NCAB Group Blog

The overall goal of thermal management at the bare board and assembly level is to move the heat away from the heat-generating components to an external heat sink for dissipation. Better heat transfer will usually translate to lower mean time between failures (MTBF) and at times will be a deciding factor at meeting product design […]

I’ve noticed that our clients are understanding more and more that PCBs are the key component, but still have challenges communicating to their PCB suppliers what they want to build. When we receive Gerber files for an order there are times we cringe because we’re missing pieces of information necessary to make sure the PCB […]

Where do costs originate? Well, 80-90% of all costs are built into the project in a very early stage of the chain – before suppliers (EMS companies, PCB suppliers, etc.) have sight of the design. We always recommend involving your suppliers very early in the design stage. In order to tackle the subject. We have […]

[This blogpost is also available in German] In this blog post we will discuss the details of PCBs used in medical applications, highlighting some of the differences in terms of demands and how the design must be handled. We have seen electronics become increasingly significant in the medical field. Advancements in medical technology have provided […]

Due to an increased demand for advanced materials to support the growth in 5G applications, many laminate manufacturers have increased the production and output of high-performance or high-speed material at the expense of standard performance materials. The current situation is having a negative effect on the supply of standard performance material (low-to-mid Tg). The consequence […]

[This blog post is also available in German]   As a designer, you now have to think about more than just the software you design on. In order to ensure that you have a robust design you have to understand how to design for manufacturability (DFM), how to design for the environment (DFE), how to […]

[This blog post is also available in German] But.. At some point we still need to be able to demonstrate that the product that we have supplied is correct, not just in terms of the physical characteristics, but also against that specification that ultimately determines functionality. Have the correct materials been used? Do we have […]

Reliability is a key factor right from the start of the PCB production process. If a PCB has a reliability issue, the end product itself is at risk. The important thing is getting it right first time. Trying to improve reliability once the product is designed and in production can lead to massively high costs […]

[This blog post is also available in German] We know that good reliability is secured by achieving a good balance between verification on a product level and verification of the process. It cannot be achieved by screening or sorting on a product level – you cannot ‘inspect in’ good quality or reliability as the old […]

The challenges There are many new challenges for PCB designers, when handling RF board. Among them, the top four factors are: RF is far more sensitive to noise, incurring ringing and reflections, which must be treated with great care. Impedance matching is extremely critical for RF. And, the higher the frequency, the smaller the tolerance […]