План развития технологии | NCAB Group

План развития технологии

План внедрения технологий в компании NCAB Group демонстрирует ожидаемое развитие нашего предложения и технологического потенциала в течение ближайших двух лет. Надлежащее понимание будущего развития имеет решающее значение для нашей деятельности по подбору производств, поскольку оно уже сегодня помогает определить стратегию завтрашнего дня. Только путем формирования правильной картины этих ожидаемых перспектив компания NCAB способна заблаговременно планировать работу с нашими предприятиями.

Этот подход включает в себя такие элементы, как создание перечней оборудования и планов повышения производительности, необходимых для достижения успеха в условиях быстро развивающегося рынка.

CAPABILITY ROADMAP

Feature 2018 2019 2020
Standard Advanced
Materials RIGID:
FR2, CEM-1, CEM-3, FR4 (standard - halogen free - high performance) including:
ShengYi, Iteq, Elite Materials Corp., NanYa, Kingboard, Grace, GoWorld, TUC, Meteorwave

FLEX:
PI, PET including:
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan. Hanwha, SF305

IMS:
IMS Al based including:
Bergquist MP, HT & CML
ITEQ T-Lam, Laird TLAM SS
Taiflex, Dupont FR & AP, Panasonic, ShengYi, Doosan.

Please contact NCAB Group for full details regarding material availability.

RIGID:
Mid – Loss material
TUC TU862HF, EMC EM370D, ITEQ IT170GRA, Panasonic Megtron-2
Low – Loss material
N4000-13(series), FR408HR, Megtron-4, S7038, S7439, TU872SLK (series), EM-828, EM888, N4800-20(series), I-Speed
Ultra Low – Loss material
Megtron-6, IT150DA, FX-2, FL-700, I-Tera, N6800-22(series), RO4350B, RO3000(series) ,RF-35, RF-35A2, TLX (series), AD250, FL-700LD
Super Low – Loss material and High Thermal Reliability Laminate
TU993,M6N,M7N,

FLEX:
PI, LCP including: Dupont

IMS:
IMS Al & Cu based including:
Bergquist HPL, Ventec VT, Polytronics TCB, Doosan DST, Denka, Arlon, Chin-Shi

Please contact NCAB Group for full details regarding material availability.

'Advanced' materials becoming more mainstream across the supply base. 'Advanced' materials becoming more mainstream across the supply base.
Minimum dielectric thickness 0.05mm for PCB
0.025mm for FPC
0.025mm for PCB
0.012mm for FPC
≤0.05mm for PCB
0.01mm for FPC
≤0.05mm for PCB
0.01mm for FPC
Layer count 1 - 38L / 40L QTA 64L (pilot runs) 64L (pilot runs) 64L (pilot runs)
HDI / Buried - blind via Y Y Y Y
Copper filled BVH (Y/N) Y Y Y Y
Copper filled PTH (Y/N) Y Y - copper paste Y - copper paste Y - copper paste
Copper paste filled PTH (Y/N) Y Y Y Y
Capped via (Y/N) Y Y Y Y
LDI (Y/N) Y Y Y Y
Maximum board size (mm) 1050 x 610 1400 X 610 1400 X 610 1400 X 610
Minimum board thickness
2L (mm)
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
0.15mm for PCB
0.05mm for 1L FPC
0.12mm for 2L FPC
Minimum board thickness
>=4L (mm)
0.25mm for PCB
0.20 for FPC
0.25mm for PCB
0.16 for FPC
0.25mm for PCB
0.16 for FPC
0.25mm for PCB
0.16 for FPC
Maximum board thickness (mm)

8.6 10.0 10.0 10.0
Minimum track / gap IL (mil)- copper weight dependant 0.075mm 0.05mm 0.05mm 0.05mm
Minimum track / gap OL (mil)- copper weight dependant 0.075mm 0.05mm 0.05mm 0.05mm
Surface finish ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / IAG+GF/ Isn+GF /ENEPIG ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF / Isn+GF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF/ Isn+GF ENIG / GF / OSP / I Ag / HASL (lead) / HASL (Leadfree) / Plating Au/Ni/ Immersion Sn / GF+OSP / GF+HASL / OSP+ENIG / ENEPIG / SPF/ IAG+GF/ Isn+GF
Layer to layer registration 0.05mm 25μm 25μm 25μm
Minimum hole (mech) (mm/mil) 0.15mm 0.10mm 0.10mm 0.10mm
Minimum hole (laser) (mm/mil) 0.075mm 0.05mm 0.05mm 0.05mm
Aspect ratio PTH 18:1 20:1 20:1 20:1
Aspect ration BVH 0.8:1 1.3:1 (factory + design dependant) 1.3:1 (factory + design dependant) 1.3:1 (factory + design dependant)
Finish hole tolerance (PTH) ± 0.076mm ± 0.05mm ± 0.05mm ± 0.05mm
Finish hole tolerance (NPTH) ± 0.0375 ± 0.025 ± 0.025 ± 0.025
Maximum Cu weight OL 12 oz 12 oz 12 oz 12 oz
Maximum Cu weight IL 12 oz 12 oz 12 oz 12 oz
Controlled impedance (+/- X%) Others ± 10% ± 5% ± 5% ± 5%
Rigid-flex (Y/N) Y Y including semi flex Y including semi flex Y including semi flex
Flexible (Y/N) Y Y Y Y
IMS (Y/N) Y (Al) Y (both Al and Cu) Y (both Al and Cu) Y (both Al and Cu)
Embedded components (Y/N) Y Y Y Y
Soldermask via plugging IPC4761 Type VI (Y/N)
Y Y Y Y
Epoxy via plugging IPC4761 Type VI (Y/N) Y Y Y Y
Epoxy via plugging IPC4761 Type VII (Y/N) Y Y Y Y
It is important to note that even with 'standard' technology this does not mean that all factories can achieve ALL of the aspects - When using combinations of these parameters, you should always consult your local NCAB technical contact person.

 

CAPACITY ROADMAP

Feature Capacity
2018 2019 2020
Capacity sqm per month 1 108 005 1 382 765 1 164 890
2 - 4 layers 476 030 447 800 451 200
6 layers and above 525 655 656 715 742 700
HDI / Buried - blind via 124 170 244 030 350 990
Flex, flex-rigid 60 450 74 520 131 650
Prototypes/QTA no orders 138 514 190 390 225 266
Number of employees (total) 29 346 30 246 31 696
Number of employees pre-production 1 531 1 799 2 012
Number of employees quality mgmt 3 630 3 921 4 311
Production facility sqm 1 268 288 1 345 788 1 421 088

 

EQUIPMENT LIST

Feature Factory Equipment (number of sets)
2018 2019 2020
CAM stations / seats 754 861 999
Plotters 77 82 89
Artwork AOI 40 47 52
Inner layer dry film lamination lines 57 62 65
Inner layer exposure machines 80 86 89
Inner layer automatic exposure machines 111 121 128
Inner layer LDI 26 31 35
Inner layer developing lines 68 76 79
AOI machines 176 193 208
Oxide lines 55 61 63
Bonding presses 109 125 131
X-Ray drilling machines 130 138 138
CNC drilling machines 1300 1402 1458
Laser drilling machines 112 136 142
De-smear and PTH lines 49 54 57
Panel plating lines 50 56 59
Vertical panel plating lines 57 64 69
Pattern plating lines 40 45 47
Outerlayer dry film lamination lines 61 68 73
Outerlayer UV exposure machines 42 44 47
Outerlayer automatic UV exposure machines 62 70 73
Outerlayer LDI 28 37 44
Outer layer developing lines 74 79 83
Outer layer AOI machines 132 144 150
Soldermask pre-treatment 57 60 62
Soldermask printing lines 309 328 344
Soldermask exposure machines 90 96 98
Soldermask automatic exposure machines 78 85 87
Soldermask developing lines 54 58 60
CNC routing machines 539 583 606
Bevelling machines 44 49 51
Scoring machines 58 65 68
Electrical test machines 221 255 285
Auto-segregation electrical test machines 139 147 151
Flying probe electrical test machines 229 237 243
Automated visual inspection systems 77 84 90