AGC: N4000-13 (series), N4800-20 (series), MW1000, N6800-22 (series), MW4000, LW990G, LW900G, MW8000 ISOLA: FR408HR, I-Speed, I-Tera MT40, ASTRA Panasonic: Megtron-4, Megtron-4S, R1755V/M2/M4/M4S, Megtron-6 SYST: S7038, S7439, MM/M6/M6G/M6N/M7GE/M7N/M7GN/M8U/M8N, DS-7409DJL2+HSD8/S9NH/S9N2H/S9GN2H TUC: TU872SLK (series), TU883, TU768, TU862S, TU863+, TU883, TU933+(Z)/TU933+, TU943R, M8U/M8N TU943R, TU933, TU-943SN EMC: EM828, EM888, EM891, EM528, EM888S/EM526,EM891/EM528, EM890K, EM892K/EM892K2, EM828G, EM890K, EM892K/EM892K2 ITEQ: IT968, IT968G, IT150DA, IT998 S9N/S9N2 NANYA: NPG186 NUYA: NY6300 (series) NY-P2/NY-P3, NY-P4 /NY-P5 WAZAM: H360, H360C, MCL-990GDZ | |
| FR-4.1 (Low halogen) | Low TG, (130-140) | ITEQ: IT-140g | ||
| Mid Tg (150-170) | KB-6165G(Without UL), Nanya: NPG-151, NPG-170DR, NPG-170DTL, NPG-171, NPGN-150LKHD, NPG-150N,NPG-170NNPG-151S/NPG-B SYST: S1150G&S1151G, ITEQ: IT-258GAITC, IT-155G, TU862HF Panasonic: R-1566W EMC: EM285 | ITEQ: IT150G | ||
| High Tg (≥170) | EM-370, S1170G,IT-170G | TUC: TU862HF, EMC: EM370D, EM828G ITEQ: IT-170GRA1, NUYA: NY3170M, SYST: S7040G | ITEQ: IT-958G, S7439G, IT-170GRA2, IT-968G EMC: EM-526 EM-888/S/(S)(A),EM-888K EM-528 TUC: TU863+ ,TU-883 ,TU-883C NUYA: NY3170M2/LK NY6300SL NY6300S Nanya: NPG-170D SYST: S7439G S6GX |
Advanced materials
| Material Type | Material examples | Information |
| High Frequency Materials | Rogers: RO4350B (RO4000 series) & RO3000 (RO3000 series), AD250 (AD series), CLTE series, Cuclad series, Diclad series, RT-duroid series, TMM series, TC series. AGC: RF-35 (RF-35series), RF-60TC, RF-10, TLX (series), TLY(series), TSM-DS3 series,. etc, | Some high frequency materials include PFAS. NCAB has developed a replacement list with non PFAS materials based on key parameters. Some materials are single source. |
| IC Substrate Materials | MGC: HL832NX, HL832NS, HL832NS(LC),HL832NS(LCA). Hitachi MCL-E-679FGB(S). MCL-E-700G, MCL-E-705G. Panasonic R-1515E, R-G515. Doosan DS7409HGB, DS7409ZLE, DS7409HDB. SYC SI10U | Each material has unique properties for single or multiple bond cycles and signal integrity. Some builds and materials are single source. |
| Flexible Materials | Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan, Thinflex, Hanwha, EMI film | PI, PET, PSA, SUS, LPISM, Silver ink and Carbon ink, Metal dome, Underfill glue |
| IMS | Bergquist MP, HT & CML ITEQ T-Lam, Laird TLAM SS Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi | A variety of thicknesses, Thermal Conductivity range and different types of metal base such as Aluminium and Copper. |
Sophisticated materials
| Material Type | Very Low loss material (Dk 3.2~3.6 Df 0.003~0.005) | Ultra Low loss material (Dk 3.0~3.4 Df 0.002~0.003) | Extremely Low loss material (Df: <0.002) | |
| FR-4.0, FR-4.1, PPE etc. | Examples: | AGC MW1000 & MW2000 & MW3000, Megtron 6 & 6N& 6HF(R-537YE), EMC EM-891 & EM-528, SYL Synamic 6 & 6GX, Isola I-Tera MT40, ITEQ IT-968 (series), TUC TU-883, TU-883C, NanYa NPG-188H, NPG-186, Doosan DS7409DV, Hitachi LW900G, etc. | AGC MW4000, Panasonic M7N(R-578YN) & M7GE(R-578YGE) & M7GN(R-578YGN), SYL: S6N, S8, S8GN, TUC: TU- 933E, TU-933V, TU-883ASP, EMC: EM-890K, EM-890, EM-891K, ITEQ: IT-988GSE, IT-988G, Isola: Tachyon-100G, Doosan: DS7409DVN, Hitachi: LW910G, LW990G, etc. | Panasonic: M8N(R-579Y(N)), M8U(R-579Y (U)) EMC: EM-892K, EM-892K2, ITEQ IT-998, IT-998SE Doosan: DS7409 DJL2+ TUC: TU-943SR, TU-943SN AGC: MW8000, MW ELL 101, ELL 102. |
Technical capability parameters
Feature | 2025 Standard | Advanced |
| Minimum dielectric thickness | 0.05mm for PCB 0.025mm for FPC | 0.025mm for PCB 0.012mm for FPC |
| Layer count | 1 – 42L / 50L QTA/Backplane 68L | Layer count 1 – 42L / 50L QTA/Backplane 68L 64L (pilot runs)/Backplane 120L |
| HDI/Buried – blind via | Y (6+N+6) | Y (8+N+8) |
| Copper filled BVH (Y/N) | Y | Y |
| Copper filled PTH (Y/N) | Y-copper paste | Y-copper paste |
| Copper paste filled PTH (Y/N) | Y | Y |
| Capped via (Y/N) | Y | Y |
| LDI (Y/N) | Y | Y |
| Maximum board size (mm) | 1180 x 610 | 1400 x 610 |
| Minimum board thickness (mm) 2L | 0.15mm for PCB 0.05mm for 1L FPC 0.06mm for 2L FPC | 0.12mm for PCB 0.05mm for 1L FPC 0.06mm for 2L FPC |
| Minimum board thickness (mm) ≥4L | 0.20mm for PCB 0.13 for FPC | 0.18mm for PCB 0.13 for FPC |
| Maximum board thickness (mm) | 10.0mm | 11.0mm (N+M) |
| Minimum track / gap IL (mil) – copper weight dependant | 0.05mm for PCB 0.025mm for FPC | 0.030mm for PCB 0.025mm for FPC |
| Minimum track / gap OL (mil) – copper weight dependant | 0.05mm for PCB 0.04mm for FPC UHDI: Contact us! | 0.040 mm for PCB 0.030 mm for FPC UHDI: Contact us! |
| Surface finish | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ENEPIG | ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG /IAG+GF/Isn+GF/ ENEPIG / SPF/EPIG |
| Layer to layer registration | 0.05mm for PCB 0.02mm for FPC | 0.025mm for PCB 0.02mm for FPC |
| Minimum hole (mech) (mm/mil) | 0.1mm | 0.075mm |
| Minimum hole (laser) (mm/mil) | 0.05 | 0.05 |
| Aspect ratio PTH | 30:1 | 35:1 |
| Finish hole tolerance (PTH) | ± 0.05mm | ± 0.04mm |
| Finish hole tolerance (NPTH) | ±0.03mm | ±0.025 |
| Maximum Cu weight OL | 12oz | 12oz |
| Maximum Cu weight IL | 12oz | 12oz |
| Controlled impedance (+/- X%) | Others ± 10% | ± 5% |
| Rigid-flex (Y/N) | Y | Y including semi flex |
| Flexible (Y/N) | Y | Y |
| IMS (Y/N) | Y (Al) | Y (both Al and Cu) |
| Embedded components (Y/N) | Y | Y |
| Soldermask via plugging IPC4761 Type VI (Y/N) | Y | Y |
| Epoxy via plugging IPC4761 Type VI (Y/N) | Y | Y |
| Epoxy via plugging IPC4761 Type VII (Y/N) | Y | Y |