Sorry, your location could not be determined.As edge rates accelerate and multi-gigabit signaling tightens design margins, reliance on idealized simulator models is no longer enough. This advanced session moves beyond basic high-speed theory to analyze the exact physical and manufacturing variables that dictate real-world impedance stability and signal integrity.
Session Agenda: • Impedance Fundamentals & Propagation Behavior • Materials, Glass Styles, and Stack-Up Definition • Crosstalk, Copper Roughness, and Signal Integrity • Simulation vs. Reality & Manufacturing Tolerances • Q&A
Speaker
Hüseyin Anaç, Field Application Engineer at NCAB Group Germany, supports customers with technical expertise in PCB design, manufacturing, and application requirements.
