Seminars & webinars about the world of PCBs
Up coming webinars
Standard stackups and impedence
Date: 25th September
High Speed Signal Integrity
Date: 28th September
Optimization of Stack ups with buried, blind and uvias
Date: 28th September
Some of our topics
Technical trends in the global PCB industry
A overview of the technical challenges, industry expectations and global trends going forward.
How to produce a printed circuit board
An in-depth description on how to produce a standard PCB.
A presentation of new technologies and how these are influencing PCB production.
Cost drivers in PCB production
We show what is driving the “cost” of the PCB, how designers can influence cost and how to optimize cost without compromising reliability, through engagement at the design stage.
The pros and cons of the most common surface finishes. The seminar also covers handling and storage rules.
HDI – High Density Interconnect
What are the types of HDI constructions? What are the benefits and how can one optimize the design? Material recommendations and cost factors are also included.
IMS – Insulated Metal Substrate
Thermal management, how to calculate and design IMS boards. What alternatives are there to IMS boards?
From material selection to construction types and design guidance – an in depth review covering flex, rigid flex and semi flex.
NCAB Group Specification
NCAB explains why we have developed our own detailed specification and product demands that build in quality and ensures reliability of the PCBs we provide.
Introduction to High Speed
What is high speed and how do we control signal speeds? A look at materials, applications and good practice for designing high speed PCBs.
Impedance controlled boards
What is impedance? Different types of impedance controlled tracks. How does the tolerances affect the impedance?
DFM – Design for manufacturing
This seminar describes how to avoid costly production, problems with Gerber packages and why NCAB asks you so many technical questions!
DFx – Design for eXcellence
The follow on to DFM, covering the other elements that drive application and consideration of design rules, reliability and manufacturability for both production and assembly of the PCB, whilst reducing total cost.
What is it and what options are out there. This presentations looks and the pros and cons of all options and defines the NCAB solutions that we recommend depending upon the application and technology.
IPC vs. Perfag
What do the different standards mean in reality? How do I use them? What is the difference between IPC and Perfag?
NCAB Class 3 solutions
We examine in-depth how to secure reliability at the lowest possible cost. IPC class 3 – highlights the difference between verification at product level vs.verification of process control and presentation of the NCAB Group solution.
IPC class 3 – how to specify the boards?
Verification at product level vs. verification of process control. Presentation of the NCAB Group solution.
Material for lead-free production
Other materials available where we present our experiences of lead free production and identify the risks. What do abbreviations like Td, Tg, CTE, CTI all mean? What is important for me as a designer? How to choose and specify the material.
We look at what other materials are available. We also present and discuss risks associated with delaminating, laser marking, lead-free soldering, unsuitable surface finishes, inadequate PCB specifications, etc.
NCAB Group Laboratory
What can be carried out in our Laboratory?
How do we carry out continuous technical improvements.
For more information and to book a seminar please contact your local NCAB Group Key Account Manager or Customer Support.