https://youtu.be/rByRMd7JmTs According to the new definition within IPC-T-50M a microvia is a blind structure with a maximum aspect ratio of 1:1, terminating on a target land with a total depth of no more than 0.25mm measured from the structure’s capture land foil to the target land. The IPC-6012 also defines the structure of a Microvia . The Microvia is a blind structure with a maximum aspect ratio of 1:1 between hole diameter and depth, with a total depth of no more than 0.25 mm , when measured from the surface to the target pad or plane. Typically NCAB considers the dielectric thickness between surface and reference pad to be 60 – 80um. The diameter dimensions of the microvia have a range of 80-100 microns. The typical RATIO is between 0.6: 1 to 1: 1, ideal 0.8: 1 Would you like to learn more about microvias? Read more here

IPC-2226 defines HDI as a printed circuit board with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces ≤ 100 µm / 0.10mm, smaller vias (<150 µm) and capture pads <400 µm / 0.40mm, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology.

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Q: What is meant by a buried via hole?

This is a hole that runs between one or more inner layers. They are normally mechanically drilled. Would you like to learn more about microvias? Read more here

HDI

What is Ultra HDI PCB?

Are there different types of HDI features?

What is a HDI PCB?

What is meant by a buried via hole?

What is meant by a blind via hole?

What is a microvia?