HDI - High Density Interconnect PCBs

NCAB has been building HDI boards for over 20 years. Our factory base has a broad experience producing HDI boards for different market applications. The factories in concert with our world-wide technical organization bring a comprehensive knowledge of the requirements and manufacturing methodologies required for successful HDI products. The NCAB Group technical support begins at the design phase of HDI pcbs where we can provide manufacturing expertise to design teams to improve manufacturability and lower overall product costs. Over 15% of our global sales are in the HDI segment which gives us the opportunity to attract the best factories in the world. We can manage local NPI and quick-turns for proof of design and bring the product to volume production off-shore seamlessly, providing a streamlined process that brings new products to market faster.

Please contact your local NCAB Group company if you need further information or assistance, we are happy to help you.
8L HDI – materials: FR-4 Shengyi S-1000-2; finished thickness: 1.60mm +/- 10%; BGA size: 0.25mm; line width and space: 0.10/0.10 mm; surface treatment: ENIG; features: fine pitch, copper filled via technology
4L HDI – materials: Shengyi S1000-2; surface treatment: ENIG; solder mask color: black; features: epoxy hole fill, copper hole fill, BGA
6L HDI – material: standard FR-4 ITEQ IT-158; board thickness: 1.60mm +/- 10%, BGA size: 0.30 mm, line width and space: 0.10/0.10mm; surface treatment: ENIG
8L HDI – materials: FR-4; board thickness: 2.00mm; hole size: 0.20mm; aspect ratio: 10:1, copper thickness inner and outer layers: 35/35 μm; line width and space: 0.9/0.9mm; surface treatment: ENIG; features: fine pitch BGA, controlled impedance
16L HDI – materials: FR-4 ITEQ IT-180A; finished board thickness: 1.75mm, surface treatment: ENIG; features: solder mask plugging, controlled impedance, control depth routing, blind and buried via structures: Layers 1-2, 2-15, 15-16; technical specification: industry control.
6L HDI – materials: FR-4; board thickness: 0.60mm; hole size: 0.10mm; aspect ratio: 6:1; inner and outer layer copper; 35/35 μm; line width and space: 0.076mm/0.076mm; surface treatment: ENIG; features: BGA pad size 0.2mm, copper wrap plating

HDI PCBs - Technical specification

DOWNLOAD SPECIFICATION (PDF) »

Feature NCAB´s technical specification
Number of layers 4 - 22 layers standard, 30 layers advanced
Technology highlights Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.
HDI builds 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D
Materials FR4 standard, FR4 high performance, Halogen free FR4, Rogers
Copper weights (finished) 18μm - 70μm
Minimum track and gap 0.075mm / 0.075mm
PCB thickness 0.40mm - 3.20mm
Maxmimum dimensions 610mm x 450mm; dependant upon laser drilling machine
Surface finishes available OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
Minimum mechanical drill 0.15mm
Minimum laser drill 0.10mm standard, 0.075mm advanced