NCAB GROUP
2014 10 06  |  BLOG

High-tech PCBs - design tips to get it right from the start

Modern electronic products are expected to offer more and more advanced functions, while the products themselves are becoming smaller and smaller. This puts greater demands on the PCB design and also the aspects relating to the PCB manufacturing process.

In issue no 3 of In Focus – NCAB Group´s newsletter, we dig deeper into high-tech PCBs. As an appetizer, we will already now give you some useful designtips regarding HDIs.

COMMON DESIGN PROBLEMS REGARDING HDI PRODUCTION PROBLEMS DEPENDING ON THIS BEST SOLUTION
Dielectric too thick for laser vias Increased time for laser drilling, lower productivity.
High risk for voids in the plating process, especially in the bottom of the microvias.
Increased price for the PCBs due to reduced yields.
Use an aspect ratio under 0.8:1.
Too small microvia size Increased risk for the microvia to be blocked by unknown material and therefore won´t be plated satisfactorily.
High risk for poor plating of the microvia, especially in the bottom.
Increased price for the PCBs due to reduced yields.
Use microvias of 100 μm with an aspect ratio under 0.8:1 for microvias intended for copper filling.
Use microvias of 125 μm and with an aspect ratio under 0.8:1 for microvias where copper filling is not a requirement.
Too tight geometries in the form of too small capture and target lands for the microvia If the target land is too small, the risk will increase for partly missing it (so called overshoot), and material adjacent to the pad will be burnt down to the next layer.
If the capture land is to small, it is a risk for the land to be broken, which is not acceptable to any class in IPC-6016.
If possible, use a start pad that is 200 μm larger than the microvia.
If possible, use a stop pad that is 200 μm larger than the microvia.
At tighter geometries consult NCAB.
Too tight demands on permitted dimple on copper filled microvias Increased price for the PCBs due to reduced yields. Place the requirement of dimple to a maximum of 25 μm.

Read more about:

Our latest news

2017 06 21  |  NEWS
ISO 26000 - Guidance on Social Responsibility is an international standard that provides guidance on how businesses can operate in a sustainable way. To demonstrate that we respect and comply with the standard ISO 26000, we complete a yearly social responsibility SIS-SP 2:2015 self-declaration. READ MORE »
2017 05 29  |  NEWS
NCAB Group Italy is going to distribute Israeli PCB manufacturer Eltek´s products in Italy. READ MORE »
2017 05 11  |  NEWS
Top ten nominees Powered by the people
As one of 10 companies out of totally 108 partcipants, NCAB Group was nominated in the award ”Powered by People”. READ MORE »
2017 05 03  |  NCAB GROUP BLOG
2017 04 18  |  NEWS
We want to encourage you to learn more about our achievements, challenges and opportunities in being a responsible and sustainable organization. In our third Sustainability Report you can read about our progress and challenges during 2016 and also our way forward. READ MORE »
ALL NEWS AND BLOG ENTRIES »
NEWSLETTER

Trends, technology and PCBs
» View all newsletters

Sanna Magnusson
Mobile:
MARKETING MANAGER
MEDIA LIBRARY

People, logos, ads and images
» View and download